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公开(公告)号:US20180269569A1
公开(公告)日:2018-09-20
申请号:US15764497
申请日:2016-09-23
发明人: Wolfgang NICKE , Frank PAKEBUSCH
CPC分类号: H01Q1/425 , G01S7/40 , G01S13/931 , G01S2007/4047 , G01S2013/9371 , H01Q1/02 , H01Q1/42 , H05B3/36 , H05B3/84 , H05B3/86 , H05B2203/017 , H05K1/0212 , H05K1/028 , H05K3/28 , H05K2203/02 , H05K2203/1327
摘要: The invention relates to a method for producing a heatable radome, a flexible printed circuit board having a metallic structure being used. Said flexible printed circuit board is embossed and is back-molded with a thermoplastic material.