公开(公告)号：US20180094171A1

公开(公告)日：2018-04-05

申请号：US15830152

申请日：2017-12-04

Applicant: HENKEL AG & CO. KGAA ,  HENKEL IP & HOLDING GMBH

Inventor： David BRIERS ,  Gunther Dreezen ,  Jianfen Cai ,  Callum Poole ,  Anthony Chapman ,  Dale R. Starkey

IPC: C09J11/04 ,  C09J177/00 ,  B29C70/70 ,  B29C70/88 ,  B29C35/16

CPC classification number: C09J11/04 ,  B29C35/16 ,  B29C70/70 ,  B29C70/882 ,  B29K2077/00 ,  B29K2105/16 ,  B29L2031/34 ,  C08K3/22 ,  C08K7/18 ,  C08K2003/2227 ,  C08K2201/001 ,  C08K2201/005 ,  C09J177/00

Abstract: The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof. The adhesive composition of the present invention comprise at least one (co)polymer binder and at least one filler, as defined herein. The thermally conductive hotmelt adhesive composition according to the present invention is also intended to encapsulate heat generating devices such as printed circuit boards to provide better heat dissipation.

公开(公告)号：US20190085219A1

公开(公告)日：2019-03-21

申请号：US16165700

申请日：2018-10-19

Applicant: HENKEL AG & CO.KGAA ,  HENKEL IP & HOLDING GMBH

Inventor： Jeffrey CAI ,  David Briers ,  Callum Poole ,  Gunther Dreezen ,  Anthony Chapman ,  Dale R. Starkey

IPC: C09J9/02 ,  C09J177/00 ,  C09J11/04 ,  C08K7/06 ,  C08K3/04 ,  C08K3/08

Abstract: The present invention is related to an electrically conductive, hot-melt adhesive or molding composition, said composition comprising: a) a binding agent which comprises at least one (co)polymer selected from the group consisting of polyamide, thermoplastic polyamide, copolyamide, polyolefins, poly(meth)acrylates, polystyrene, polyurethanes, polyesters, ethylene copolymers, ethylene vinyl copolymers, styrenic block copolymers, polylactic acid, silicones, epoxies and polyols; and, b) a conductive filler comprising particles (p1) which have a mass median diameter (D50) of ≤100 microns and which are selected from the group consisting of flakes, platelets, leaf-like particles, dendritic particles, rods, tubes, fibres, needles and mixtures thereof, wherein said composition has a melt viscosity of from 2500 to 25000 mPa·s as measured at 210° C. and is further characterized in that said particles (p1) constitute from 15 to 70 wt. %, by weight of the composition. Preferably, the binding agent comprises at least one (co)polymer selected from the group consisting of polyamide, thermoplastic polyamide and copolyamide.