公开(公告)号：US20160357233A1

公开(公告)日：2016-12-08

申请号：US15120511

申请日：2014-04-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Thomas Robert BOWDEN ,  Allen B DOERR ,  John FRANZ ,  Melvin K BENEDICT ,  Joseph ALLEN ,  John NORTON ,  Binh NGUYEN

IPC: G06F1/20 ,  G06F13/42

CPC classification number: G06F1/206 ,  G06F1/185 ,  G06F1/20 ,  G06F13/42 ,  H01L23/367 ,  H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermal management assembly in accordance with one example may include a first thermal management member that includes a first main region that is continuous, a first connection region that is discontinuous, and a first top side. The thermal management assembly may also include a second thermal management member that includes a second main region, a second connection region, and a second top side. The second main region and the second connection region are continuous. The thermal management assembly may further include a connection member to couple the first thermal management member and the second thermal management member to a memory device via the first connection region and the second connection region. The first top side and the second top side are substantially level with a top side of the memory device in a horizontal direction when the first thermal management member and the second thermal management member are coupled to the memory device.

Abstract translation: 根据一个示例的热管理组件可以包括第一热管理构件，其包括连续的第一主区域，不连续的第一连接区域和第一顶侧面。 热管理组件还可以包括第二热管理构件，其包括第二主区域，第二连接区域和第二顶侧。 第二主区域和第二连接区域是连续的。 热管理组件还可以包括连接构件，用于经由第一连接区域和第二连接区域将第一热管理构件和第二热管理构件连接到存储装置。 当第一热管理构件和第二热管理构件联接到存储装置时，第一顶侧和第二顶侧基本上与存储装置的顶侧在水平方向平齐。