公开(公告)号：US20160005671A1

公开(公告)日：2016-01-07

申请号：US14769231

申请日：2013-02-22

Applicant: HITACHI, LTD.

Inventor： Nobutake TSUYUNO ,  Hiroshi HOZOJI ,  Takashi NAITO ,  Motomune KODAMA ,  Masanori MIYAGI ,  Takuya AOYAGI

IPC: H01L23/29 ,  H01L25/16 ,  H01L23/31 ,  H01L25/07

CPC classification number: H01L23/291 ,  H01L23/053 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/564 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L25/16 ,  H01L2224/37124 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8389 ,  H01L2224/84801 ,  H01L2224/8484 ,  H01L2224/8485 ,  H01L2224/8489 ,  H01L2224/8592 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention is intended to increase the moisture resistance of a resin-sealed electronic control device. The resin-sealed electronic control device includes: a semiconductor chip; a chip capacitor; a chip resistor; a bonding member; a substrate; a case; a heat radiating plate; a glass coating; and a first sealing material. The glass coating directly covers the electronic circuit formed by the element group including: the semiconductor chip; the chip capacitor; and the chip resistor, the bonding member and the substrate, and is sealed by the first sealing material. By being water impermeable, the glass coating prevents water absorption in the vicinity of the element group, and can prevent an increase in the leak current of the semiconductor chip due to water absorption, and an insulation performance drop such as lowered insulation resistance caused by migration within the element group.

Abstract translation: 本发明旨在提高树脂密封电子控制装置的耐湿性。 树脂密封电子控制装置包括：半导体芯片; 片式电容器; 芯片电阻; 接合部件; 底物; 一个案例; 散热板; 玻璃涂层; 和第一密封材料。 玻璃涂层直接覆盖由元件组成的电子电路，包括：半导体芯片; 片式电容器; 芯片电阻，接合部件和基板，并由第一密封材料密封。 通过不透水，玻璃涂层防止元件组附近的吸水，并且可以防止由于吸水引起的半导体芯片的泄漏电流的增加，以及由迁移引起的绝缘电阻降低等绝缘性能下降 在元素组内。

公开(公告)号：US20180005748A1

公开(公告)日：2018-01-04

申请号：US15548629

申请日：2016-02-05

Applicant: HITACHI, LTD.

Inventor： Hiroshi HOZOJI

IPC: H01F27/02 ,  H01F27/20 ,  H01F27/24 ,  H01F27/28

CPC classification number: H01F27/025 ,  H01F27/06 ,  H01F27/085 ,  H01F27/20 ,  H01F27/22 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/29

Abstract: An object is to improve a core and heat radiation properties from the coil, and to reduce the size of a transformer. In order to attain the object described above, a transformer includes a bobbin wound around with a coil, a columnar core center portion in which the bobbin is mounted, and a plurality of core leg portions joining both ends of the core center portion on the outside of the coil. The size of the core leg portion is larger than the size of the other core leg portions, and the core leg portion includes a flat outer circumferential surface approximately parallel to a surface which is tangent to an outer circumferential side surface of the coil. The transformer is disposed in a housing such that the outer circumferential surface of the core leg portion is tangent to a floor surface of the housing.