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公开(公告)号：US20160146652A1
公开(公告)日：2016-05-26
申请号：US14899567
申请日：2014-02-07
发明人： Norio ISHITSUKA , Masatoshi OGATA , Tsutomu KONO , Tsubasa WATANABE , Shinobu TASHIRO , Noboru TOKUYASU
IPC分类号： G01F1/692
摘要： An objective of the present invention is, in a thermal flowmeter having a structure including a resin portion formed in the vicinity of a diaphragm structural portion using a mold, to prevent destruction of the diaphragm structural portion at the time of pressing the mold, in a method of manufacturing the thermal flow meter, including: supporting a gas flow measurement element 200 on support members 102b and 111, the gas flow measurement element 200 including a cavity portion 202 surrounded by a substrate inclined portion 202a inclined to a substrate surface, a diaphragm 201 that covers the cavity portion, and an electrical resistive element formed in the diaphragm 201; and covering the gas flow measurement element 200 and the support members 102b and 111 with the resin portion 104 formed with the mold, to set the mold 14 such that an acting portion of pressure force by the mold that molds the resin portion 104 is positioned outside the substrate inclined portion 202a in the entire periphery of the diaphragm 201.
摘要翻译： 本发明的目的在于，在具有使用模具形成在隔膜结构部附近的树脂部的结构的热式流量计中，为了防止压模时的膜结构部的破坏， 制造热流量计的方法包括：在支撑部件102b和111上支撑气体流量测量元件200，气体流量测量元件200包括由与基板表面倾斜的基板倾斜部分202a包围的空腔部分202，隔膜 201，其形成在隔膜201中;电阻元件， 并用形成有模具的树脂部分104覆盖气体流量测量元件200和支撑构件102b和111，以将模具14设置成使得模制树脂部分104的模具的压力作用部分位于外部 基板倾斜部分202a在隔膜201的整个周边。
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公开(公告)号：US20150300857A1
公开(公告)日：2015-10-22
申请号：US14418330
申请日：2013-06-28
发明人： Norio ISHITSUKA , Yasuo ONOSE , Noriyuki SAKUMA , Hiroshi NAKANO
CPC分类号： G01F1/692 , G01F1/6842 , G01F1/6845
摘要： A thermal air flow sensor that offers high flow rate measurement accuracy is provided. The thermal air flow sensor includes a measuring element. The measuring element includes: a semiconductor substrate; a heating resistor and a temperature measuring resistor both formed as a result of thin films being stacked over the semiconductor substrate; an electronic insulator including a silicon oxide film; and a diaphragm portion formed after part of the semiconductor substrate is removed. The heating resistor and the temperature measuring resistor are formed over the diaphragm portion. In the thermal air flow sensor, a ratio of an area occupied by the thin films to an area of the measuring element ranges between 40% and 60%.
摘要翻译： 提供了一种提供高流量测量精度的热空气流量传感器。 热空气流量传感器包括测量元件。 测量元件包括：半导体衬底; 由半导体衬底上层叠薄膜而形成的加热电阻器和温度测量电阻器; 包括氧化硅膜的电子绝缘体; 并且在半导体衬底的一部分之后形成的膜部分被去除。 加热电阻器和温度测量电阻器形成在隔膜部分上。 在热空气流量传感器中，薄膜占据的面积与测量元件的面积的比率在40％至60％之间。
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公开(公告)号：US20170241820A1
公开(公告)日：2017-08-24
申请号：US15519452
申请日：2015-09-24
CPC分类号： G01F1/696 , F02M35/10386 , G01F1/684 , G01F1/6842 , G01F15/006 , G01F15/02
摘要： The purpose is to improve the measurement accuracy of a thermal air flow meter. The device has: an auxiliary passage for entraining a portion of a fluid being measured; a sensor chip arranged in the auxiliary passage, for measuring the flow rate of the fluid being measured; an electronic component having an internal resistor, for converting the fluid flow rate detected by the sensor chip to an electrical signal; and a substrate on which the sensor chip and the electronic component are mounted. The substrate is covered by a filler material, on the surface of which the electronic component is mounted.
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公开(公告)号：US20160161312A1
公开(公告)日：2016-06-09
申请号：US14907118
申请日：2014-02-03
CPC分类号： G01F1/684 , G01F1/6842 , G01F1/692 , G01F5/00 , G01F15/14
摘要： An object of the present invention is to provide a thermal-type air flow meter with a high measurement accuracy by reducing influence of a thermal stress generated in a resistor in an LSI while securing a high positioning accuracy flow rate detection unit. Thus, a thermal-type air flow meter is provided with: a sensor assembly 100 including an LSI 3 having a resistor 7 and a flow rate detection unit 4a which are configured by insert molding so as to expose at least a part of the flow rate detection unit 4a, a housing 301 which has secondary passages 305i, 305o and 305s, and houses the sensor assembly 100 by allowing the flow rate detection unit 4a to be arranged in the secondary passage 305s, the sensor assembly 100 being molded using a first resin, and the housing 301 being molded using a second resin, the sensor assembly 100 being fixed to the housing 301 using the second resin; and resin structures 20 and 21 which cause a tensile stress in a direction parallel to a surface on which the flow rate detection unit 4a is exposed with respect to the sensor assembly 100.
摘要翻译： 本发明的目的是提供一种在确保高定位精度的流量检测单元的同时，通过减小在LSI中的电阻器中产生的热应力的影响来提供具有高测量精度的热式空气流量计。 因此，热式空气流量计设置有：传感器组件100，其包括具有电阻器7和流量检测单元4a的LSI 3，其通过嵌件成型构成，以暴露至少一部分流量 检测单元4a，具有次级通道305i，305o和305s的壳体301，并且通过允许流量检测单元4a布置在次通道305s中来容纳传感器组件100，传感器组件100使用第一树脂 并且壳体301使用第二树脂模制，传感器组件100使用第二树脂固定到壳体301; 以及在平行于流量检测单元4a相对于传感器组件100露出的表面的方向上引起拉伸应力的树脂结构20和21。
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公开(公告)号：US20210072059A1
公开(公告)日：2021-03-11
申请号：US16771879
申请日：2018-08-06
发明人： Norio ISHITSUKA , Yasuo ONOSE
摘要： Provided are a semiconductor device and a thermal type fluid flow rate sensor which suppress strain occurring in an aluminum film and suppresses disconnection due to repeated metal fatigue of the aluminum film. The semiconductor device and the thermal type fluid flow rate sensor of the present invention are configured so that the heights of a silicon film and an aluminum film satisfy D>D1 between a flow rate sensor part (immediately above a diaphragm end part) D and a circuit part (LSI part) D1.
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公开(公告)号：US20180306619A1
公开(公告)日：2018-10-25
申请号：US15770993
申请日：2016-10-05
发明人： Akira UENODAN , Shinobu TASHIRO , Takeshi MORINO , Masatoshi OGATA , Tsubasa WATANABE , Norio ISHITSUKA
IPC分类号： G01F1/684
摘要： To obtain a flow meter with which it is possible to facilitate establishing an electrical connection with a conductor exposed in a location through which a gas to be measured passes. A flow meter that is provided with a lead and a circuit component placed on the lead, and that has a package in which part of the lead is molded from a resin, wherein the package is provided with an exposure portion for exposing part of the lead from the resin member, the exposure portion being electrically connected to a conductor that constitutes part of an auxiliary passage.
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公开(公告)号：US20160025539A1
公开(公告)日：2016-01-28
申请号：US14773232
申请日：2013-12-13
IPC分类号： G01F1/69
CPC分类号： G01F1/69 , G01F1/684 , G01F1/6842 , G01F15/022 , H01L29/045 , H01L29/84
摘要： In order to provide a thermal flow sensor having high measurement accuracy, the thermal type air flow sensor includes a flow detecting unit, a sub passage on which the flow detecting unit is disposed, and an LSI to which a signal obtained by the flow detecting unit is input and which outputs a signal to the outside. A side wall of the sub passage is disposed between the flow detecting unit and the LSI, or on the LSI. A diffusion resistor provided inside the LSI has its longitudinal direction in parallel with a orientation of single-crystal Si.
摘要翻译： 为了提供具有高测量精度的热流量传感器，热式空气流量传感器包括流量检测单元，配置有流量检测单元的副通路和通过流量检测单元获得的信号的LSI 被输入并向外部输出信号。 副通路的侧壁设置在流量检测单元和LSI之间或LSI上。 设置在LSI内部的扩散电阻器具有与单晶Si的<100>取向平行的纵向方向。
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公开(公告)号：US20200248811A1
公开(公告)日：2020-08-06
申请号：US16641890
申请日：2018-04-10
摘要： An object of the present invention is to provide a seal structure capable of maintaining necessary sealing performance for a long period of time even in an environment where a corrosive solution such as salt water adheres. A seal portion at which seal materials are formed and a fixing portion that fixes a housing and a cover to each other are formed at a joint portion between the housing and the cover constituting a casing. The seal portion and the fixing portion are arranged from an outer edge portion side of the joint portion toward an inside of the casing in order of the seal portion and the fixing portion.
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公开(公告)号：US20170322062A1
公开(公告)日：2017-11-09
申请号：US15660806
申请日：2017-07-26
发明人： Norio ISHITSUKA , Keiji HANZAWA , Yasuo ONOSE , Noriyuki SAKUMA
摘要： A thermal air flow sensor that produces less measurement error is provided. The thermal air flow sensor includes: a semiconductor substrate; a heating resistor, resistance temperature detectors, and an electrical insulator that includes a silicon oxide film, wherein the heating resistor, the resistance temperature detectors, and the electrical insulator are formed on the semiconductor substrate; and a diaphragm portion formed by removing a portion of the semiconductor substrate. The heating resistor and the resistance temperature detectors are formed on the diaphragm portion. The thermal air flow sensor further includes a silicon nitride film formed as the electrical insulator above the heating resistor and the resistance temperature detectors. The silicon nitride film has steps conforming to the patterns of the heating resistor and the resistance temperature detectors. The silicon nitride film has a multilayer structure.
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