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    Thermal Flow Meter
    2.
    发明申请
    Thermal Flow Meter 审中-公开

    公开(公告)号：US20170336232A1

    公开(公告)日：2017-11-23

    申请号：US15659309

    申请日：2017-07-25

    申请人： Hitachi Automotive Systems, Ltd.

    发明人： Shinobu TASHIRO ,  Keiji HANZAWA ,  Noboru TOKUYASU ,  Takeshi MORINO ,  Ryosuke DOI ,  Akira UENODAN

    IPC分类号： G01F1/684 ,  G01F1/696 ,  G01F15/14

    摘要： It is an object of the present invention to improve a measurement accuracy of a thermal flowmeter. A circuit package 401 is such that a measurement surface 430 and a backside of measurement surface 431 of a rear surface thereof are located in a bypass passage, and the bypass passage is configured to allow a measurement target gas 30 to flow upon dividing the measurement target gas 30 into a flow path 386 at a side of the measurement surface 430 of the circuit package and a flow path 387 at a side of the backside of measurement surface 431 of a rear surface of the measurement surface 430, and an inflow-side end surface of the circuit package for dividing the measurement target gas 30 has different shapes at the side of the measurement surface and at the side of the backside of measurement surface. The inflow-side end surface of the circuit package for dividing the measurement target gas 30 is formed with a reference line 700 dividing the measurement target gas 30, and an end surface 701a at the side of the measurement surface with respect to the reference line and an end surface 701b at the side of the backside of measurement surface with respect to the reference line are formed to be asymmetrical.

    THERMAL-TYPE AIR FLOW METER
    3.
    发明申请
    THERMAL-TYPE AIR FLOW METER 有权
    热式空气流量计

    公开(公告)号：US20160161312A1

    公开(公告)日：2016-06-09

    申请号：US14907118

    申请日：2014-02-03

    申请人： HITACHI AUTOMOTIVE SYSTEMS, LTD.

    发明人： Masatoshi OGATA ,  Norio ISHITSUKA ,  Shinobu TASHIRO ,  Noboru TOKUYASU ,  Takeshi MORINO

    IPC分类号： G01F1/684 ,  G01F15/14

    CPC分类号： G01F1/684 ,  G01F1/6842 ,  G01F1/692 ,  G01F5/00 ,  G01F15/14

    摘要： An object of the present invention is to provide a thermal-type air flow meter with a high measurement accuracy by reducing influence of a thermal stress generated in a resistor in an LSI while securing a high positioning accuracy flow rate detection unit. Thus, a thermal-type air flow meter is provided with: a sensor assembly 100 including an LSI 3 having a resistor 7 and a flow rate detection unit 4a which are configured by insert molding so as to expose at least a part of the flow rate detection unit 4a, a housing 301 which has secondary passages 305i, 305o and 305s, and houses the sensor assembly 100 by allowing the flow rate detection unit 4a to be arranged in the secondary passage 305s, the sensor assembly 100 being molded using a first resin, and the housing 301 being molded using a second resin, the sensor assembly 100 being fixed to the housing 301 using the second resin; and resin structures 20 and 21 which cause a tensile stress in a direction parallel to a surface on which the flow rate detection unit 4a is exposed with respect to the sensor assembly 100.

    摘要翻译： 本发明的目的是提供一种在确保高定位精度的流量检测单元的同时，通过减小在LSI中的电阻器中产生的热应力的影响来提供具有高测量精度的热式空气流量计。 因此，热式空气流量计设置有：传感器组件100，其包括具有电阻器7和流量检测单元4a的LSI 3，其通过嵌件成型构成，以暴露至少一部分流量 检测单元4a，具有次级通道305i，305o和305s的壳体301，并且通过允许流量检测单元4a布置在次通道305s中来容纳传感器组件100，传感器组件100使用第一树脂 并且壳体301使用第二树脂模制，传感器组件100使用第二树脂固定到壳体301; 以及在平行于流量检测单元4a相对于传感器组件100露出的表面的方向上引起拉伸应力的树脂结构20和21。

    Flow Sensor and Manufacturing Method of the Same and Flow Sensor Module and Manufacturing Method of the Same
    6.
    发明申请
    Flow Sensor and Manufacturing Method of the Same and Flow Sensor Module and Manufacturing Method of the Same 审中-公开
    流量传感器及其制造方法及其流程传感器模块及其制造方法

    公开(公告)号：US20140190273A1

    公开(公告)日：2014-07-10

    申请号：US14210787

    申请日：2014-03-14

    申请人： Hitachi Automotive Systems, Ltd.

    发明人： Tsutomu KONO ,  Keiji HANZAWA ,  Takeshi MORINO ,  Yuki OKAMOTO ,  Noboru TOKUYASU ,  Shinobu TASHIRO

    IPC分类号： G01F1/38

    CPC分类号： G01F1/383 ,  G01F1/34 ,  G01F1/6845 ,  G01F1/692 ,  G01F1/698 ,  G01F5/00 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10157 ,  H01L2924/15151 ,  H01L2924/15153

    摘要： Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, apart of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).

    摘要翻译： 提供了抑制每个流量传感器的性能变化的技术。 在本发明的流量传感器FS1中，在半导体芯片CHP1上形成的流量检测单元（FDU）露出的状态下，半导体芯片CHP1的外部被配置为被树脂（MR）覆盖。 由于树脂（MR）的上表面SUR（MR）高于半导体芯片（CHP1）的上表面SUR（CHP），所以通过在上表面SUR（CHP）的一部分上密封树脂 半导体芯片CHP1在与空气流动方向平行的方向上，可以使流量检测单元（FDU）周围的空气流稳定。 此外，通过增加半导体芯片（CHP1）和树脂（MR）之间的接触面积，可以防止半导体芯片（CHP1）和树脂（MR）之间的界面剥离。

    Thermal Flow Meter
    8.
    发明申请
    Thermal Flow Meter 有权
    热流量计

    公开(公告)号：US20160282162A1

    公开(公告)日：2016-09-29

    申请号：US14778397

    申请日：2014-01-29

    申请人： HITACHI AUTOMOTIVE SYSTEMS, LTD.

    发明人： Noboru TOKUYASU ,  Shinobu TASHIRO ,  Takeshi MORINO ,  Akira UENODAN

    IPC分类号： G01F1/684 ,  G01P5/12

    CPC分类号： G01F1/6847 ,  G01F1/6842 ,  G01F1/692 ,  G01F1/696 ,  G01F5/00 ,  G01P5/12

    摘要： In order to provide a thermal flow meter capable of preventing adherence of contaminants to an air flow sensing portion, the thermal flow meter (300) of the invention includes a bypass passage for flowing a measurement target gas (30) received from a main passage (124) and an air flow sensing portion (602) for measuring a flow rate of the measurement target gas (30) by performing heat transfer with the measurement target gas (30) flowing through the bypass passage through a heat transfer surface (437). The air flow sensing portion (602) is provided to be exposed to an exposed surface (402) arranged along a flow direction of the measurement target gas (30) inside the bypass passage is embedded, the mount support surface (402) has a stage (407) formed to surround a periphery of the air flow sensing portion (602), and an inner portion surrounded by the stage protrudes more than an outer portion of the stage.

    摘要翻译： 为了提供能够防止污染物与气流感测部分的粘附的热流量计，本发明的热流量计（300）包括用于使从主通道接收的测量目标气体（30）流动的旁路通道（ 124）和用于通过使流过旁通通路的测量对象气体（30）通过传热面（437）进行传热来测量测量对象气体（30）的流量的气流感测部（602）。 空气流动检测部分602被设置为暴露于沿旁路通道内部的测量目标气体30的流动方向布置的暴露表面402，安装支撑表面402具有一个阶段 （407），其形成为围绕所述气流感测部（602）的周边，并且由所述台围绕的内部部分比所述台的外部突出。

    Thermal Flow Meter
    9.
    发明申请
    Thermal Flow Meter 有权
    热流量计

    公开(公告)号：US20150355006A1

    公开(公告)日：2015-12-10

    申请号：US14407775

    申请日：2013-05-29

    申请人： Hitachi Automotive Systems, Ltd.

    发明人： Shinobu TASHIRO ,  Keiji HANZAWA ,  Noboru TOKUYASU ,  Takeshi MORINO ,  Ryosuke DOI ,  Akira UENODAN

    IPC分类号： G01F1/684 ,  G01F1/696

    CPC分类号： G01F1/6842 ,  G01F1/684 ,  G01F1/696 ,  G01F15/14

    摘要： It is an object of the present invention to improve a measurement accuracy of a thermal flow meter. A circuit package 401 is such that a measurement surface 430 and a backside of measurement surface 431 of a rear surface thereof are located in a bypass passage, and the bypass passage is configured to allow a measurement target gas 30 to flow upon dividing the measurement target gas 30 into a flow path 386 at a side of the measurement surface 430 of the circuit package and a flow path 387 at a side of the backside of measurement surface 431 of a rear surface of the measurement surface 430, and an inflow-side end surface of the circuit package for dividing the measurement target gas 30 has different shapes at the side of the measurement surface and at the side of the backside of measurement surface. The inflow-side end surface of the circuit package for dividing the measurement target gas 30 is formed with a reference line 700 dividing the measurement target gas 30, and an end surface 701a at the side of the measurement surface with respect to the reference line and an end surface 701b at the side of the backside of measurement surface with respect to the reference line are formed to be asymmetrical.

    摘要翻译： 本发明的目的是提高热流量计的测量精度。 电路封装401使得测量表面430及其后表面的测量表面431的后侧位于旁路通道中，并且旁路通道被构造成允许测量目标气体30在划分测量目标时流动 气体30进入电路封装的测量表面430侧的流路386和测量表面430的后表面的测量表面431的后侧的流动通道387，以及流入侧端 用于划分测量目标气体30的电路封装的表面在测量表面侧和测量表面的背面侧具有不同的形状。 用于划分测量对象气体30的电路封装的流入侧端面由分配测量对象气体30的基准线700和测量表面侧的相对于基准线的端面701a形成， 在测量表面的背面侧相对于基准线的端面701b形成为不对称的。

    Flow Sensor and Manufacturing Method for the Same
    10.
    发明申请
    Flow Sensor and Manufacturing Method for the Same 有权
    流量传感器及其制造方法

    公开(公告)号：US20150338258A1

    公开(公告)日：2015-11-26

    申请号：US14759374

    申请日：2013-11-18

    申请人： HITACHI AUTOMOTIVE SYSTEMS, LTD.

    发明人： Tsutomu KONO ,  Keiji HANZAWA ,  Noboru TOKUYASU ,  Shinobu TASHIRO ,  Hiroki NAKATSUCHI

    IPC分类号： G01F15/16 ,  B81C1/00

    CPC分类号： G01F15/16 ,  B81C1/00333 ,  G01F1/6845 ,  G01F1/692

    摘要： When an exposed part of a semiconductor chip is reduced in size, a tendency of development of a crack on the semiconductor chip is suppressed. A pressure of injection of a resin MR into a second space creates a gap on a contact part SEL where an elastic film LAF and a semiconductor chip CHP1 are in contact, and a resin MR2 different in constituent from the resin MR infiltrates into the gap. As a result, in an area of semiconductor chip CHP1 that is exposed from the resin MR, the resin MR2 is formed in an area other than a flow detecting unit FDU and an area around it. Hence, an area of semiconductor chip CHP1 that is exposed from the resins MR and MR2 can be reduced in size.

    摘要翻译： 当半导体芯片的暴露部分尺寸减小时，抑制了半导体芯片上的裂纹发展的倾向。 将树脂MR注入第二空间的压力在弹性膜LAF和半导体芯片CHP1接触的接触部分SEL上产生间隙，并且与树脂MR成分不同的树脂MR2渗透到间隙中。 结果，在从树脂MR露出的半导体芯片CHP1的区域中，树脂MR2形成在流动检测单元FDU以外的区域和周围的区域。 因此，从树脂MR和MR2露出的半导体芯片CHP1的面积可以减小。