公开(公告)号：US20180005986A1

公开(公告)日：2018-01-04

申请号：US15541861

申请日：2015-12-10

Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.

Inventor： Shiro YAMASHITA ,  Yusuke TAKAGI ,  Takahiro SHIMURA

IPC: H01L25/065 ,  H01L23/00

CPC classification number: H01L25/0655 ,  H01L24/17 ,  H01L25/07 ,  H01L25/18 ,  H01L2224/17132 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40137 ,  H01L2924/3841 ,  H01L2924/00014

Abstract: A power module includes a base plate, first, second, and third semiconductor chips. At least one of a third edge or fourth edge of the first semiconductor chip is disposed adjacent to a side end of the base plate. Among a half of a distance from a first edge of the first semiconductor chip to one edge of the second semiconductor chip, a half of a distance from a second edge of the first semiconductor chip to one edge of the third semiconductor chip, and a distance from the third edge or fourth edge of the first semiconductor chip disposed adjacent to the side end of the base plate to the side end of the base plate, a length of a solder fillet formed on the edge of the first semiconductor chip at the shortest distance is formed in the shortest length.

公开(公告)号：US20160073504A1

公开(公告)日：2016-03-10

申请号：US14784124

申请日：2014-04-23

Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.

Inventor： Miki HIRAOKA ,  Shiro YAMASHITA ,  Tomishige YATSUGI

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2201/10621 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: The objective of the present invention is to improve reliability in a solder connection portion between an electronic component and a wiring pattern. A pair of wiring patterns (31A and 31B) are formed on a circuit wiring board (30) with an insulation layer (37) therebetween. Each wiring pattern (31A and 31B) has a land (33a or 33b) and a wiring portion (34a or 34b) that is narrower than the land. By way of solder (42), a chip component (41) is soldered to the lands (33a and 33b). The x (width) direction center (Xa) of each connection portion (53) where a respective wiring portion (34a or 34b) is connected to a respective land (33a or 33b) is disposed at a position that is outside of both the region in which a region of predetermined width (Wc) of the chip component (41) extends in the x (longitudinal) direction, and the region in which a region of predetermined length (Lc) of the chip component (41) extends in a y (transverse) direction.

Abstract translation: 本发明的目的是提高电子部件与布线图形之间的焊接连接部的可靠性。 一对布线图案（31A和31B）形成在其间具有绝缘层（37）的电路布线板（30）上。 每个布线图案（31A和31B）具有比平台窄的区域（33a或33b）和布线部分（34a或34b）。 通过焊料（42），将芯片部件（41）焊接到焊盘（33a和33b）上。 其中各个配线部分（34a或34b）连接到相应的焊盘（33a或33b）的每个连接部分（53）的x（宽度）方向中心（Xa）被布置在两个区域 其中芯片部件（41）的预定宽度（Wc）的区域在x（纵向）方向上延伸，并且芯片部件（41）的预定长度（Lc）的区域在a 横向）方向。

公开(公告)号：US20200352056A1

公开(公告)日：2020-11-05

申请号：US16759825

申请日：2018-10-12

Applicant: Hitachi Automotive Systems, Ltd.

Inventor： Isamu YOSHIDA ,  Masaru KAMOSHIDA ,  Toshikazu SHIGYO ,  Shiro YAMASHITA

IPC: H05K7/20 ,  H05K1/02

Abstract: An electronic control device includes a heating element, a substrate, and a housing. The heating element includes an electronic component. The heating element is mounted to the substrate. The substrate is fixed to the housing via a substrate fixing portion. The housing includes a plurality of projecting portions projecting to the substrate side from a reference surface. The plurality of projecting portions have mutually different heights from the reference surface. The reference surface is a surface opposing the substrate and a reference of a height of the housing. The projecting portion highest in the height from the reference surface among the plurality of projecting portions is in contact with a surface of the substrate via a heat dissipation member. The surface of the substrate is on an opposite side of a surface where the heating element is mounted.