公开(公告)号：US11667817B2

公开(公告)日：2023-06-06

申请号：US16339145

申请日：2017-09-26

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Takashi Tatsuzawa ,  Kazuya Matsuda ,  Yutaka Tsuchida ,  Takashi Seki ,  Mitsuyoshi Shimamura ,  Kengo Shinohara ,  Tetsuyuki Shirakawa ,  Yasunori Kawabata ,  Satoru Matsumoto

IPC: H01L21/68 ,  C09J9/02 ,  C09J7/00 ,  C09J7/30 ,  C09J7/40 ,  C09J11/04 ,  C09J201/00 ,  H01B1/22 ,  H01B5/14 ,  H01B5/16 ,  H01L23/00 ,  H01R11/01

CPC classification number: C09J9/02 ,  C09J7/00 ,  C09J7/30 ,  C09J7/401 ,  C09J11/04 ,  C09J201/00 ,  H01B1/22 ,  H01B5/14 ,  H01B5/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01R11/01 ,  C09J2203/326 ,  C09J2423/045 ,  C09J2423/105 ,  C09J2425/00 ,  C09J2463/00 ,  C09J2467/005 ,  H01L24/32 ,  H01L2224/2711 ,  H01L2224/27334 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29247 ,  H01L2224/29255 ,  H01L2224/29264 ,  H01L2224/29293 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/743 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83851 ,  H01L2224/97 ,  H01L2224/29014 ,  H01L2924/00012 ,  H01L2224/29013 ,  H01L2924/00012 ,  H01L2224/29012 ,  H01L2924/00012 ,  H01L2224/97 ,  H01L2224/27 ,  H01L2224/83851 ,  H01L2924/00014

Abstract: A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.

公开(公告)号：US11414573B2

公开(公告)日：2022-08-16

申请号：US16328944

申请日：2017-08-29

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Tetsuyuki Shirakawa ,  Satoru Matsumoto ,  Yusuke Asakawa ,  Tatsuya Kumada ,  Takahiro Fukui

IPC: C09J9/02 ,  C09J201/00 ,  C09J163/00 ,  C09J7/00 ,  C09J175/16

Abstract: One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.