公开(公告)号：US11556369B2

公开(公告)日：2023-01-17

申请号：US16710261

申请日：2019-12-11

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Feifei Chen ,  Xiaodong Zhang ,  Shaohe Cai ,  Xuefeng Lu ,  Guangrui You

IPC: G06F9/455 ,  G06F8/60

Abstract: This application describes a virtual machine deployment method and an operation and maintenance management (OMM) virtual machine. The method includes: obtaining, by an OMM virtual machine, a quantity and a specification of service virtual machines created in virtual network function application software to which the OMM virtual machine belongs; and determining, by the OMM virtual machine based on load that needs to be carried by the application software and the quantity and the specification of the service virtual machines, a module to be configured for each service virtual machine. The described implementations avoid or reduce waste of virtual machine resources.

公开(公告)号：US20220262751A1

公开(公告)日：2022-08-18

申请号：US17733132

申请日：2022-04-29

Applicant: Huawei Technologies Co., Ltd.

Inventor： Tonglong Zhang ,  Xiaodong Zhang ,  Yong Guan ,  Simin Wang

IPC: H01L23/00 ,  H01L25/10

Abstract: A chip package on package structure includes a primary chip stack unit having pins insulated and spaced from each other on a first surface; a first bonding layer disposed on the first surface, where the first bonding layer includes bonding components insulated and spaced from each other, each bonding component includes a bonding part, and any two bonding parts are insulated and have a same cross-sectional area, and the bonding components are separately bonded to the pins; and secondary chip stack units, disposed on a surface of a side that is of the first bonding layer and that is away from the primary chip stack unit, where the secondary chip stack unit has micro bumps insulated and spaced from each other, and each of the micro bumps is bonded to one of the bonding components.

公开(公告)号：US10250674B2

公开(公告)日：2019-04-02

申请号：US15042837

申请日：2016-02-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xiaodong Zhang ,  Jueping Wang ,  Jianchun Wang ,  Tao Pu

IPC: H04L29/08 ,  H04B7/024 ,  H04W84/04 ,  H04W88/08

Abstract: Embodiments of the disclosure provide a radio access method, apparatus, and system, which can implement mutual transmission and processing of collaborative data between sites on a basis of low-cost deployment and high availability, and improve network performance. In the method, a basic DU is deployed in a site, and the method may include: receiving, by a switching device, a first data packet sent by a first basic DU; determining to send the first data packet to a second basic DU for collaborative processing; and sending the first data packet to the second basic DU, so that the second basic DU performs collaborative processing on the first data packet and a second data packet, where the second data packet and the first data packet are of a same data type. Embodiments of the disclosure are applicable to the communications field.

公开(公告)号：US20150349808A1

公开(公告)日：2015-12-03

申请号：US14822311

申请日：2015-08-10

Applicant: Huawei Technologies Co., Ltd.

Inventor： Wangjun Wu ,  Yulin Li ,  Fengqing Yan ,  Xiaodong Zhang ,  Xiwen Zhang

IPC: H04B1/00 ,  H04B1/50

CPC classification number: H04B1/40 ,  H04B1/005 ,  H04B1/0057 ,  H04B1/50

Abstract: A multi-band multi-path receiving and transmitting device and method, and a base station system are provided. The multi-band multi-path receiving and transmitting device includes a broadband antenna, at least two multi-frequency couplers, a multi-band transceiver, and a signal processing module. The multi-band transceiver is adopted to decrease the number of the transceivers, thereby reducing the material cost and the mounting cost of the base station system.

Abstract translation: 提供了一种多频带多路径发送装置及方法以及基站系统。 多频带多路径接收和发送装置包括宽带天线，至少两个多频耦合器，多频带收发器和信号处理模块。 采用多频带收发器减少收发器的数量，从而降低了基站系统的材料成本和安装成本。

公开(公告)号：US09130604B2

公开(公告)日：2015-09-08

申请号：US13916998

申请日：2013-06-13

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Wangjun Wu ,  Yulin Li ,  Fengqing Yan ,  Xiaodong Zhang ,  Xiwen Zhang

IPC: H04B1/38 ,  H04B1/00 ,  H04B1/50

CPC classification number: H04B1/40 ,  H04B1/005 ,  H04B1/0057 ,  H04B1/50

Abstract: A multi-band multi-path receiving and transmitting device and method, and a base station system are provided. The multi-band multi-path receiving and transmitting device includes a broadband antenna, at least two multi-frequency couplers, a multi-band transceiver, and a signal processing module. The multi-band transceiver is adopted to decrease the number of the transceivers, thereby reducing the material cost and the mounting cost of the base station system.

Abstract translation: 提供了一种多频带多路径发送装置及方法以及基站系统。 多频带多路径接收和发送装置包括宽带天线，至少两个多频耦合器，多频带收发器和信号处理模块。 采用多频带收发器减少收发器的数量，从而降低了基站系统的材料成本和安装成本。

公开(公告)号：US20130273975A1

公开(公告)日：2013-10-17

申请号：US13916998

申请日：2013-06-13

Applicant: Huawei Technologies Co., Ltd.

Inventor： Wangjun WU ,  Yulin Li ,  Fengqing Yan ,  Xiaodong Zhang ,  Xiwen Zhang

IPC: H04B1/00

CPC classification number: H04B1/40 ,  H04B1/005 ,  H04B1/0057 ,  H04B1/50

Abstract: A multi-band multi-path receiving and transmitting device and method, and a base station system are provided. The multi-band multi-path receiving and transmitting device includes a broadband antenna, at least two multi-frequency couplers, a multi-band transceiver, and a signal processing module. The multi-band transceiver is adopted to decrease the number of the transceivers, thereby reducing the material cost and the mounting cost of the base station system.

Abstract translation: 提供了一种多频带多路径发送装置及方法以及基站系统。 多频带多路径接收和发送装置包括宽带天线，至少两个多频耦合器，多频带收发器和信号处理模块。 采用多频带收发器减少收发器的数量，从而降低了基站系统的材料成本和安装成本。

公开(公告)号：US20230083420A1

公开(公告)日：2023-03-16

申请号：US18050913

申请日：2022-10-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yang Sun ,  Sofoklis Floratos ,  Ahmad Ghazal ,  Jianjun CHEN ,  Xiaodong Zhang

IPC: G06F16/242 ,  G06F16/2453 ,  G06F16/22 ,  G06F11/34

Abstract: A method for functionally rewriting iterative queries for a relational database management system (RDBMS) is provided. The method comprises receiving a first iterative query, the first iterative query having a first non-iterative part that defines a first main table and a first iterative part that generates values in rows of a first working table based on values in rows of the first main table, determining that the first iterative part modifies all of the rows of the first working table, and rewriting the first iterative part, including: adding a renaming operation to rename the first working table to a new first main table and to rename the first main table to a new first working table, adding a first Delete operation to delete each row of the new first working table, and adding a first loop operation to repeat the first iterative part until a first termination condition is met.

公开(公告)号：US20220189901A1

公开(公告)日：2022-06-16

申请号：US17687220

申请日：2022-03-04

Applicant: Huawei Technologies Co., Ltd.

Inventor： Shiqun Gu ,  Rui Niu ,  Xiaodong Zhang ,  Yiwei Ren ,  Tonglong Zhang

IPC: H01L23/00 ,  H01L23/538 ,  H01L25/10 ,  H01L25/065 ,  H01L25/00

Abstract: A packaged IC includes a fanout layer, a processor having a first surface residing substantially adjacent a first surface of the fanout layer, a Redistribution Layer (RDL) having a first surface coupled to a second surface of the processor, and a memory coupled to a second surface of the RDL, wherein a first portion of the memory is disposed outside of a footprint of the processor and a second portion of the memory is disposed within the footprint of the processor. The packaged IC further includes first conductive posts disposed beneath the first portion of the memory proximate a first side of the processor for providing communication links between the processor and memory, and second conductive posts coupled between the fanout layer and conductive features of the RDL coupled to power inputs of the second portion of the memory, the second conductive posts proximate a second side of the processor.

公开(公告)号：US20220077123A1

公开(公告)日：2022-03-10

申请号：US17531133

申请日：2021-11-19

Applicant: Huawei Technologies Co., Ltd.

Inventor： Tonglong Zhang ,  Xiaodong Zhang ,  Yong Guan ,  Heng Li

IPC: H01L25/10 ,  H01L23/29 ,  H01L21/56 ,  H01L23/00 ,  H01L23/538 ,  H01L25/00

Abstract: A chip package structure includes a first chip, a second chip, and a carrier board. The first chip is disposed between the second chip and the carrier board. An active layer of the first chip is opposite to an active layer of the second chip. A first interconnection structure is disposed between the first chip and the second chip and is configured to couple the active layer of the first chip to the active layer of the second chip. A first conductor pillar is disposed in the first chip. One end of the first conductor pillar is coupled to the active layer of the first chip, and the other end of the first conductor passes through the first chip to be coupled to a circuit in the carrier board.

公开(公告)号：US09516536B2

公开(公告)日：2016-12-06

申请号：US14827587

申请日：2015-08-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xiaodong Zhang ,  Johan Johansson

IPC: H04W72/12 ,  H04W24/10 ,  H04W72/04 ,  H04W74/08

CPC classification number: H04W24/10 ,  H04W72/04 ,  H04W72/1242 ,  H04W72/1284 ,  H04W74/0833

Abstract: A method and device of sending Buffer Status Reports (BSRs) are provided herein. The method includes: determining the type priority sequence of BSR by a user terminal, and selecting and processing one BSR based on the type priority. A user device is also provided. The provided method and device may reduce resource waste because there is no situation that at least two BSRs sending processes are triggered at one time and at least two BSRs are sent at one time.

Abstract translation: 本文提供了一种发送缓冲状态报告（BSR）的方法和装置。 该方法包括：由用户终端确定BSR的类型优先级顺序，并根据类型优先级选择和处理一个BSR。 还提供了用户设备。 所提供的方法和设备可以减少资源浪费，因为不存在一次触发至少两个发送过程的BSR和一次发送至少两个BSR的情况。