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公开(公告)号：US20210174780A1
公开(公告)日：2021-06-10
申请号：US17010104
申请日：2020-09-02
发明人： Jae Gi Sim , Hong Jae Kim , Jong Hyun Ryu
IPC分类号： G10K11/162 , B32B3/26 , B32B3/30
摘要： Disclosed are a holey plate, which improves the shape of punched holes so as to increase sound absorbing and insulating efficiency and durability, and a composite panel for sound absorption and sound insulation using the same. The holey plate used in the composite panel includes a base part, first bent parts configured to be bent from designated regions of the base part and to extend to be inclined so as to form a plurality of first punched holes by punching the designated regions of the base part in a thickness direction, and second bent parts configured to be bent from the first bent parts and to extend to be inclined so as to form second punched holes extending from the first punched holes, an angle of the second bent parts with the base part being smaller than an angle of the first bent parts with the base part.
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公开(公告)号：US10699686B2
公开(公告)日：2020-06-30
申请号：US15807349
申请日：2017-11-08
发明人： Jae Gi Sim , Jong Hyun Ryu
IPC分类号： G10K11/168 , B32B3/26 , B32B3/28 , B32B15/14 , B32B15/20 , G10K11/172 , B60R13/08
摘要： A sound-permeable metal plate, which is a plate processed to have concavity and convexity formed thereon, may include: a plurality of cells protruding from the plate; and a flat base portion formed between the plurality of cells, wherein each of the cells includes a plurality of wall surface parts, which are bent on and protrude from the base portion, and a cover portion extending from end portions of the wall surface parts, and each of the cells has a straight line-shaped slit formed through the plate.
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公开(公告)号：US20190118733A1
公开(公告)日：2019-04-25
申请号：US15840466
申请日：2017-12-13
发明人： Jae Gi Sim , Jung Hyeok Lim , Sung Il Choi , Ki Hoon Son
摘要： Disclosed herein is a composite panel for sound absorption that may absorb and block noise. The composite panel may include: a first perforated panel comprising first embosses and first perforation groups formed in a predetermined pattern, wherein the first embosses are formed by forming a plurality of cells and the first perforation groups are formed by collecting a plurality of first perforated holes; an embossed panel comprising second embosses formed by forming the plurality of cells and coupled to the first perforated panel wherein the embossed panel is laminated with the first perforated panel; and a sound absorbing and insulating material inserted between the first perforated panel and the embossed panel.
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公开(公告)号：US10029628B2
公开(公告)日：2018-07-24
申请号：US15189033
申请日：2016-06-22
发明人： Jae Gi Sim , Jin Woo Park , Tae Wan Kim , Jin Ha Lee
摘要： Disclosed is an insulation fiber composite. In particular, a surface of the insulation fiber composite is substantially improved such that a shape of three dimensions can be maintained as a heat resisting fiber and an insulation material are integrated. The insulation fiber composite of the present invention has excellent formability and surface property and comprises an insulation layer; and a pair of inorganic fiber layers. A first inorganic fiber layer of the pair is stacked on an upper surface of the insulation layer and a second inorganic fiber layer is stacked on a lower surface of the insulation layer, respectively. In particular, each the inorganic fiber layers has a greater planar surface area than a planar surface area of the insulation layer such that the insulation is not exposed to an exterior when the insulation layer and the pair of the inorganic fiber layers are stacked.
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公开(公告)号：US20170166142A1
公开(公告)日：2017-06-15
申请号：US15189033
申请日：2016-06-22
发明人： Jae Gi Sim , Jin Woo Park , Tae Wan Kim , Jin Ha Lee
CPC分类号： B60R13/08 , B32B5/022 , B32B5/06 , B32B5/26 , B32B7/12 , B32B19/06 , B32B2250/20 , B32B2250/40 , B32B2250/44 , B32B2255/02 , B32B2255/26 , B32B2262/10 , B32B2262/105 , B32B2262/108 , B32B2307/304 , B32B2307/306 , B32B2307/54 , B32B2307/546 , B32B2307/554 , B32B2307/58 , B32B2307/70 , B32B2307/718 , B32B2307/732 , B32B2605/00 , B60R13/0838 , B60R13/0876
摘要： Disclosed is an insulation fiber composite. In particular, a surface of the insulation fiber composite is substantially improved such that a shape of three dimensions can be maintained as a heat resisting fiber and an insulation material are integrated. The insulation fiber composite of the present invention has excellent formability and surface property and comprises an insulation layer; and a pair of inorganic fiber layers. A first inorganic fiber layer of the pair is stacked on an upper surface of the insulation layer and a second inorganic fiber layer is stacked on a lower surface of the insulation layer, respectively. In particular, each the inorganic fiber layers has a greater planar surface area than a planar surface area of the insulation layer such that the insulation is not exposed to an exterior when the insulation layer and the pair of the inorganic fiber layers are stacked
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6.发明申请公开(公告)号：US20210246821A1
公开(公告)日：2021-08-12
申请号：US17167472
申请日：2021-02-04
发明人： Sung Joon Choi , Jae Gi Sim , Seung Hoon Lee , Jung Hyeok Lim , Yong Pyo Hong , Seong Bin Moon
摘要： An exhaust manifold heat dissipation cover coupling device for thermal stress and vibration deflection is proposed. The device has a function of preventing wear of a heat dissipation cover to couple an exhaust manifold heat dissipation cover, the device being able to improve the durability of various parts including a heat dissipation cover by attenuating multi-directional vibration that is transmitted from an exhaust manifold when the heat dissipation cover is installed outside the exhaust manifold, being able to prevent damage to parts due to thermal stress by flexibly coping with thermal deformation such as thermal contraction or thermal expansion even if the thermal deformation is generated by high-temperature heat transmitted from the exhaust manifold, and being able to prevent frictional damage of the heat dissipation cover due to friction by a component that slides to attenuate vibration.
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公开(公告)号：US10204612B2
公开(公告)日：2019-02-12
申请号：US15374681
申请日：2016-12-09
发明人： Jae Gi Sim
IPC分类号： G10K11/172
摘要： A holey plate for sound absorption and insulation may include an array of through holes including a plurality of through holes having at least two different diameters, and the array of through holes being arrayed on the holey plate to form a predetermined pattern.
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公开(公告)号：US09688054B2
公开(公告)日：2017-06-27
申请号：US14520991
申请日：2014-10-22
发明人： Jae Gi Sim , Sung Jin Park , Sung Hoon Yoon
IPC分类号： F01N1/00 , B32B15/01 , B32B3/28 , B32B3/12 , B32B7/00 , B32B7/04 , B32B9/00 , B32B9/04 , B32B15/00 , B32B15/04 , B32B15/20 , B32B1/00 , B32B3/00 , B32B3/02 , B21D53/80 , F01N13/10 , F01N13/14
CPC分类号： B32B15/016 , B21D53/80 , B32B1/00 , B32B3/00 , B32B3/02 , B32B3/12 , B32B3/28 , B32B7/00 , B32B7/04 , B32B9/00 , B32B9/04 , B32B15/00 , B32B15/01 , B32B15/04 , B32B15/20 , B32B2307/10 , B32B2307/102 , B32B2307/30 , B32B2307/306 , B32B2605/00 , F01N13/10 , F01N13/14 , F01N2260/20 , Y10T29/49622 , Y10T428/1234
摘要： Disclosed is a multi-layered composite panel. The multi-layered composite panel comprises at least two sheets of thin plates with continuous waveform patterns having the same pitch and different heights in one direction are overlapped. In the multi-layered composite panel, an air layer is formed between the overlapping thin plates, orthogonal pressing portions, which divide the waveform patterns on the top and the bottom of the thin plates into the unit of triangle-patterned cell by being pressed orthogonally to cross each other on the top and the bottom of the thin plates overlapping in the orthogonal direction crossing the direction of the waveform patterns, are formed and an undercut portion is formed by pressing the centers of both sides connecting a groove and a ridge of each cell on the top and the bottom of the thin plates with opposite orthogonal pressing portions.
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9.发明授权公开(公告)号：US11408323B2
公开(公告)日：2022-08-09
申请号：US17167472
申请日：2021-02-04
发明人： Sung Joon Choi , Jae Gi Sim , Seung Hoon Lee , Jung Hyeok Lim , Yong Pyo Hong , Seong Bin Moon
摘要： An exhaust manifold heat dissipation cover coupling device for thermal stress and vibration deflection is proposed. The device has a function of preventing wear of a heat dissipation cover to couple an exhaust manifold heat dissipation cover, the device being able to improve the durability of various parts including a heat dissipation cover by attenuating multi-directional vibration that is transmitted from an exhaust manifold when the heat dissipation cover is installed outside the exhaust manifold, being able to prevent damage to parts due to thermal stress by flexibly coping with thermal deformation such as thermal contraction or thermal expansion even if the thermal deformation is generated by high-temperature heat transmitted from the exhaust manifold, and being able to prevent frictional damage of the heat dissipation cover due to friction by a component that slides to attenuate vibration.
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公开(公告)号：US10654424B2
公开(公告)日：2020-05-19
申请号：US15840466
申请日：2017-12-13
发明人： Jae Gi Sim , Jung Hyeok Lim , Sung Il Choi , Ki Hoon Son
摘要： Disclosed herein is a composite panel for sound absorption that may absorb and block noise. The composite panel may include: a first perforated panel comprising first embosses and first perforation groups formed in a predetermined pattern, wherein the first embosses are formed by forming a plurality of cells and the first perforation groups are formed by collecting a plurality of first perforated holes; an embossed panel comprising second embosses formed by forming the plurality of cells and coupled to the first perforated panel wherein the embossed panel is laminated with the first perforated panel; and a sound absorbing and insulating material inserted between the first perforated panel and the embossed panel.
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