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    METHOD AND APPARATUS OF USING DRIVE TEST DATA FOR PROPAGATION MODEL CALIBRATION
    2.
    发明申请
    METHOD AND APPARATUS OF USING DRIVE TEST DATA FOR PROPAGATION MODEL CALIBRATION 审中-公开
    使用驱动测试数据进行传播模型校准的方法和装置

    公开(公告)号：US20090157342A1

    公开(公告)日：2009-06-18

    申请号：US12260847

    申请日：2008-10-29

    Applicant: Yusheng Zhang ,  Sheng Zhou ,  Chenguang Wei ,  Li Zhang ,  Peng Gao ,  Wujie Hu ,  Yanyun Zhu ,  Wenhua Ma ,  Pei Zhao ,  Yaxi Hu ,  Hongbin Jin ,  Jing Yuan ,  Bin Zhang ,  Hanhui Wei ,  Hai Fu

    Inventor： Yusheng Zhang ,  Sheng Zhou ,  Chenguang Wei ,  Li Zhang ,  Peng Gao ,  Wujie Hu ,  Yanyun Zhu ,  Wenhua Ma ,  Pei Zhao ,  Yaxi Hu ,  Hongbin Jin ,  Jing Yuan ,  Bin Zhang ,  Hanhui Wei ,  Hai Fu

    IPC: G06F19/00

    CPC classification number: G06F17/5009 ,  H04W16/18

    Abstract: A method using drive test data for propagation model calibration includes: step 1, obtaining original drive test data; step 2, selecting the data from the drive test data according to predefined conditions as effective drive test data; and step 3, extracting the effective drive test data to form a data file used for propagation model calibration. An apparatus using drive test data for propagation model calibration includes: a drive test data obtaining module, configured to obtain the drive test data in the regions to be calibrated; an effective drive test data generation module, configured to generate effective drive test data from the drive test data according to predefined conditions; and a data file generation module, configured to extract the effective drive test data to form a data file used for propagation model calibration. The present invention utilizes drive test data of existing networks to largely decrease the CW test work and reduce the network building cost. It is believed that the calibrated model can relatively accurately reflect the propagation characteristics in the field. Furthermore, base stations can be optimally allocated.

    Abstract translation: 使用驱动测试数据进行传播模型校准的方法包括：步骤1，获得原始驱动测试数据; 步骤2，根据预定条件从驱动测试数据中选择数据作为有效的驱动测试数据; 并且步骤3，提取有效的驱动测试数据以形成用于传播模型校准的数据文件。 使用用于传播模型校准的驱动器测试数据的装置包括：驱动测试数据获取模块，被配置为获得要校准的区域中的驱动测试数据; 有效的驱动测试数据生成模块，被配置为根据预定条件从所述驱动测试数据产生有效的驱动测试数据; 以及数据文件生成模块，被配置为提取有效的驱动测试数据以形成用于传播模型校准的数据文件。 本发明利用现有网络的驱动测试数据大大降低了CW测试工作，降低了网络建设成本。 相信校准模型可以相对准确地反映现场的传播特性。 此外，可以最佳地分配基站。

    HINGE
    4.
    发明申请
    HINGE 审中-公开

    公开(公告)号：US20170167171A1

    公开(公告)日：2017-06-15

    申请号：US15444344

    申请日：2017-02-28

    Applicant: Hai Fu

    Inventor： Hai Fu

    IPC: E05D3/12 ,  E05D11/08

    CPC classification number: E05D3/122 ,  E05D3/06 ,  E05D3/18 ,  E05D11/087 ,  E05D15/28 ,  E05D15/30 ,  E05D15/44 ,  E05Y2201/26 ,  E05Y2201/712 ,  E05Y2201/722 ,  E05Y2900/132 ,  E05Y2900/148

    Abstract: A hinge used for being installed between a door leaf and a door frame or between a sash and a window frame (7). The hinge includes a gear and rack unit and an inclined draw bar (1). The gear and rack unit is installed on the door frame or window frame (7). A gear (5) is rotatably installed on the door frame or window frame (7). A rack is located on one side of the gear (5). The gear (5) is meshed with the rack. A gear installation portion (51) is arranged on one side of the gear (5). Both ends of the inclined draw bar (1) are installed on the door leaf and door frame or the sash and window frame (7) respectively. According to the present invention, the problem that the existing hinge is unreasonably stressed and prone to damage is effectively solved.

    Semiconductor device and method for manufacturing a semiconductor device
    5.
    发明授权
    Semiconductor device and method for manufacturing a semiconductor device 有权
    半导体装置及其制造方法

    公开(公告)号：US07719096B2

    公开(公告)日：2010-05-18

    申请号：US11827041

    申请日：2007-07-09

    Applicant: Ta-Te Chou ,  Xiong-Jie Zhang ,  Xian Li ,  Hai Fu ,  Yong-Qi Tian

    Inventor： Ta-Te Chou ,  Xiong-Jie Zhang ,  Xian Li ,  Hai Fu ,  Yong-Qi Tian

    IPC: H01L23/495

    CPC classification number: H01L23/49575 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49586 ,  H01L2224/32245 ,  H01L2924/13091 ,  H01L2924/00

    Abstract: A semiconductor device mountable to a substrate is provided. The device includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. An interlayer material is formed on the second attachment surface of the electrically conductive attachment region. The interlayer material is a thermally conductive, dielectric material. A housing at least in part encloses the semiconductor die and the interlayer material.

    Abstract translation: 提供可安装到基板的半导体器件。 该器件包括半导体管芯和具有第一附接表面和第二附接表面的导电附接区域。 第一附接表面布置成与半导体管芯电连通。 中间层材料形成在导电性附着区域的第二附着面上。 中间层材料是导热的介电材料。 壳体至少部分地包围半导体管芯和中间层材料。

    Secmiconductor device and method for manufacturing a semiconductor device
    6.
    发明申请
    Secmiconductor device and method for manufacturing a semiconductor device 有权
    半导体器件及其制造方法

    公开(公告)号：US20080036072A1

    公开(公告)日：2008-02-14

    申请号：US11827041

    申请日：2007-07-09

    Applicant: Ta-Te Chou ,  Xiong-Jie Zhang ,  Xian Li ,  Hai Fu ,  Yong-Qi Tian

    Inventor： Ta-Te Chou ,  Xiong-Jie Zhang ,  Xian Li ,  Hai Fu ,  Yong-Qi Tian

    IPC: H01L23/34 ,  H01L21/00

    CPC classification number: H01L23/49575 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49586 ,  H01L2224/32245 ,  H01L2924/13091 ,  H01L2924/00

    Abstract: A semiconductor device mountable to a substrate is provided. The device includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. An interlayer material is formed on the second attachment surface of the electrically conductive attachment region. The interlayer material is a thermally conductive, dielectric material. A housing at least in part encloses the semiconductor die and the interlayer material.

    Abstract translation: 提供可安装到基板的半导体器件。 该器件包括半导体管芯和具有第一附接表面和第二附接表面的导电附接区域。 第一附接表面布置成与半导体管芯电连通。 中间层材料形成在导电性附着区域的第二附着面上。 中间层材料是导热的介电材料。 壳体至少部分地包围半导体管芯和中间层材料。

    Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities
    8.
    发明授权
    Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities 有权
    用于制造具有改善的散热能力的半导体器件的半导体器件和方法

    公开(公告)号：US08048714B2

    公开(公告)日：2011-11-01

    申请号：US11827042

    申请日：2007-07-09

    Applicant: Ta-Te Chou ,  Xiong-Jie Zhang ,  Xian Li ,  Hai Fu ,  Yong-Qi Tian

    Inventor： Ta-Te Chou ,  Xiong-Jie Zhang ,  Xian Li ,  Hai Fu ,  Yong-Qi Tian

    IPC: H01L23/34 ,  H01L21/00

    CPC classification number: H01L23/4334 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2924/13091 ,  H01L2924/1815 ,  H01L2924/00

    Abstract: A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. A housing at least in part encloses the semiconductor die and the interlayer material. The housing has a recess disposed through the second attachment surface of the electrically conductive attachment region. A dielectric, thermally conductive interlayer material is located in the recess and secured to the housing. A metallic plate is located in the recess and secured to the interlayer material.

    Abstract translation: 可安装到基板的半导体器件包括半导体管芯和具有第一附接表面和第二附接表面的导电附接区域。 第一附接表面布置成与半导体管芯电连通。 壳体至少部分地包围半导体管芯和中间层材料。 壳体具有穿过导电附接区域的第二附接表面设置的凹部。 绝缘导热中间层材料位于凹槽中并固定到外壳上。 金属板位于凹槽中并固定在夹层材料上。

    Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities
    9.
    发明申请
    Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities 有权
    用于制造具有改善的散热能力的半导体器件的半导体器件和方法

    公开(公告)号：US20080036073A1

    公开(公告)日：2008-02-14

    申请号：US11827042

    申请日：2007-07-09

    Applicant: Ta-Te Chou ,  Xiong-Jie Zhang ,  Xian Li ,  Hai Fu ,  Yong-Qi Tian

    Inventor： Ta-Te Chou ,  Xiong-Jie Zhang ,  Xian Li ,  Hai Fu ,  Yong-Qi Tian

    IPC: H01L23/34 ,  H01L21/00

    CPC classification number: H01L23/4334 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2924/13091 ,  H01L2924/1815 ,  H01L2924/00

    Abstract: A semiconductor device mountable to a substrate includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. A housing at least in part encloses the semiconductor die and the interlayer material. The housing has a recess disposed through the second attachment surface of the electrically conductive attachment region. A dielectric, thermally conductive interlayer material is located in the recess and secured to the housing. A metallic plate is located in the recess and secured to the interlayer material.

    Abstract translation: 可安装到基板的半导体器件包括半导体管芯和具有第一附接表面和第二附接表面的导电附接区域。 第一附接表面布置成与半导体管芯电连通。 壳体至少部分地包围半导体管芯和中间层材料。 壳体具有穿过导电附接区域的第二附接表面设置的凹部。 绝缘导热中间层材料位于凹槽中并固定到外壳上。 金属板位于凹槽中并固定在夹层材料上。

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