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公开(公告)号：US07586048B2
公开(公告)日：2009-09-08
申请号：US11528331
申请日：2006-09-28
CPC分类号： H01F17/0006 , H01F27/29 , H01F2017/0046 , H01G4/228 , H01G4/252
摘要： The invention relates to a surface mount type electronic component to be mounted on a printed circuit board or a hybrid IC (HIC) and provides a low-cost electronic component which is reliable in terms of heat resistance and pressure resistance. An inductor as the electronic component has a general outline in the form of a rectangular parallelepiped, provided by forming a lead-out electrode having a multi-layer structure on a substrate and forming a protective layer for protecting the lead-out electrode using thin film forming techniques. The lead-out electrode includes a first electrode which is electrically connected to a coil conductor and which has an exposed part exposed on an outer surface and a second electrode which has an exposed part exposed on the outer surface to extend an electrode width different from an electrode width of the first electrode and which is formed directly above the first electrode and electrically connected to the first electrode.
摘要翻译： 本发明涉及一种安装在印刷电路板或混合IC（HIC）上的表面贴装型电子元件，并且提供了一种在耐热性和耐压性方面是可靠的低成本电子部件。 作为电子部件的电感器具有长方体形状的一般轮廓，通过在基板上形成具有多层结构的引出电极，并形成用于使用薄膜保护引出电极的保护层 成型技术。 引出电极包括电连接到线圈导体并且具有暴露在外表面上的暴露部分的第一电极和具有暴露在外表面上的暴露部分的第二电极，以延伸不同于 第一电极的电极宽度，并且直接形成在第一电极的上方并与第一电极电连接。
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公开(公告)号：US20070132060A1
公开(公告)日：2007-06-14
申请号：US11606931
申请日：2006-12-01
IPC分类号： H01L29/00
CPC分类号： H03H7/0115 , H01G4/33 , H01L27/016
摘要： The invention provides an electronic component which has an improved breakdown limit value of withstand voltage and improved insulation properties and which can be made compact and provided with a multiplicity of layers and a great capacity. The electronic component includes a first conductor having a bottom conductor formed on a substrate and a raised conductor formed to protrude from the bottom conductor, a dielectric film formed on the raised conductor, and a second conductor formed on the dielectric film to constitute a capacitor element in combination with the raised conductor and the dielectric film.
摘要翻译： 本发明提供一种具有改进的耐电压击穿极限值和改善的绝缘性能的电子部件，其可以制成紧凑的并具有多层和大容量。 电子部件包括：第一导体，其具有形成在基板上的底部导体和形成为从底部导体突出的凸起导体，形成在凸起导体上的电介质膜，以及形成在电介质膜上以构成电容器元件的第二导体 与凸起的导体和电介质膜组合。
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公开(公告)号：US07859080B2
公开(公告)日：2010-12-28
申请号：US11606931
申请日：2006-12-01
IPC分类号： H01L27/08
CPC分类号： H03H7/0115 , H01G4/33 , H01L27/016
摘要： The invention provides an electronic component which has an improved breakdown limit value of withstand voltage and improved insulation properties and which can be made compact and provided with a multiplicity of layers and a great capacity. The electronic component includes a first conductor having a bottom conductor formed on a substrate and a raised conductor formed to protrude from the bottom conductor, a dielectric film formed on the raised conductor, and a second conductor formed on the dielectric film to constitute a capacitor element in combination with the raised conductor and the dielectric film.
摘要翻译： 本发明提供一种具有改进的耐电压击穿极限值和改善的绝缘性能的电子部件，其可以制成紧凑的并具有多层和大容量。 电子部件包括：第一导体，其具有形成在基板上的底部导体和形成为从底部导体突出的凸起导体，形成在凸起导体上的电介质膜和形成在电介质膜上的第二导体，以构成电容器元件 与凸起的导体和电介质膜组合。
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公开(公告)号：US07667951B2
公开(公告)日：2010-02-23
申请号：US11598073
申请日：2006-11-13
CPC分类号： H01G4/33 , H01G4/228 , H01G4/40 , H01L23/5223 , H01L27/016 , H01L28/60 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to an electronic component including a capacitor and provides an electronic component in which electromigration can be prevented and whose capacitor element has an accurate capacity value. The electronic component includes a bottom conductor formed on a substrate, a dielectric film formed to cover the bottom conductor, an organic insulation film formed on the dielectric film, and a top conductor formed in an opening provided in the organic insulation film over the bottom conductor, the top conductor forming a capacitor element in combination with the bottom conductor and the dielectric film.
摘要翻译： 本发明涉及包括电容器的电子部件，并且提供可以防止电迁移并且其电容器元件具有精确的容量值的电子部件。 电子部件包括形成在基板上的底部导体，形成为覆盖底部导体的电介质膜，形成在电介质膜上的有机绝缘膜，以及在底部导体上设置在有机绝缘膜中的开口中形成的顶部导体 ，顶部导体与底部导体和电介质膜组合形成电容器元件。
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公开(公告)号：US20070109719A1
公开(公告)日：2007-05-17
申请号：US11598073
申请日：2006-11-13
IPC分类号： H01G4/06
CPC分类号： H01G4/33 , H01G4/228 , H01G4/40 , H01L23/5223 , H01L27/016 , H01L28/60 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to an electronic component including a capacitor and provides an electronic component in which electromigration can be prevented and whose capacitor element has an accurate capacity value. The electronic component includes a bottom conductor formed on a substrate, a dielectric film formed to cover the bottom conductor, an organic insulation film formed on the dielectric film, and a top conductor formed in an opening provided in the organic insulation film over the bottom conductor, the top conductor forming a capacitor element in combination with the bottom conductor and the dielectric film.
摘要翻译： 本发明涉及包括电容器的电子部件，并且提供可以防止电迁移并且其电容器元件具有精确的容量值的电子部件。 电子部件包括形成在基板上的底部导体，形成为覆盖底部导体的电介质膜，形成在电介质膜上的有机绝缘膜，以及在底部导体上设置在有机绝缘膜中的开口中形成的顶部导体 ，顶部导体与底部导体和电介质膜组合形成电容器元件。
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公开(公告)号：US20070089904A1
公开(公告)日：2007-04-26
申请号：US11528331
申请日：2006-09-28
IPC分类号： H01L23/28
CPC分类号： H01F17/0006 , H01F27/29 , H01F2017/0046 , H01G4/228 , H01G4/252
摘要： The invention relates to a surface mount type electronic component to be mounted on a printed circuit board or a hybrid IC (HIC) and provides a low-cost electronic component which is reliable in terms of heat resistance and pressure resistance. An inductor as the electronic component has a general outline in the form of a rectangular parallelepiped, provided by forming a lead-out electrode having a multi-layer structure on a substrate and forming a protective layer for protecting the lead-out electrode using thin film forming techniques. The lead-out electrode includes a first electrode which is electrically connected to a coil conductor and which has an exposed part exposed on an outer surface and a second electrode which has an exposed part exposed on the outer surface to extend an electrode width different from an electrode width of the first electrode and which is formed directly above the first electrode and electrically connected to the first electrode.
摘要翻译： 本发明涉及一种安装在印刷电路板或混合IC（HIC）上的表面贴装型电子元件，并且提供了一种在耐热性和耐压性方面是可靠的低成本电子部件。 作为电子部件的电感器具有长方体形状的一般轮廓，通过在基板上形成具有多层结构的引出电极，并形成用于使用薄膜保护引出电极的保护层 成型技术。 引出电极包括电连接到线圈导体并且具有暴露在外表面上的暴露部分的第一电极和具有暴露在外表面上的暴露部分的第二电极，以延伸不同于 第一电极的电极宽度，并且直接形成在第一电极的上方并与第一电极电连接。
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7.发明授权Thin-film device including a terminal electrode connected to respective end faces of conductor layers 有权薄膜器件包括连接到导体层的相应端面的端子电极公开(公告)号：US07675136B2
公开(公告)日：2010-03-09
申请号：US11723925
申请日：2007-03-22
申请人： Hajime Kuwajima , Masahiro Miyazaki , Akira Furuya
发明人： Hajime Kuwajima , Masahiro Miyazaki , Akira Furuya
IPC分类号： H01L29/00
CPC分类号： H01L27/016
摘要： A thin-film device incorporates a device main body and four terminal electrodes. The device main body has four side surfaces. The terminal electrodes are disposed to touch respective portions of the side surfaces. The device main body includes a lower conductor layer used to form a first passive element and an upper conductor layer used to form a second passive element. At each side surface of the device main body, an end face of the lower conductor layer and an end face of the upper conductor layer are electrically and physically connected to each other. The terminal electrodes touch the end faces of the lower and upper conductor layers, and are thereby connected to the lower and upper conductor layers.
摘要翻译： 薄膜器件包括器件主体和四个端子电极。 装置主体具有四个侧面。 端子电极被设置成接触侧表面的相应部分。 器件主体包括用于形成第一无源元件的下导体层和用于形成第二无源元件的上导体层。 在器件主体的每个侧表面处，下导体层的端面和上导体层的端面彼此电气和物理地连接。 端子电极接触下导体层和上导体层的端面，从而连接到下导体层和上导体层。
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公开(公告)号：US20090244809A1
公开(公告)日：2009-10-01
申请号：US12457296
申请日：2009-06-05
申请人： Hajime Kuwajima , Masahiro Miyazaki , Akira Furuya
发明人： Hajime Kuwajima , Masahiro Miyazaki , Akira Furuya
CPC分类号： H01G4/33 , H01G4/01 , H05K1/162 , H05K3/244 , H05K2201/0179 , H05K2201/0347 , Y10T29/435
摘要： A thin-film device includes a substrate, and a capacitor provided on the substrate. The capacitor incorporates a lower conductor layer having a top surface and a side surface; a flattening film disposed to cover the top and side surfaces of the lower conductor layer; a dielectric film disposed on the flattening film; and an upper conductor layer disposed on the dielectric film. The lower conductor layer is composed of an electrode film and a plating film disposed on the electrode film. The dielectric film has a thickness that falls within a range of 0.02 to 1 μm inclusive and that is smaller than a thickness of the lower conductor layer. A surface roughness in maximum height of a top surface of the flattening film is smaller than that of the top surface of the lower conductor layer and equal to or smaller than the thickness of the dielectric film.
摘要翻译： 薄膜器件包括衬底和设置在衬底上的电容器。 电容器包括具有顶表面和侧表面的下导体层; 布置成覆盖下导体层的顶表面和侧表面的平坦化膜; 设置在平坦化膜上的电介质膜; 以及设置在电介质膜上的上导体层。 下导体层由设置在电极膜上的电极膜和镀膜构成。 电介质膜的厚度为0.02〜1μm的范围，小于下导体层的厚度。 平坦化膜的上表面的最大高度的表面粗糙度小于下导体层的上表面的表面粗糙度，并且等于或小于电介质膜的厚度。
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公开(公告)号：US20070228512A1
公开(公告)日：2007-10-04
申请号：US11723925
申请日：2007-03-22
申请人： Hajime Kuwajima , Masahiro Miyazaki , Akira Furuya
发明人： Hajime Kuwajima , Masahiro Miyazaki , Akira Furuya
IPC分类号： H01L29/00
CPC分类号： H01L27/016
摘要： A thin-film device incorporates a device main body and four terminal electrodes. The device main body has four side surfaces. The terminal electrodes are disposed to touch respective portions of the side surfaces. The device main body includes a lower conductor layer used to form a first passive element and an upper conductor layer used to form a second passive element. At each side surface of the device main body, an end face of the lower conductor layer and an end face of the upper conductor layer are electrically and physically connected to each other. The terminal electrodes touch the end faces of the lower and upper conductor layers, and are thereby connected to the lower and upper conductor layers.
摘要翻译： 薄膜器件包括器件主体和四个端子电极。 装置主体具有四个侧面。 端子电极被设置成接触侧表面的相应部分。 器件主体包括用于形成第一无源元件的下导体层和用于形成第二无源元件的上导体层。 在器件主体的每个侧表面处，下导体层的端面和上导体层的端面彼此电气和物理地连接。 端子电极接触下导体层和上导体层的端面，从而连接到下导体层和上导体层。
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公开(公告)号：US07489036B2
公开(公告)日：2009-02-10
申请号：US11701458
申请日：2007-02-02
IPC分类号： H01L23/48
CPC分类号： H01L27/016 , H01L27/12
摘要： A thin-film device incorporates: a substrate; an insulating layer, a lower conductor layer, a dielectric film, an insulating layer, an upper conductor layer and a protection film that are stacked in this order on the substrate; and four terminal electrodes. The four terminal electrodes touch part of end faces of the upper conductor layer, and part of the top surface of the upper conductor layer contiguous to the end faces. The protection film has four concave portions, each of which has a shape that is recessed inward from the edge of the protection film except portions thereof corresponding to these concave portions. The four concave portions expose respective portions of the top surface of the upper conductor layer that touch the four terminal electrodes. The four concave portions accommodate respective portions of the four terminal electrodes.
摘要翻译： 薄膜器件包括：衬底; 绝缘层，下导体层，电介质膜，绝缘层，上导体层和保护膜，其依次层叠在基板上; 和四个端子电极。 四个端子电极接触上导体层的端面的一部分，并且上导体层的顶表面的与端面相邻的部分。 保护膜具有四个凹部，每个凹部具有从除了与这些凹部对应的部分之外的保护膜的边缘向内凹陷的形状。 四个凹部露出接触四个端子电极的上部导体层的上表面的各个部分。 四个凹部容纳四个端子电极的各部分。
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