公开(公告)号：US20230343646A1

公开(公告)日：2023-10-26

申请号：US17799389

申请日：2021-02-05

Applicant: Kyoritsu Chemical & Co., Ltd. ,  HAMAMATSU PHOTONICS K.K.

Inventor： Daisuke KURITA ,  Yasunobu MATSUMOTO ,  Takeshi SAKAMOTO ,  Iku SANO

IPC: H01L21/78 ,  H01L21/683 ,  H01L21/268 ,  H01L21/67 ,  H01L21/56

CPC classification number: H01L21/78 ,  H01L21/6836 ,  H01L21/268 ,  H01L21/6715 ,  H01L21/56

Abstract: A workpiece cutting method includes: a first step of pasting an expandable sheet on a workpiece; a second step of irradiating, after the first step, the workpiece with laser light to form a modified region and expanding the expandable sheet to divide the workpiece into a plurality of chips, and meanwhile, to form a gap disposed between the plurality of chips and extending to a side surface of the workpiece; a third step of irradiating the expandable sheet with an ultraviolet light after the first step; a fourth step of filling, after the second step and the third step, the gap with resin from an outer edge part of the workpiece including the side surface; a fifth step of curing the resin after the fourth step; and a sixth step of taking out the chips from above the expandable sheet after the fifth step.

公开(公告)号：US20230054570A1

公开(公告)日：2023-02-23

申请号：US17794066

申请日：2021-01-08

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Koji KUNO

IPC: B23K26/53 ,  B23K26/08 ,  B23K26/06 ,  B23K26/03

Abstract: The controller executes a first process of moving a support portion so that inside the peripheral edge of an object, a focusing position moves along the peripheral edge, thereby forming a first modified region, and following the first process, executes a second process of moving the support portion so that the focusing position moves, thereby forming a second modified region The measurement data acquiring portion, at execution of the first process, acquires measurement data associated with position information on a position of the object. The controller, at execution of the second process, causes the driving portion to shift a position of the condenser lens, the position being along the direction of an optical axis, to an initial position based on the measurement data acquired in the first process, before or when the focusing position moves from outside of the object to inside thereof.

公开(公告)号：US20220084827A1

公开(公告)日：2022-03-17

申请号：US17534835

申请日：2021-11-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Ryuji Sugiura ,  Yuta Kondoh ,  Naoki Uchiyama

IPC: H01L21/268 ,  H01L21/683 ,  H01L25/065

Abstract: A laminated element manufacturing method includes a first forming step of forming a first modified region along a line to cut by irradiating a semiconductor substrate of a first wafer with a laser light along the line to cut, a first grinding step of grinding the semiconductor substrate of the first wafer, a bonding step of bonding a circuit layer of a second wafer to the semiconductor substrate of the first wafer, a second forming step of forming a second modified region along the line to cut by irradiating a semiconductor substrate of the second wafer with a laser light along the line to cut, and a second grinding step of grinding the semiconductor substrate of the second wafer.

公开(公告)号：US20220009039A1

公开(公告)日：2022-01-13

申请号：US17289069

申请日：2019-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Katsuhiro KOREMATSU ,  Takeshi SAKAMOTO

IPC: B23K26/53 ,  B23K26/08 ,  H01L21/268

Abstract: A laser processing apparatus irradiates a target with a laser light to form a modified region along a virtual plane in the target. The laser processing apparatus includes a support portion, an irradiation portion, a movement mechanism, and a controller. The controller performs a first processing process of irradiating a first portion in the target with the laser light under a first processing condition, and a second processing process of irradiating a second portion more on an inner side than the first portion in the target with the laser light under a second processing condition different from the first processing condition, after the first processing process.

公开(公告)号：US20220009032A1

公开(公告)日：2022-01-13

申请号：US17288601

申请日：2019-10-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Junji OKUMA

IPC: B23K26/10 ,  B23K37/047 ,  B23K26/08 ,  B23K26/06

Abstract: A laser processing apparatus includes: a support portion configured to move along a first direction; a first moving portion configured to move along a second direction orthogonal to the first direction; a first attachment portion configured to move along a third direction orthogonal to the first direction and the second direction; a first laser processing head attached to the first attachment portion; a light source unit; and a first mirror attached to the first moving portion. The first laser processing head includes a first entrance portion and a first condensing portion. The light source unit includes a first emission portion. The first mirror is attached to the first moving portion to face the first emission portion in the second direction and face the first entrance portion in the third direction.

公开(公告)号：US20200176415A1

公开(公告)日：2020-06-04

申请号：US16633240

申请日：2018-07-18

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Ryuji SUGIURA ,  Yuta KONDOH ,  Naoki UCHIYAMA

IPC: H01L23/00 ,  H01L27/06 ,  H01L21/268 ,  H01L21/78

Abstract: A laminating step includes a first bonding step of bonding a circuit layer of a second wafer to a circuit layer of a first wafer, a grinding step of grinding a semiconductor substrate of the second wafer, and a second bonding step of bonding a circuit layer of the third wafer to the semiconductor substrate of the second wafer. In a laser light irradiation step, a modified region is formed and a fracture extends from the modified region along a laminating direction of a laminated body by irradiating the semiconductor substrate of the first wafer with a laser light.

公开(公告)号：US20170216973A1

公开(公告)日：2017-08-03

申请号：US15314182

申请日：2015-03-30

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yasunori IGASAKI ,  Mamiko MATSUNAGA

IPC: B23K26/53 ,  B23K26/067 ,  B23K26/066

Abstract: A laser processing device includes: a laser light source emitting laser light; a converging optical system converging the laser light at an object to be processed; a reflective spatial light modulator modulating the laser light such that the laser light is caused to branch into 0th order light and ±nth order light (n is a natural number) including at least first processing light and second processing light, and the first processing light is converged at a first converging point and the second processing light is converged at a second converging point; and a light blocking part blocking light to be converged at an outside with respect to the first processing light and the second processing light of the 0th order light and the ±nth order light to be converged at the object.

公开(公告)号：US20130168831A1

公开(公告)日：2013-07-04

申请号：US13757111

申请日：2013-02-01

Applicant: Hamamatsu Photonics K.K.

Inventor： Takeshi SAKAMOTO ,  Kenichi Muramatsu

IPC: H01L23/544

CPC classification number: H01L23/544 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  C03B33/0222 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An object to be processed 1 comprising a substrate 4 and a plurality of functional devices 15 formed on a front face 3 of the substrate 4 is irradiated with laser light L while locating a converging point P within the substrate 4, so as to form at least one row of a divided modified region 72, at least one row of a quality modified region 71 positioned between the divided modified region 72 and the front face 3 of the substrate 4, and at least one row of an HC modified region 73 positioned between the divided modified region 72 and a rear face 21 of the substrate 4 for one line to cut 5. Here, in a direction along the line to cut, a forming density of the divided modified region 72 is made lower than that of the quality modified region 71 and that of the HC modified region 73.

公开(公告)号：US20240238905A1

公开(公告)日：2024-07-18

申请号：US18014819

申请日：2021-07-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Katsuhiro KOREMATSU ,  Takafumi OGIWARA

IPC: B23K26/38

CPC classification number: B23K26/38

Abstract: This laser processing apparatus includes an irradiation unit and a controller. The irradiation unit has a spatial light modulator and a converging part. The controller executes first control for causing the laser light to be modulated by the spatial light modulator such that the laser light is branched into a plurality of rays of processing light and a plurality of converging points of the plurality of rays of processing light are positioned in different positions in a direction perpendicular to an irradiation direction of the laser light. In the first control, the laser light is modulated such that the modified region is present between a converging point of non-modulated light of the laser light and an opposite surface on a side opposite to a laser light incidence surface of the object in the irradiation direction.

公开(公告)号：US20230307237A1

公开(公告)日：2023-09-28

申请号：US18015559

申请日：2021-07-01

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO

IPC: H01L21/268 ,  H01L21/304 ,  B23K26/06 ,  B23K26/073

CPC classification number: H01L21/268 ,  B23K26/0648 ,  B23K26/0736 ,  H01L21/3043

Abstract: A semiconductor member manufacturing method includes a laser processing step of forming a converging spot of laser light in an object including a semiconductor while relatively moving the converging spot with respect to the object along a line extended in a circular shape when viewed from a Z direction intersecting with an incident surface of the laser light in the object, thereby forming a modified region and a fracture extended from the modified region along the line in the object, and a separation step of, after the laser processing step, separating a part of the object using the modified region and the fracture as a boundary, thereby forming a semiconductor member from the object.