公开(公告)号：US09960140B2

公开(公告)日：2018-05-01

申请号：US15024682

申请日：2014-11-11

申请人： NIPPON STEEL & SUMITOMO METAL CORPORATION ,  WASEDA University

发明人： Kohei Tatsumi ,  Shinji Ishikawa ,  Norie Matsubara ,  Masamoto Tanaka

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  B23K35/28 ,  B23K35/30 ,  C22C5/06 ,  C22C5/08 ,  C22C21/00 ,  B22F7/08 ,  B23K35/02 ,  C22C19/00

CPC分类号： H01L24/32 ,  B22F7/08 ,  B22F2999/00 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/28 ,  B23K35/30 ,  B23K35/3033 ,  C22C5/06 ,  C22C5/08 ,  C22C19/00 ,  C22C21/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/03436 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/04026 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/2741 ,  H01L2224/29083 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29155 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2949 ,  H01L2224/29639 ,  H01L2224/29644 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/83055 ,  H01L2224/83065 ,  H01L2224/83075 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8384 ,  H01L2224/85207 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00015 ,  B22F1/0018 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01014 ,  H01L2924/0104 ,  H01L2924/01026 ,  H01L2924/01025 ,  H01L2924/01047 ,  H01L2924/01015 ,  H01L2924/01079 ,  H01L2924/0103 ,  H01L2924/0105 ,  H01L2924/00012

摘要： The present invention can give a joining structure using metal nanoparticles to join the same types or different types of metal where when one surface metal is Al based, the parts are joined through a joining layer containing Ni nanoparticles, whereby a good joining strength is obtained. Further, by using two joining layers (6, 8) including metal nanoparticles to sandwich metal foil (7) so as to form a joining layer and joining the same type or different types of surface metals (3-4) through this joining layer, it is possible to ease the thermal stress due to the difference in amounts of thermal expansion of joined members which have two surface metals.

公开(公告)号：US09818718B2

公开(公告)日：2017-11-14

申请号：US14394347

申请日：2013-08-20

申请人： KAKEN TECH CO., LTD.

发明人： Shigeo Hori ,  Hirohiko Furui ,  Akira Fujita

IPC分类号： B22F1/02 ,  H01L23/00 ,  H01B1/22 ,  B23K1/00 ,  B23K31/12 ,  B23K35/30 ,  B23K35/36 ,  B22F1/00 ,  B23K35/02 ,  B22F9/24

CPC分类号： H01L24/83 ,  B22F1/0051 ,  B22F1/0062 ,  B22F1/0074 ,  B22F9/24 ,  B23K1/0008 ,  B23K1/0016 ,  B23K31/12 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3613 ,  H01B1/22 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/27312 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27416 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29395 ,  H01L2224/29439 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/83055 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/8323 ,  H01L2224/83439 ,  H01L2224/8384 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/066

摘要： Provided are: a conductive paste in which sinterability of silver particles the conductive paste can be easily controlled by using silver particles having predetermined crystal transformation characteristics defined by an XRD analysis, and after a sintering treatment, excellent electrical conductivity and thermal conductivity can be stably obtained; and a die bonding method using the conductive paste.Disclosed is a conductive paste which includes silver particles having a volume average particle size of 0.1 to 30 μm as a sinterable conductive material, and a dispersing medium for making a paste-like form, and in which when the integrated intensity of the peak at 2θ=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis before a sintering treatment of the silver particles is designated as S1, and the integrated intensity of the peak at 2θ=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis after a sintering treatment (250° C., 60 minutes) of the silver particles is designated as S2, the value of S2/S1 is adjusted to a value within the range of 0.2 to 0.8.

公开(公告)号：US20170196133A1

公开(公告)日：2017-07-06

申请号：US15314914

申请日：2015-05-22

申请人： Sharp Kabushiki Kaisha

发明人： Katsuhiro YAMAGUCHI ,  Nobuhiro NAKATA ,  Yukinori MASUDA ,  Tomoki TAKAHARA

IPC分类号： H05K13/04 ,  H05K3/00 ,  H01L23/00 ,  H05K1/11

CPC分类号： H05K13/0469 ,  G02F1/13454 ,  H01L24/03 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/13144 ,  H01L2224/1403 ,  H01L2224/16227 ,  H01L2224/27334 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/7525 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75312 ,  H01L2224/75744 ,  H01L2224/75981 ,  H01L2224/75985 ,  H01L2224/81048 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81234 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81466 ,  H01L2224/81903 ,  H01L2224/83048 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/83234 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/15788 ,  H01L2924/1579 ,  H05K1/111 ,  H05K3/0055 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83

摘要： An array substrate includes a driver, a glass substrate having a driver mounting section where the driver is mounted, an anisotropic conductive material that is interposed between the driver and driver mounting section so as to electrically connect both and that at least includes a binder made of a thermosetting resin and conductive particles in the binder, and a heat supply part provided on at least the driver mounting section of the glass substrate for supplying heat to the anisotropic conductive material.

公开(公告)号：US20170028477A1

公开(公告)日：2017-02-02

申请号：US15302712

申请日：2015-04-10

申请人： Alpha Metals, Inc.

发明人： Rohan P. Setna ,  Nirmalya Kumar Chaki ,  Poulami Sengupta Roy ,  Siuli Sarkar ,  Sutapa Mukherjee

IPC分类号： B22F9/24 ,  B22F1/02 ,  B22F9/04 ,  H01L23/00 ,  C09J9/02 ,  C09J11/04 ,  C09C1/62 ,  B22F1/00 ,  C09J1/00

CPC分类号： B22F9/24 ,  B22F1/0014 ,  B22F1/0074 ,  B22F1/025 ,  B22F9/04 ,  B22F2009/043 ,  B22F2301/10 ,  B22F2301/255 ,  C01P2004/20 ,  C01P2004/32 ,  C01P2004/51 ,  C01P2004/61 ,  C01P2006/11 ,  C01P2006/12 ,  C01P2006/80 ,  C09C1/62 ,  C09C1/622 ,  C09C1/627 ,  C09J1/00 ,  C09J9/02 ,  C09J11/04 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/111 ,  H01L2224/1111 ,  H01L2224/1131 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/11438 ,  H01L2224/1144 ,  H01L2224/11505 ,  H01L2224/13294 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13439 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/271 ,  H01L2224/2711 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27438 ,  H01L2224/2744 ,  H01L2224/27505 ,  H01L2224/29011 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8184 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/8384 ,  H01L2224/94 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2224/11 ,  H01L2224/83 ,  H01L2224/81

摘要： A method for manufacturing metal powder comprising: providing a basic metal salt solution; contacting the basic metal salt solution with a reducing agent to precipitate metal powder therefrom; and recovering precipitated metal powder from the solvent.

摘要翻译： 一种制造金属粉末的方法，包括：提供碱金属盐溶液; 使碱金属盐溶液与还原剂接触以从其中沉淀金属粉末; 并从溶剂中回收沉淀的金属粉末。

公开(公告)号：US20160368103A1

公开(公告)日：2016-12-22

申请号：US15109115

申请日：2014-01-16

申请人： Ormet Circuitd, Inc.

发明人： Catherine A Shearer

IPC分类号： B23K35/26 ,  B23K35/362 ,  B23K35/36 ,  B23K35/02 ,  B23K35/30

CPC分类号： B23K35/262 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/264 ,  B23K35/266 ,  B23K35/268 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3026 ,  B23K35/3033 ,  B23K35/3612 ,  B23K35/362 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/27312 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27418 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29301 ,  H01L2224/29305 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29314 ,  H01L2224/29316 ,  H01L2224/29317 ,  H01L2224/29318 ,  H01L2224/2932 ,  H01L2224/29324 ,  H01L2224/29338 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29349 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29373 ,  H01L2224/2938 ,  H01L2224/29384 ,  H01L2224/29386 ,  H01L2224/29411 ,  H01L2224/29424 ,  H01L2224/29438 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29449 ,  H01L2224/29455 ,  H01L2224/29457 ,  H01L2224/2946 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/29473 ,  H01L2224/2948 ,  H01L2224/29484 ,  H01L2224/29486 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/3201 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/325 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83439 ,  H01L2224/83825 ,  H01L2224/8384 ,  H05K3/3463 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01052 ,  H01L2924/0108 ,  H01L2924/01034 ,  H01L2924/01084 ,  H01L2924/01048 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/00012

摘要： Invention compositions are a replacement for high melting temperature solder pastes and preforms in high operating temperature and step-soldering applications. In the use of the invention, a mixture of metallic powders reacts below 350 degrees C. to form a dense metallic joint that does not remelt at the original process temperature.

摘要翻译： 本发明组合物是在高工作温度和步骤焊接应用中替代高熔点温度的焊膏和预制件。 在本发明的使用中，金属粉末的混合物在350摄氏度以下反应，形成不会在原始工艺温度下重熔的致密金属接头。

公开(公告)号：US09340710B2

公开(公告)日：2016-05-17

申请号：US14134578

申请日：2013-12-19

申请人： DEXERIALS CORPORATION

发明人： Hidetsugu Namiki ,  Shiyuki Kanisawa ,  Hideaki Umakoshi

IPC分类号： H01L33/46 ,  H01L33/62 ,  C09J9/02 ,  C08L23/02 ,  C09J11/04 ,  C09J123/02 ,  H01L33/60 ,  C08G59/42 ,  C08L63/00 ,  C08K3/08 ,  C08K9/02 ,  H01L23/00

CPC分类号： C09J9/02 ,  C08G59/42 ,  C08K3/08 ,  C08K9/02 ,  C08L23/02 ,  C08L63/00 ,  C09J11/04 ,  C09J123/02 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/73 ,  H01L24/83 ,  H01L33/60 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/29644 ,  H01L2224/29647 ,  H01L2224/29655 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/00011

摘要： A light-reflective conductive particle for an anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a core particle coated with a metal material and a light-reflecting layer formed from light-reflective inorganic particles having a refractive index of 1.52 or more on a surface of the core particle. Examples of the light-reflective inorganic particles having a refractive index of 1.52 or more include titanium oxide particles, zinc oxide particles, or aluminum oxide particles.

摘要翻译： 用于发光元件与布线基板的各向异性导电连接的各向异性导电粘合剂用的光反射性导电性粒子，具有涂覆有金属材料的芯粒子和由具有金属材料的光反射性无机粒子形成的光反射层， 核心颗粒表面的折射率为1.52以上。 折射率为1.52以上的光反射性无机粒子的实例包括氧化钛颗粒，氧化锌颗粒或氧化铝颗粒。

公开(公告)号：US09330946B1

公开(公告)日：2016-05-03

申请号：US14946904

申请日：2015-11-20

申请人： International Business Machines Corporation

发明人： Mukta G. Farooq ,  Michael A. Gaynes ,  Katsuyuki Sakuma

IPC分类号： H01L21/56 ,  H01L23/544 ,  H01L21/78 ,  H01L23/29 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L21/563 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/98 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29387 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2224/8388 ,  H01L2224/9212 ,  H01L2224/94 ,  H01L2924/0665 ,  H01L2924/351 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2924/00014 ,  H01L2924/014

摘要： Structures and processes for die stacking using an opaque or translucent pre-applied underfill material generally include selectively applying a low surface tension material to at least a portion of an alignment mark surface on a die; and applying the opaque or translucent underfill material to the die surface, wherein the underfill material does not wet or adhere to the low surface tension material such that the alignment mark surface is free of underfill material.

摘要翻译： 使用不透明或半透明的预先施加的底部填充材料的模具堆叠的结构和工艺通常包括选择性地将低表面张力材料施加到模具上的对准标记表面的至少一部分上; 以及将不透明或半透明的底部填充材料施加到模具表面，其中底部填充材料不会湿润或粘附到低表面张力材料上，使得对准标记表面没有底部填充材料。

公开(公告)号：US20140264383A1

公开(公告)日：2014-09-18

申请号：US14213452

申请日：2014-03-14

申请人： RENESAS ELECTRONICS CORPORATION

发明人： Ryoichi KAJIWARA ,  Takuya NAKAJO ,  Katsuo ARAI ,  Yuichi YATO ,  Hiroi OKA ,  Hiroshi HOZOJI

IPC分类号： H01L23/49 ,  H01L29/20 ,  H01L21/50 ,  H01L29/16

CPC分类号： H01L23/49 ,  H01L21/50 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3192 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/49582 ,  H01L23/562 ,  H01L23/564 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L29/1608 ,  H01L29/2003 ,  H01L2224/0381 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29294 ,  H01L2224/29439 ,  H01L2224/2949 ,  H01L2224/3011 ,  H01L2224/3201 ,  H01L2224/32013 ,  H01L2224/32058 ,  H01L2224/32059 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45565 ,  H01L2224/45616 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/48997 ,  H01L2224/4903 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/83055 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83439 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8392 ,  H01L2224/83951 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/8592 ,  H01L2224/85951 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/10272 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/06 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/01013 ,  H01L2924/01051 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/83205

摘要： A semiconductor device includes a die pad, an SiC chip mounted on the die pad, a porous first sintered Ag layer bonding the die pad and the SiC chip, and a reinforcing resin portion covering a surface of the first sintered Ag layer and formed in a fillet shape. The semiconductor device further includes a source lead electrically connected to a source electrode of the SiC chip, a gate lead electrically connected to a gate electrode, a drain lead electrically connected to a drain electrode, and a sealing body which covers the SiC chip, the first sintered Ag layer, and a part of the die pad, and the reinforcing resin portion covers a part of a side surface of the SiC chip.

摘要翻译： 半导体器件包括芯片焊盘，安装在芯片焊盘上的SiC芯片，接合芯片焊盘和SiC芯片的多孔第一烧结Ag层，以及覆盖第一烧结Ag层表面的增强树脂部分， 圆角形状。 半导体器件还包括电连接到SiC芯片的源电极的源极引线，电连接到栅电极的栅极引线，电连接到漏电极的漏极引线和覆盖SiC芯片的密封体， 第一烧结Ag层和芯片焊盘的一部分，并且增强树脂部分覆盖SiC芯片的侧表面的一部分。

公开(公告)号：US08710662B2

公开(公告)日：2014-04-29

申请号：US13516005

申请日：2011-05-27

申请人： Hideaki Umakoshi ,  Hidetsugu Namiki ,  Akira Ishigami ,  Masaharu Aoki ,  Shiyuki Kanisawa ,  Yoshihisa Shinya

发明人： Hideaki Umakoshi ,  Hidetsugu Namiki ,  Akira Ishigami ,  Masaharu Aoki ,  Shiyuki Kanisawa ,  Yoshihisa Shinya

IPC分类号： H01L23/48

CPC分类号： H01L24/29 ,  C08G59/687 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29386 ,  H01L2224/29444 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81444 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8359 ,  H01L2224/836 ,  H01L2224/83624 ,  H01L2224/83639 ,  H01L2224/83644 ,  H01L2224/83647 ,  H01L2224/83655 ,  H01L2224/83664 ,  H01L2224/83687 ,  H01L2224/83744 ,  H01L2224/83755 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2924/053 ,  H01L2924/00012 ,  H01L2924/05432 ,  H01L2224/29318 ,  H01L2224/29366 ,  H01L2924/05341 ,  H01L2924/049

摘要： A light-reflective anisotropic conductive paste is used as an anisotropic conductive paste when a light-emitting device is produced by flip-chip mounting a light-emitting element such as a light-emitting diode element (LED) on a wiring board. The light-reflective anisotropic conductive paste includes light-reflective insulating particles, in order to improve light emission efficiency without providing, in the LED, a light-reflecting layer that causes an increase in manufacturing cost. With the light-reflective anisotropic conductive paste, a reduction in bonding strength of the light-emitting element to the wiring board in a high-temperature environment can be suppressed, and a reduction in conduction reliability after a TCT can also be suppressed. In the light-reflective anisotropic conductive paste, conductive particles and the light-reflective insulating particles are dispersed in a thermosetting resin composition. The thermosetting resin composition contains an epoxy compound and a thermal catalyst-type curing agent.

摘要翻译： 当通过在布线板上安装诸如发光二极管元件（LED）的发光元件倒装芯片来制造发光器件时，使用光反射各向异性导电膏作为各向异性导电膏。 光反射各向异性导电浆料包括光反射绝缘颗粒，以便在LED中不提供导致制造成本增加的光反射层而提高发光效率。 通过使用光反射性各向异性导电膏，可以抑制发光元件在高温环境下对配线基板的接合强度的降低，并且还可以抑制TCT之后的导通可靠性的降低。 在光反射各向异性导电膏中，导电粒子和光反射绝缘粒子分散在热固性树脂组合物中。 热固性树脂组合物含有环氧化合物和热催化剂型固化剂。

公开(公告)号：US08555491B2

公开(公告)日：2013-10-15

申请号：US12175375

申请日：2008-07-17

申请人： Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

发明人： Monnir Boureghda ,  Nitin Desai ,  Anna Lifton ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

IPC分类号： H05K3/30 ,  H05K3/02 ,  H05K3/10

CPC分类号： H05K13/0465 ,  B22F1/0062 ,  H01L23/373 ,  H01L24/03 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0381 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27416 ,  H01L2224/2745 ,  H01L2224/27452 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/83075 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83204 ,  H01L2224/8321 ,  H01L2224/83211 ,  H01L2224/83438 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/83907 ,  H01L2224/8393 ,  H01L2224/83931 ,  H01L2224/8584 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/203 ,  H01L2924/3512 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T428/24893 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/00012 ,  H01L2924/01014

摘要： Methods for attachment of a die to a substrate are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate.

摘要翻译： 公开了将模具附接到基板的方法。 在某些实施例中，该方法包括在衬底上设置封盖的纳米材料，在设置的封盖的纳米材料上设置管芯，干燥所设置的封盖的纳米材料和所设置的管芯，并在300℃的温度下烧结经干燥的设置的管芯和干燥的封盖的纳米材料 ℃以下以将管芯附着到基板上。