摘要:
A lighting module may be provided that includes a light guide plate; a first case coupled to one side of the light guide plate; a first light source which is disposed in the first case and emits light to the one side of the light guide plate; a second case coupled to the other side of the light guide plate; and a second light source which is disposed in the second case and emits light to the other side of the light guide plate. An amount of light which is emitted through a top surface of the light guide plate is equal to or not equal to an amount of light which is emitted through a bottom surface of the light guide plate.
摘要:
A lighting module may be provided that includes a light guide plate including a predetermined pattern; a case covering both sides of the light guide plate; and a light source which is disposed in the case and is configured to emit light to the both sides of the light guide plate. The light guide plate emits the light from the light source through a top surface and a bottom surface.
摘要:
A lighting module may be provided that includes a first and a second light sources, both of which are disposed opposite to each other; a first case including the first light source; a second case including the second light source; and an optical plate of which one side is connected to the first case and the other side is connected to the second case and on which light from the first and the second light sources is incident, wherein at least the first and/or the second light sources includes a light emitting diode (LED).
摘要:
A lighting module may be provided that includes: a first light guide plate which includes a top surface and a bottom surface, each of which emits light, and a light incident side; a second light guide plate which is disposed below the first light guide plate and includes a top surface and a bottom surface, each of which emits light, and a light incident side; a reflector which is disposed between the first light guide plate and the second light guide plate; and a light source which includes first light emitting devices disposed on a side of the first light guide plate, and second light emitting devices disposed on a side of the second light guide plate.
摘要:
Provided are laminating apparatus and method. A laminating apparatus includes a jig assembly, which includes the first jig and an elastic member, and a second jig. A laminating method includes placing a first plate on a jig assembly, placing a second plate on a second jig which is placed to face the first jig, bringing the second plate into contact with the adhesive layer by making the jig assembly and the second jig approach each other, and, attaching the first plate and the second plate to each other by making the jig assembly and the second jig approach closer to each other. The jig assembly includes a first jig and an elastic member which comprises a top portion and sloping portions sloping downward from the top portion. An adhesive layer is disposed between the first plate and the second plate.
摘要:
An x-ray detection photo diode is disclosed. The disclosed x-ray detection photo diode includes: a substrate; a first electrode formed on the substrate; a photoconductor layer formed on the first electrode in a narrower area than that of the first electrode; and a second electrode formed on the photoconductor layer. In this manner, the x-ray detection photo diode enables the electrode structure to be changed. As such, a leakage current generated in edges of the x-ray detection photo diode can be minimized.
摘要:
Embodiments relate to and image sensor. In embodiments, the image sensor may include a semiconductor substrate, a photodiode region, a gate electrode, a dummy gate, and an interlayer dielectric layer. The semiconductor substrate includes a field oxide layer. The photodiode region may be formed on the semiconductor substrate. The gate electrode may be formed on the semiconductor substrate. The dummy gate may be formed on the field oxide layer. The interlayer dielectric layer may be formed on one side of the dummy gate and includes an opening exposing the photodiode region.
摘要:
Embodiments relate to and image sensor. In embodiments, the image sensor may include a semiconductor substrate, a photodiode region, a gate electrode, a dummy gate, and an interlayer dielectric layer. The semiconductor substrate includes a field oxide layer. The photodiode region may be formed on the semiconductor substrate. The gate electrode may be formed on the semiconductor substrate. The dummy gate may be formed on the field oxide layer. The interlayer dielectric layer may be formed on one side of the dummy gate and includes an opening exposing the photodiode region.