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    Bleaching and detergent compositions comprising manganese complex prepared from tetra-aza macrocyclic ligands through a convenient synthesis
    1.
    发明授权
    Bleaching and detergent compositions comprising manganese complex prepared from tetra-aza macrocyclic ligands through a convenient synthesis 有权
    漂白和洗涤剂组合物包含通过方便的合成由四 - 氮杂大环配体制备的锰络合物

    公开(公告)号：US07906472B2

    公开(公告)日：2011-03-15

    申请号：US11593167

    申请日：2006-11-03

    申请人： Han Woong Park ,  Sang Yun Lee ,  In Sik Cho ,  Won Jong Kim ,  In Sub Baik

    发明人： Han Woong Park ,  Sang Yun Lee ,  In Sik Cho ,  Won Jong Kim ,  In Sub Baik

    IPC分类号： C11D1/00 ,  C11D3/20 ,  C11D3/26 ,  C11D3/28 ,  C11D3/39 ,  C11D3/395

    CPC分类号： C11D3/3935 ,  C11D3/3932

    摘要： The present invention provides a bleach activator which is at least one macrocyclic manganese complex selected from the group consisting of [MnIII(rac-14-decane)X2]Y, [MnIII(mes-14-decane)X2]Y.H2O and [MnIII(mes-14-decane)X2]Y represented by Formulas 1-3, as well as a preparation method thereof. Also, the invention provides a bleaching composition and bleaching detergent composition comprising the bleach activator. The bleach activator comprising the manganese complex is used in a granulated form. wherein X is at least one selected from chlorine (—Cl) and acetate (—OOCCH3), and Y is an anion selected from Cl−, Br−, F−, NO3−, ClO4−, OH−, NCS−, N3−, and PF6−.

    摘要翻译： 本发明提供一种漂白活化剂，它是至少一种选自[MnIII（rac-14-癸烷）X2] Y，[MnIII（mes-14-癸烷）X2]·Y.H2O和[ 由式1-3表示的MnIII（mes-14-癸烷）X2] Y及其制备方法。 此外，本发明提供了一种漂白组合物和漂白洗涤剂组合物，其包含漂白活化剂。 包含锰络合物的漂白活化剂以颗粒形式使用。 其中X是选自氯（-Cl）和乙酸（-OOCCH 3）中的至少一种，Y是选自Cl-，Br-，F-，NO 3 - ，ClO 4 - ，OH-，NCS-，N 3 - ，和PF6-。

    Herb medicine extract-containing non-bleeding striped dentifrice composition
    2.
    发明授权
    Herb medicine extract-containing non-bleeding striped dentifrice composition 失效
    含草药提取物含有非渗色条纹牙膏组合物

    公开(公告)号：US5980870A

    公开(公告)日：1999-11-09

    申请号：US934544

    申请日：1997-09-19

    申请人： In Sub Baik ,  Jong Gi Lee ,  In Sik Cho ,  Youn Woo Park

    发明人： In Sub Baik ,  Jong Gi Lee ,  In Sik Cho ,  Youn Woo Park

    IPC分类号： A61K8/19 ,  A61K8/26 ,  A61K8/73 ,  A61K8/97 ,  A61Q11/00 ,  A61K9/16

    CPC分类号： A61K8/0237 ,  A61K8/19 ,  A61K8/26 ,  A61K8/73 ,  A61K8/97 ,  A61Q11/00

    摘要： A herb medicine extract-containing non-bleeding striped dentifrice composition, consisting essentially of a striped dentifrice component and a base dentifrice component, each component comprising the following ingredients at the substantially same amount: a. an abrasive that has a BET surface area of 10 m.sup.2 /g or less and an average particle diameter of 1 to 30 .mu.m upon measurement by Coulter Counter method, and shows oil absorption (linseed oil, ml/100 g) of 50 or less; b. a binder selected from the group consisting of xanthan gum, carrageenan, sodium carboxymethylcellulose, and the mixtures thereof; c. an alkyl sulfonate of anionic surfactants; and d. a humectant, and said striped dentifrice component containing herb medicine extracts at an amount of 0.001 to 10% by weight, on the basis of dry solid substance. It is non-bleeding by virtue of the substantially same formulation in the two components and the herb medicine extracts allow the dentifrice composition to suppress the formation of plaque.

    摘要翻译： 一种草本药物提取物含有非出血性条状洁齿剂组合物，其基本上由条状洁牙剂组分和基础洁齿剂组分组成，每种组分包含基本相同量的以下成分：a。 通过Coulter Counter法测定的BET表面积为10m 2 / g以下，平均粒径为1〜30μm的研磨剂，油吸收（亚麻子油，ml / 100g）为50以下 ; b。 选自黄原胶，角叉菜胶，羧甲基纤维素钠及其混合物的粘合剂; C。 阴离子表面活性剂的烷基磺酸盐; 和d。 湿润剂，所述条状洁齿剂组分含有基于干固体物质的0.001至10重量％的草药提取物。 由于在两个成分中基本相同的制剂是不渗血的，草药提取物允许洁牙剂组合物抑制斑块的形成。

    Wafer level packages capable of reducing chipping defect and manufacturing methods thereof
    3.
    发明申请
    Wafer level packages capable of reducing chipping defect and manufacturing methods thereof 有权
    能够减少切屑缺陷的晶片级封装及其制造方法

    公开(公告)号：US20080237896A1

    公开(公告)日：2008-10-02

    申请号：US12076903

    申请日：2008-03-25

    申请人： In Sik Cho

    发明人： In Sik Cho

    IPC分类号： H01L23/29 ,  H01L21/00

    CPC分类号： H01L21/561 ,  H01L23/3128 ,  H01L2224/13 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

    摘要： A packaged semiconductor device may include a substrate including at least one device layer and at least one connector arranged thereon, and a resin cover covering each side of the substrate, the resin cover on at least one side of the substrate including an opening exposing the connector and the resin cover on at least one other side of the substrate exposing a portion of the substrate.

    摘要翻译： 封装的半导体器件可以包括：衬底，其包括至少一个器件层和布置在其上的至少一个连接器;以及覆盖衬底的每一侧的树脂覆盖层，所述衬底的至少一侧上的树脂盖包括露出连接器的开口 并且所述树脂盖在所述基板的至少另一侧上，暴露所述基板的一部分。

    Encapsulated wafer level package with protection against damage and manufacturing method
    5.
    发明授权
    Encapsulated wafer level package with protection against damage and manufacturing method 有权
    封装的晶圆级封装，防止损坏和制造方法

    公开(公告)号：US08026601B2

    公开(公告)日：2011-09-27

    申请号：US12076903

    申请日：2008-03-25

    申请人： In Sik Cho

    发明人： In Sik Cho

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/28

    CPC分类号： H01L21/561 ,  H01L23/3128 ,  H01L2224/13 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

    摘要： A packaged semiconductor device may include a substrate including at least one device layer and at least one connector arranged thereon, and a resin cover covering each side of the substrate, the resin cover on at least one side of the substrate including an opening exposing the connector and the resin cover on at least one other side of the substrate exposing a portion of the substrate.

    摘要翻译： 封装的半导体器件可以包括：衬底，其包括至少一个器件层和布置在其上的至少一个连接器;以及覆盖衬底的每一侧的树脂覆盖层，所述衬底的至少一侧上的树脂盖包括露出连接器的开口 并且所述树脂盖在所述基板的至少另一侧上，暴露所述基板的一部分。

    Semiconductor device packages having dummy block leads and tie bars with extended portions to prevent formation of air traps in the encapsulate
    6.
    发明授权
    Semiconductor device packages having dummy block leads and tie bars with extended portions to prevent formation of air traps in the encapsulate 失效
    半导体器件封装具有虚拟块引线和具有延伸部分的连接杆，以防止密封件中的空气阱的形成

    公开(公告)号：US5932923A

    公开(公告)日：1999-08-03

    申请号：US943129

    申请日：1997-10-03

    申请人： Tae Hyeong Kim ,  Hee Sun Rho ,  In Sik Cho ,  Gi Su Yoo ,  Sang Hyeop Lee

    发明人： Tae Hyeong Kim ,  Hee Sun Rho ,  In Sik Cho ,  Gi Su Yoo ,  Sang Hyeop Lee

    IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L23/12 ,  H01L23/495 ,  H01L23/50

    CPC分类号： H01L21/565 ,  H01L23/49551 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/181

    摘要： A semiconductor device package is equipped with devices for preventing the formulation of air traps in its encapsulated package body. These devices include dummy block leads formed on the outermost inner lead of each row of inner leads, and extended portions formed on each tie bar. Each dummy block lead extends from the end of an outermost inner lead and is integrally formed therewith. The tie bar extended portions are separated into several parts defined by spaces between the parts, and the several parts are formed integral with each other and with the tie bar. The dummy block leads and the tie bar extended portions may be formed so as to be inclined relative to horizontal and with jagged edges at their side surfaces. The dummy block leads and tie bar extended portions serve to reduce the velocity of the potting resin which forms the encapsulate, as it enters the die cavity for encapsulation, but before the resin actually contacts the chip or the inner leads. Thereby, the flow velocity at various points within the mold cavity is uniform, and formation of air traps is prevented.

    摘要翻译： 半导体器件封装配备有用于防止其封装的封装主体中的空气阱的配制的装置。 这些装置包括形成在每排内引线的最外侧的内引线上的虚拟块引线和形成在每个连杆上的延伸部分。 每个虚拟块引线从最外侧的内部引线的端部延伸并与其一体地形成。 拉杆延伸部分被分成由部件之间的空间限定的几个部分，并且多个部分彼此成一体并且与连接杆形成。 虚拟块引导件和拉杆延伸部分可以形成为相对于水平面倾斜并且在其侧表面具有锯齿状边缘。 虚拟块引线和连接杆延伸部分用于当其进入用于封装的模腔时，但在树脂实际接触芯片或内引线之前，会降低形成封装的灌封树脂的速度。 因此，模腔内的各点的流速是均匀的，并且防止了空气阱的形成。