公开(公告)号：US20110199746A1

公开(公告)日：2011-08-18

申请号：US12705389

申请日：2010-02-12

Applicant: Han-Hsiang LEE ,  Kun-Hong SHIH ,  Jeng-Jen LI

Inventor： Han-Hsiang LEE ,  Kun-Hong SHIH ,  Jeng-Jen LI

IPC: H05K7/00

CPC classification number: H05K7/1432 ,  H01L23/13 ,  H01L23/49531 ,  H01L23/49541 ,  H01L2224/49175 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M3/00 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/10924 ,  H05K2203/1327 ,  H01L2924/00

Abstract: A composite substrate made of a circuit board mounted on a lead frame is used for an electronic system package. High heat generated electronic components are adapted to mount on the lead frame and relatively low heat generated electronic components are adapted to mount on the circuit board. Metal lines are used for electrical coupling between the circuitry of the IC chip and the circuit board. An electronic system with the composite substrate gains both advantages—good circuitry arrangement capability from the circuit board and good heat distribution from the lead frame.

Abstract translation: 将由安装在引线框架上的电路板制成的复合基板用于电子系统封装。 高热产生的电子部件适于安装在引线框架上，相对低的发热电子部件适于安装在电路板上。 金属线用于IC芯片的电路和电路板之间的电耦合。 具有复合基板的电子系统具有两个优点 - 电路板具有良好的电路布置能力和来自引线框架的良好热分布。

公开(公告)号：US20110057766A1

公开(公告)日：2011-03-10

申请号：US12773152

申请日：2010-05-04

Applicant: Ching-Feng CHEN ,  Kun-Hong SHIH ,  Yen-Ting LIN ,  Yin-Tien YEH

Inventor： Ching-Feng CHEN ,  Kun-Hong SHIH ,  Yen-Ting LIN ,  Yin-Tien YEH

IPC: H01C1/034

CPC classification number: H01C17/006 ,  H01C7/003 ,  H01C7/13 ,  H01C17/02 ,  H01C17/065

Abstract: A surface mount resistor includes a resistance body, a first protective layer, a heat-transfer layer, a second protective layer and two electrode layers. The resistance body has a first end portion, a second end portion and a central portion between the first end portion and the second end portion. The first protective layer is disposed on the central portion of the resistance body, and the first end portion and the second end portion are exposed. The heat-transfer layer is plated on at least part of the resistance body. The second protective layer is disposed on at least part of the heat-transfer layer. The electrode layers are respectively arranged on the first end portion and the second end portion, and electrically connected with the heat-transfer layer.

Abstract translation: 表面贴装电阻器包括电阻体，第一保护层，传热层，第二保护层和两个电极层。 电阻体具有在第一端部和第二端部之间的第一端部，第二端部和中心部。 第一保护层设置在电阻体的中心部分，第一端部和第二端部露出。 传热层被电镀在电阻体的至少一部分上。 第二保护层设置在传热层的至少一部分上。 电极层分别设置在第一端部和第二端部上，与传热层电连接。