DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    显示装置及其制造方法

    公开(公告)号:US20120115265A1

    公开(公告)日:2012-05-10

    申请号:US13354618

    申请日:2012-01-20

    IPC分类号: H01L31/18

    摘要: A substrate comprising a thin-film-transistor (TFT) region, a pixel region, a gate-line region and a data-line region is provided. A transparent conductive layer and a first metal layer are orderly formed on the substrate. A conductive stack layer is formed within each of the TFT/pixel/gate-line regions and the end of the data-line region. Next, a first insulating layer and a semiconductor layer are orderly formed, and a patterned first insulating layer and a patterned semiconductor layer are formed above the conductive stack layer within the TFT region. Then, a second metal layer and a first photoresist layer are respectively formed. Afterwards, the second and the first metal layers are patterned by using the first photoresist layer as a photomask. Finally, the first photoresist layer is reflowed by heat, and part of the reflowed first photoresist layer covers a channel formed within the TFT region.

    摘要翻译: 提供了包括薄膜晶体管(TFT)区域,像素区域,栅极线区域和数据线区域的衬底。 在衬底上有序地形成透明导电层和第一金属层。 在每个TFT /像素/栅极线区域和数据线区域的末端中形成导电堆叠层。 接下来,有序地形成第一绝缘层和半导体层,并且在TFT区域内的导电堆叠层的上方形成图案化的第一绝缘层和图案化半导体层。 然后,分别形成第二金属层和第一光致抗蚀剂层。 之后,通过使用第一光致抗蚀剂层作为光掩模来对第二和第一金属层进行构图。 最后,第一光致抗蚀剂层通过热回流,并且回流的第一光致抗蚀剂层的一部分覆盖形成在TFT区域内的沟道。

    Display device and method of manufacturing the same
    2.
    发明授权
    Display device and method of manufacturing the same 有权
    显示装置及其制造方法

    公开(公告)号:US08143624B2

    公开(公告)日:2012-03-27

    申请号:US12076297

    申请日:2008-03-17

    IPC分类号: H01L27/14

    摘要: A substrate comprising a thin-film-transistor (TFT) region, a pixel region, a gate-line region and a data-line region is provided. A transparent conductive layer and a first metal layer are orderly formed on the substrate. A conductive stack layer is formed within each of the TFT/pixel/gate-line regions and the end of the data-line region. Next, a first insulating layer and a semiconductor layer are orderly formed, and a patterned first insulating layer and a patterned semiconductor layer are formed above the conductive stack layer within the TFT region. Then, a second metal layer and a first photoresist layer are respectively formed. Afterwards, the second and the first metal layers are patterned by using the first photoresist layer as a photomask. Finally, the first photoresist layer is reflowed by heat, and part of the reflowed first photoresist layer covers a channel formed within the TFT region.

    摘要翻译: 提供了包括薄膜晶体管(TFT)区域,像素区域,栅极线区域和数据线区域的衬底。 在衬底上有序地形成透明导电层和第一金属层。 在每个TFT /像素/栅极线区域和数据线区域的末端中形成导电堆叠层。 接下来,有序地形成第一绝缘层和半导体层,并且在TFT区域内的导电堆叠层的上方形成图案化的第一绝缘层和图案化半导体层。 然后,分别形成第二金属层和第一光致抗蚀剂层。 之后,通过使用第一光致抗蚀剂层作为光掩模来对第二和第一金属层进行构图。 最后,第一光致抗蚀剂层通过热回流,并且回流的第一光致抗蚀剂层的一部分覆盖形成在TFT区域内的沟道。

    Display device and method of manufacturing the same
    3.
    发明申请
    Display device and method of manufacturing the same 有权
    显示装置及其制造方法

    公开(公告)号:US20090101902A1

    公开(公告)日:2009-04-23

    申请号:US12076297

    申请日:2008-03-17

    IPC分类号: H01L33/00 H01L21/00

    摘要: A substrate comprising a thin-film-transistor (TFT) region, a pixel region, a gate-line region and a data-line region is provided. A transparent conductive layer and a first metal layer are orderly formed on the substrate. A conductive stack layer is formed within each of the TFT/pixel/gate-line regions and the end of the data-line region. Next, a first insulating layer and a semiconductor layer are orderly formed, and a patterned first insulating layer and a patterned semiconductor layer are formed above the conductive stack layer within the TFT region. Then, a second metal layer and a first photoresist layer are respectively formed. Afterwards, the second and the first metal layers are patterned by using the first photoresist layer as a photomask. Finally, the first photoresist layer is reflowed by heat, and part of the reflowed first photoresist layer covers a channel formed within the TFT region.

    摘要翻译: 提供了包括薄膜晶体管(TFT)区域,像素区域,栅极线区域和数据线区域的衬底。 在衬底上有序地形成透明导电层和第一金属层。 在每个TFT /像素/栅极线区域和数据线区域的末端中形成导电堆叠层。 接下来,有序地形成第一绝缘层和半导体层,并且在TFT区域内的导电堆叠层的上方形成图案化的第一绝缘层和图案化半导体层。 然后,分别形成第二金属层和第一光致抗蚀剂层。 之后,通过使用第一光致抗蚀剂层作为光掩模来对第二和第一金属层进行构图。 最后,第一光致抗蚀剂层通过热回流,并且回流的第一光致抗蚀剂层的一部分覆盖形成在TFT区域内的沟道。

    Display device and method of manufacturing the same

    公开(公告)号:US08383466B2

    公开(公告)日:2013-02-26

    申请号:US13354618

    申请日:2012-01-20

    IPC分类号: H01L21/00

    摘要: A substrate comprising a thin-film-transistor (TFT) region, a pixel region, a gate-line region and a data-line region is provided. A transparent conductive layer and a first metal layer are orderly formed on the substrate. A conductive stack layer is formed within each of the TFT/pixel/gate-line regions and the end of the data-line region. Next, a first insulating layer and a semiconductor layer are orderly formed, and a patterned first insulating layer and a patterned semiconductor layer are formed above the conductive stack layer within the TFT region. Then, a second metal layer and a first photoresist layer are respectively formed. Afterwards, the second and the first metal layers are patterned by using the first photoresist layer as a photomask. Finally, the first photoresist layer is reflowed by heat, and part of the reflowed first photoresist layer covers a channel formed within the TFT region.

    PIXEL STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    5.
    发明申请
    PIXEL STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 有权
    像素结构及其制造方法

    公开(公告)号:US20110117707A1

    公开(公告)日:2011-05-19

    申请号:US13013887

    申请日:2011-01-26

    IPC分类号: H01L21/336

    CPC分类号: H01L27/1288 H01L27/1214

    摘要: A method for manufacturing a pixel structure is provided. First, a first mask process is performed to form a patterned first metal layer on a substrate, wherein the patterned first metal layer includes a gate. Next, a second mask process is performed to form a patterned insulating layer and a patterned semiconductor layer over the gate, wherein the patterned insulating layer is disposed on the patterned first metal layer, and the patterned semiconductor layer is disposed on the patterned insulating layer. Then, a third mask process is performed to define a thin film transistor (TFT) and a pixel electrode connected thereto and to form a passivation layer to cover the TFT.

    摘要翻译: 提供了一种用于制造像素结构的方法。 首先,执行第一掩模处理以在基板上形成图案化的第一金属层,其中图案化的第一金属层包括栅极。 接下来,执行第二掩模处理以在栅极上形成图案化绝缘层和图案化半导体层,其中图案化绝缘层设置在图案化的第一金属层上,并且图案化的半导体层设置在图案化的绝缘层上。 然后,执行第三掩模处理以限定连接到其上的薄膜晶体管(TFT)和像素电极,并形成覆盖TFT的钝化层。

    Pixel structure and method for manufacturing the same
    6.
    发明申请
    Pixel structure and method for manufacturing the same 有权
    像素结构及其制造方法

    公开(公告)号:US20100051954A1

    公开(公告)日:2010-03-04

    申请号:US12591019

    申请日:2009-11-05

    IPC分类号: H01L33/00 H01L31/0224

    CPC分类号: H01L27/1288 H01L27/1214

    摘要: A method for manufacturing a pixel structure is provided. First, a first mask process is performed to form a patterned first metal layer on a substrate, wherein the patterned first metal layer includes a gate. Next, a second mask process is performed to form a patterned insulating layer and a patterned semiconductor layer over the gate, wherein the patterned insulating layer is disposed on the patterned first metal layer, and the patterned semiconductor layer is disposed on the patterned insulating layer. Then, a third mask process is performed to define a thin film transistor (TFT) and a pixel electrode connected thereto and to form a passivation layer to cover the TFT.

    摘要翻译: 提供了一种用于制造像素结构的方法。 首先,执行第一掩模处理以在基板上形成图案化的第一金属层,其中图案化的第一金属层包括栅极。 接下来,执行第二掩模处理以在栅极上形成图案化绝缘层和图案化半导体层,其中图案化绝缘层设置在图案化的第一金属层上,并且图案化的半导体层设置在图案化的绝缘层上。 然后,执行第三掩模处理以限定连接到其上的薄膜晶体管(TFT)和像素电极,并形成覆盖TFT的钝化层。

    Pixel structure and method for manufacturing the same
    8.
    发明申请
    Pixel structure and method for manufacturing the same 有权
    像素结构及其制造方法

    公开(公告)号:US20090108260A1

    公开(公告)日:2009-04-30

    申请号:US12076681

    申请日:2008-03-21

    IPC分类号: H01L29/04 H01L21/336

    CPC分类号: H01L27/1288 H01L27/1214

    摘要: A method for manufacturing a pixel structure is provided. First, a first mask process is performed to form a patterned first metal layer on a substrate, wherein the patterned first metal layer includes a gate. Next, a second mask process is performed to form a patterned insulating layer and a patterned semiconductor layer over the gate, wherein the patterned insulating layer is disposed on the patterned first metal layer, and the patterned semiconductor layer is disposed on the patterned insulating layer. Then, a third mask process is performed to define a thin film transistor (TFT) and a pixel electrode connected thereto and to form a passivation layer to cover the TFT.

    摘要翻译: 提供了一种用于制造像素结构的方法。 首先,执行第一掩模处理以在基板上形成图案化的第一金属层,其中图案化的第一金属层包括栅极。 接下来,执行第二掩模处理以在栅极上形成图案化绝缘层和图案化半导体层,其中图案化绝缘层设置在图案化的第一金属层上,并且图案化的半导体层设置在图案化的绝缘层上。 然后,执行第三掩模处理以限定连接到其上的薄膜晶体管(TFT)和像素电极,并形成覆盖TFT的钝化层。

    Pixel structure and method for manufacturing the same

    公开(公告)号:US07897449B2

    公开(公告)日:2011-03-01

    申请号:US12076681

    申请日:2008-03-21

    IPC分类号: H01L21/8238 H01L29/04

    CPC分类号: H01L27/1288 H01L27/1214

    摘要: A method for manufacturing a pixel structure is provided. First, a first mask process is performed to form a patterned first metal layer on a substrate, wherein the patterned first metal layer includes a gate. Next, a second mask process is performed to form a patterned insulating layer and a patterned semiconductor layer over the gate, wherein the patterned insulating layer is disposed on the patterned first metal layer, and the patterned semiconductor layer is disposed on the patterned insulating layer. Then, a third mask process is performed to define a thin film transistor (TFT) and a pixel electrode connected thereto and to form a passivation layer to cover the TFT.

    Pixel structure and method for manufacturing the same

    公开(公告)号:US07834361B2

    公开(公告)日:2010-11-16

    申请号:US12591019

    申请日:2009-11-05

    IPC分类号: H01L29/04 H01L21/8238

    CPC分类号: H01L27/1288 H01L27/1214

    摘要: A method for manufacturing a pixel structure is provided. First, a first mask process is performed to form a patterned first metal layer on a substrate, wherein the patterned first metal layer includes a gate. Next, a second mask process is performed to form a patterned insulating layer and a patterned semiconductor layer over the gate, wherein the patterned insulating layer is disposed on the patterned first metal layer, and the patterned semiconductor layer is disposed on the patterned insulating layer. Then, a third mask process is performed to define a thin film transistor (TFT) and a pixel electrode connected thereto and to form a passivation layer to cover the TFT.