公开(公告)号：US5430611A

公开(公告)日：1995-07-04

申请号：US88283

申请日：1993-07-06

申请人： Chandrakant Patel ,  Hannsjorg Obermaier

发明人： Chandrakant Patel ,  Hannsjorg Obermaier

IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/467 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L23/467 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/3011

摘要： A spring-biased heat sink assembly for a multi-chip module that has several integrated circuit chips on a substrate. Thermal paste provides a thermal connection between a heat sink and the chips. A beam spring applies pressure to the back side of the substrate, maintaining a constant force that urges the chips against the heat sink and avoids mechanical stress that would otherwise result from lateral motion of the chips such as from differential expansion. A flat flexible cable connects the module with other circuitry.

摘要翻译： 一种用于多芯片模块的弹簧偏置散热器组件，其在基板上具有多个集成电路芯片。 散热膏在散热片和芯片之间提供热连接。 梁弹簧向基板的背面施加压力，保持恒定的力，以将芯片推向散热片，并避免由于芯片的横向运动（例如来自差动膨胀）而导致的机械应力。 扁平柔性电缆将模块与其他电路连接。

公开(公告)号：US5966293A

公开(公告)日：1999-10-12

申请号：US990635

申请日：1997-12-15

申请人： Hannsjorg Obermaier ,  Keunmyung Lee

发明人： Hannsjorg Obermaier ,  Keunmyung Lee

IPC分类号： G06F13/40 ,  H05K3/00 ,  H05K3/46 ,  H05K7/14 ,  H05K7/10

CPC分类号： H05K3/4691 ,  G06F13/409 ,  H05K7/1442 ,  H05K7/1459 ,  H05K2201/044 ,  H05K2201/09109 ,  H05K3/4614

摘要： An electrical interconnection structure. The electrical interconnection structure includes a mother board substrate having a plurality of layers. At least one layer includes a signal path having a characteristic impedance of Z.sub.O and a conductive ground plane. A signal via passes through each layer of the mother board substrate. The signal via electrically is connected to the signal path. A ground via passes through each layer of the mother board substrate. The ground via is electrically connected to the conductive ground plane. The electrical interconnection structure further includes a plurality of flex circuits. Each flex circuit includes a flex signal path having a characteristic impedance of Z.sub.O and a flex ground plane. Each flex signal path is electrically connected to the signal via and each flex ground plane is electrically connected to the ground via. The connections between the flex signal path and the signal via, and between the flex ground plane and the ground via can be permanent or separable.

摘要翻译： 电互连结构。 电互连结构包括具有多个层的母板衬底。 至少一层包括具有ZO的特性阻抗和导电接地平面的信号路径。 信号通孔穿过母板基板的每一层。 电信号通过信号通路连接。 接地通孔穿过母板基板的每一层。 接地通孔电连接到导电接地平面。 电互连结构还包括多个柔性电路。 每个柔性电路包括具有ZO的特性阻抗和柔性接地平面的弯曲信号路径。 每个柔性信号路径电连接到信号通孔，并且每个柔性接地平面电连接到接地通孔。 柔性信号路径和信号通孔之间，以及柔性接地平面和接地通道之间的连接可以是永久的或可分离的。

公开(公告)号：US06185104B2

公开(公告)日：2001-02-06

申请号：US09220647

申请日：1998-12-24

申请人： Hannsjorg Obermaier

发明人： Hannsjorg Obermaier

IPC分类号： H05K500

CPC分类号： G06F1/185 ,  G06F1/184 ,  G06F1/186 ,  H05K7/1414

摘要： An improved apparatus is disclosed for removing and installing faulty printed circuit cards laterally through a side wall of a computer system, while the remaining cards of the computer system remain under power and operational. The computer system incorporates zero insertion force (ZIF) connectors for receiving the printed circuit cards, and a special interlock mechanism prevents each ZIF connector from being moved from its open position to its closed position until an associated card has been fully installed into the connector. In addition, a special centering mechanism is used to adjustably position the printed circuit card with its electrical contacts precisely aligned with the contacts of the ZIF connector.

摘要翻译： 公开了一种改进的装置，用于通过计算机系统的侧壁横向移除和安装有故障的印刷电路卡，而计算机系统的剩余卡片仍然处于电力和可操作状态。 计算机系统包括用于接收印刷电路卡的零插入力（ZIF）连接器，并且特殊的互锁机构防止每个ZIF连接器从其打开位置移动到其关闭位置，直到相关的卡已经完全安装到连接器中。 另外，使用特殊的定心机构可调整地定位印刷电路卡，其电触头与ZIF连接器的触点精确对准。

公开(公告)号：US06656314B2

公开(公告)日：2003-12-02

申请号：US09862705

申请日：2001-05-23

申请人： Hannsjorg Obermaier

发明人： Hannsjorg Obermaier

IPC分类号： B32B310

CPC分类号： H05K3/465 ,  H05K3/0032 ,  H05K3/4661 ,  H05K2203/0156 ,  H05K2203/1407 ,  Y10T29/49126 ,  Y10T29/49156 ,  Y10T428/24331

摘要： A multi-layered substrate is manufactured utilizing a sheet material. The sheet material is a dielectric material with a dielectric adhesive coated on one side. A catalyst layer is at a boundary between the dielectric material and the adhesive. The catalyst layer is thin in comparison to the dielectric material and the dielectric adhesive. In the manufacture of the multi-layered substrate, the material is processed using patterning and metallizing steps. During this manufacture the processed sheet material may be supported with a releasable layer. Laminating additional sheet materials onto previously processed sheets produces multiple layers. These additional sheets are then processed. Multiple lamination steps may be performed in order to obtain an end product of a desired number of layers.