公开(公告)号：US20100077516A1

公开(公告)日：2010-03-25

申请号：US12234816

申请日：2008-09-22

申请人： Harish Bhaskaran ,  Michel Despont ,  Ute Drechsler ,  Abu Sebastian

发明人： Harish Bhaskaran ,  Michel Despont ,  Ute Drechsler ,  Abu Sebastian

IPC分类号： G01N13/16

CPC分类号： G01Q60/40

摘要： Tips including a platinum silicide at an apex of a single crystal silicon tip are provided herein. Also, techniques for creating a tip are provided. The techniques include depositing an amount of platinum (Pt) on a single crystal silicon tip, annealing the platinum and single crystal silicon tip to form a platinum silicide, and selectively etching the platinum with respect to the formed platinum silicide.

摘要翻译： 本文提供了包括单晶硅尖端顶点处的铂硅化物的提示。 此外，提供了用于创建提示的技术。 这些技术包括在单晶硅尖端上沉积一定量的铂（Pt），使铂和单晶硅尖端退火以形成铂硅化物，并相对于形成的铂硅化物选择性地蚀刻铂。

公开(公告)号：US08332961B2

公开(公告)日：2012-12-11

申请号：US12234816

申请日：2008-09-22

申请人： Harish Bhaskaran ,  Michel Despont ,  Ute Drechsler ,  Abu Sebastian

发明人： Harish Bhaskaran ,  Michel Despont ,  Ute Drechsler ,  Abu Sebastian

IPC分类号： G01Q60/40 ,  G01Q10/00

CPC分类号： G01Q60/40

摘要： Tips including a platinum silicide at an apex of a single crystal silicon tip are provided herein. Also, techniques for creating a tip are provided. The techniques include depositing an amount of platinum (Pt) on a single crystal silicon tip, annealing the platinum and single crystal silicon tip to form a platinum silicide, and selectively etching the platinum with respect to the formed platinum silicide.

摘要翻译： 本文提供了包括单晶硅尖端顶点处的铂硅化物的提示。 此外，提供了用于创建提示的技术。 这些技术包括在单晶硅尖端上沉积一定量的铂（Pt），使铂和单晶硅尖端退火以形成铂硅化物，并相对于形成的铂硅化物选择性地蚀刻铂。

公开(公告)号：US08327461B2

公开(公告)日：2012-12-04

申请号：US13146355

申请日：2010-01-15

申请人： Harish Bhaskaran ,  Michel Despont ,  Abu Sebastian

发明人： Harish Bhaskaran ,  Michel Despont ,  Abu Sebastian

IPC分类号： G01Q60/14 ,  G01N13/16 ,  G01N13/10

CPC分类号： G01Q60/16

摘要： The invention is directed to a probe for scanning probe microscopy. The probe 20 comprises a tunnel-current conducting part 30 and a tunnel-current insulating part 40. The said parts are configured such that the insulating part determines a minimal distance between the conducting part 30 and the sample surface. The invention may further concern a scanning probe microscope having such a probe, and a corresponding scanning probe microscopy method. Since the distance to the sample surface 100 is actually determined by the insulating part 40, controlling the vertical position of the probe 20 relative to the sample surface is easily and rapidly achieved. The configuration of the parts allows for a fast scan of the sample surface, whereby high-speed imaging can be achieved. Further, embodiments allow for topographical variations to be accurately captured through tunneling effect.

摘要翻译： 本发明涉及用于扫描探针显微镜的探针。 探针20包括隧道电流传导部分30和隧道电流绝缘部分40.所述部分被构造成使得绝缘部分确定导电部分30和样品表面之间的最小距离。 本发明还可以涉及具有这种探针的扫描探针显微镜和相应的扫描探针显微镜方法。 由于到达样品表面100的距离实际上由绝缘部件40确定，因此容易且快速地实现了探针20相对于样品表面的垂直位置的控制。 部件的构造允许对样品表面进行快速扫描，由此可以实现高速成像。 此外，实施例允许通过隧道效应准确地捕获地形变化。

公开(公告)号：US20110289636A1

公开(公告)日：2011-11-24

申请号：US13146355

申请日：2010-01-15

申请人： Harish Bhaskaran ,  Michel Despont ,  Abu Sebastian

发明人： Harish Bhaskaran ,  Michel Despont ,  Abu Sebastian

IPC分类号： G01Q60/14

CPC分类号： G01Q60/16

摘要： The invention is directed to a probe for scanning probe microscopy. The probe 20 comprises a tunnel-current conducting part 30 and a tunnel-current insulating part 40. The said parts are configured such that the insulating part determines a minimal distance between the conducting part 30 and the sample surface. The invention may further concern a scanning probe microscope having such a probe, and a corresponding scanning probe microscopy method. Since the distance to the sample surface 100 is actually determined by the insulating part 40, controlling the vertical position of the probe 20 relative to the sample surface is easily and rapidly achieved. The configuration of the parts allows for a fast scan of the sample surface, whereby high-speed imaging can be achieved. Further, embodiments allow for topographical variations to be accurately captured through tunneling effect.

摘要翻译： 本发明涉及用于扫描探针显微镜的探针。 探针20包括隧道电流传导部分30和隧道电流绝缘部分40.所述部分被构造成使得绝缘部分确定导电部分30和样品表面之间的最小距离。 本发明还可以涉及具有这种探针的扫描探针显微镜和相应的扫描探针显微镜方法。 由于到达样品表面100的距离实际上由绝缘部件40确定，因此容易且快速地实现了探针20相对于样品表面的垂直位置的控制。 部件的构造允许对样品表面进行快速扫描，由此可以实现高速成像。 此外，实施例允许通过隧道效应准确地捕获地形变化。

公开(公告)号：US20110269302A1

公开(公告)日：2011-11-03

申请号：US13083057

申请日：2011-04-08

申请人： Harish Bhaskaran ,  Mikael T. Bjoerk ,  Michel Despont ,  Bernd W. Gotsmann ,  Heinz Schmid

发明人： Harish Bhaskaran ,  Mikael T. Bjoerk ,  Michel Despont ,  Bernd W. Gotsmann ,  Heinz Schmid

IPC分类号： H01L21/265

CPC分类号： H01L21/2254 ,  B82Y40/00 ,  H01L21/2253 ,  H01L21/28518 ,  H01L21/324 ,  H01L21/67103

摘要： The invention relates to a method of fabricating a semiconductor device. The method includes: providing a semiconductor substrate and locally heating the semiconductor substrate by using a heated tip structure. Locally heating the semiconductor substrate is carried out to locally modify the electrical properties of the semiconductor substrate. The semiconductor substrate can be implanted with dopants, so that locally heating step causes a local activation of the implanted dopants. Furthermore, the semiconductor substrate can be provided with a dopant layer, so that locally heating step causes dopants to diffuse into the semiconductor substrate.

摘要翻译： 本发明涉及一种制造半导体器件的方法。 该方法包括：提供半导体衬底并通过使用加热的尖端结构局部加热半导体衬底。 进行局部加热半导体衬底以局部改变半导体衬底的电性能。 半导体衬底可以注入掺杂剂，使得局部加热步骤引起注入的掺杂剂的局部激活。 此外，半导体衬底可以设置有掺杂剂层，使得局部加热步骤使掺杂剂扩散到半导体衬底中。

公开(公告)号：US08446070B2

公开(公告)日：2013-05-21

申请号：US13477436

申请日：2012-05-22

申请人： Harish Bhaskaran ,  Michel Despont

发明人： Harish Bhaskaran ,  Michel Despont

IPC分类号： H01L41/04

CPC分类号： B81B3/0021 ,  B81B2201/032 ,  B81B2203/0118 ,  F16K31/004 ,  G02B26/0858 ,  H01G5/18 ,  H01H2057/006 ,  H01L41/094 ,  Y10T137/2213

摘要： A micro-electro-mechanical device includes a substrate; a piezoelectric actuator disposed on the substrate; and an elastic member affixed to the substrate at a first end thereof, and mechanically coupled to the piezoelectric actuator; wherein the elastic member comprises at least one of: a notch, a groove, and a recess.

摘要翻译： 微机电装置包括：基板; 设置在基板上的压电致动器; 以及弹性构件，其在其第一端处固定到所述基板，并且机械地联接到所述压电致动器; 其中所述弹性构件包括凹口，凹槽和凹部中的至少一个。

公开(公告)号：US20120227846A1

公开(公告)日：2012-09-13

申请号：US13477436

申请日：2012-05-22

申请人： Harish Bhaskaran ,  Michel Despont

发明人： Harish Bhaskaran ,  Michel Despont

IPC分类号： F16K31/02 ,  H01L41/04

CPC分类号： B81B3/0021 ,  B81B2201/032 ,  B81B2203/0118 ,  F16K31/004 ,  G02B26/0858 ,  H01G5/18 ,  H01H2057/006 ,  H01L41/094 ,  Y10T137/2213

摘要： A micro-electro-mechanical device includes a substrate; a piezoelectric actuator disposed on the substrate; and an elastic member affixed to the substrate at a first end thereof, and mechanically coupled to the piezoelectric actuator; wherein the elastic member comprises at least one of: a notch, a groove, and a recess.

摘要翻译： 微机电装置包括：基板; 设置在基板上的压电致动器; 以及弹性构件，其在其第一端处固定到所述基板，并且机械地联接到所述压电致动器; 其中所述弹性构件包括凹口，凹槽和凹部中的至少一个。

公开(公告)号：US08222796B2

公开(公告)日：2012-07-17

申请号：US12578619

申请日：2009-10-14

申请人： Harish Bhaskaran ,  Michel Despont

发明人： Harish Bhaskaran ,  Michel Despont

IPC分类号： H01L41/00

CPC分类号： B81B3/0021 ,  B81B2201/032 ,  B81B2203/0118 ,  F16K31/004 ,  G02B26/0858 ,  H01G5/18 ,  H01H2057/006 ,  H01L41/094 ,  Y10T137/2213

摘要： A micro-electro-mechanical device including a substrate with a main surface, a piezoelectric actuator with a first side mechanically coupled to the substrate, an elastic member with a first end mechanically coupled to the substrate, and a transfer member mechanically coupling a second side of the piezoelectric actuator to the elastic member. The piezoelectric actuator is positioned lateral to an unfixed region of the elastic member. The method includes applying a voltage to a piezoelectric actuator altering the piezoelectric actuator's dimension vertical to the main surface of the substrate; and mechanically transferring the alteration to a coupling point of an elastic member.

摘要翻译： 一种微电子机械装置，包括具有主表面的基板，具有机械耦合到所述基板的第一侧的压电致动器，具有机械耦合到所述基板的第一端的弹性构件，以及将第二侧 的压电致动器。 压电致动器位于弹性构件的未固定区域的侧面。 该方法包括向压电致动器施加电压，该压电致动器改变垂直于衬底的主表面的压电致动器的尺寸; 并将所述改变机械地转移到弹性构件的联接点。

公开(公告)号：US20100090565A1

公开(公告)日：2010-04-15

申请号：US12578619

申请日：2009-10-14

申请人： Harish Bhaskaran ,  Michel Despont

发明人： Harish Bhaskaran ,  Michel Despont

IPC分类号： H01L41/00

CPC分类号： B81B3/0021 ,  B81B2201/032 ,  B81B2203/0118 ,  F16K31/004 ,  G02B26/0858 ,  H01G5/18 ,  H01H2057/006 ,  H01L41/094 ,  Y10T137/2213

摘要： A micro-electro-mechanical device including a substrate with a main surface, a piezoelectric actuator with a first side mechanically coupled to the substrate, an elastic member with a first end mechanically coupled to the substrate, and a transfer member mechanically coupling a second side of the piezoelectric actuator to the elastic member. The piezoelectric actuator is positioned lateral to an unfixed region of the elastic member. The method includes applying a voltage to a piezoelectric actuator altering the piezoelectric actuator's dimension vertical to the main surface of the substrate; and mechanically transferring the alteration to a coupling point of an elastic member.

摘要翻译： 一种微电子机械装置，包括具有主表面的基板，具有机械耦合到所述基板的第一侧的压电致动器，具有机械耦合到所述基板的第一端的弹性构件，以及将第二侧 的压电致动器。 压电致动器位于弹性构件的未固定区域的侧面。 该方法包括向压电致动器施加电压，该压电致动器改变垂直于衬底的主表面的压电致动器的尺寸; 并将所述改变机械地转移到弹性构件的联接点。

公开(公告)号：US20090256275A1

公开(公告)日：2009-10-15

申请号：US12100364

申请日：2008-04-09

申请人： Rachel Cannara ,  Bernd W. Gotsmann ,  Urs T. Duerig ,  Harish Bhaskaran ,  Armin W. Knoll

发明人： Rachel Cannara ,  Bernd W. Gotsmann ,  Urs T. Duerig ,  Harish Bhaskaran ,  Armin W. Knoll

IPC分类号： B28B3/00

CPC分类号： G01Q70/00 ,  G01Q80/00 ,  G11B9/1409

摘要： A method of repairing worn or blunt probe tips, attaching a desired tip material, or defining the registry of probe tips relative to planar surface, including: pressing a probe tip or an array of probe tips into a substrate pre-patterned with an array of tip-shaped molds, the molds containing a preceramic material that can bond to the worn probe tips by thermal activation, the substrate having a protective layer that prevents the preceramic material and/or thermally-activated ceramic material from bonding to the substrate; pressing the worn probe tips into the molds while heating the worn probe tips causing the preceramic material to bond to the worn probe tips and form a solid ceramic material; forming an array comprising a plurality of reconstructed probe tips that are sharper or consisting of a different material than the original worn or base probe tips; and reading and/or writing, with the array comprising the plurality of reconstructed probe tips, data that was unreadable and/or unwritable with the original probe tips due to tip shape or lack of registry with a planar pattern.

摘要翻译： 修复磨损或钝的探针尖端，附接期望的尖端材料或相对于平坦表面限定探针尖端的注册表的方法，包括：将探针尖端或探针尖端阵列压入预先图案化的衬底中， 所述模具包含预陶瓷材料，所述预陶瓷材料可以通过热活化与所述磨损的探针末端结合，所述基底具有防止所述预陶瓷材料和/或热活化的陶瓷材料结合到所述基底的保护层; 将磨损的探针尖端压入模具中，同时加热磨损的探针尖端，导致预陶瓷材料结合到磨损的探针尖端并形成固体陶瓷材料; 形成包括多个重建的探针尖端的阵列，所述多个重建的探针尖端比原始磨损或基底探针尖端更尖锐或由不同的材料组成; 以及包括多个重建的探针尖端的阵列的读取和/或写入，由于尖端形状或不具有平面图案的注册而与原始探针尖端不可读和/或不可写的数据。