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    PLATINUM SILICIDE TIP APICES FOR PROBE-BASED TECHNOLOGIES
    1.
    发明申请
    PLATINUM SILICIDE TIP APICES FOR PROBE-BASED TECHNOLOGIES 有权
    用于基于探针的技术的二氧化钛硅胶贴片APICES

    公开(公告)号：US20100077516A1

    公开(公告)日：2010-03-25

    申请号：US12234816

    申请日：2008-09-22

    申请人： Harish Bhaskaran ,  Michel Despont ,  Ute Drechsler ,  Abu Sebastian

    发明人： Harish Bhaskaran ,  Michel Despont ,  Ute Drechsler ,  Abu Sebastian

    IPC分类号： G01N13/16

    CPC分类号： G01Q60/40

    摘要： Tips including a platinum silicide at an apex of a single crystal silicon tip are provided herein. Also, techniques for creating a tip are provided. The techniques include depositing an amount of platinum (Pt) on a single crystal silicon tip, annealing the platinum and single crystal silicon tip to form a platinum silicide, and selectively etching the platinum with respect to the formed platinum silicide.

    摘要翻译： 本文提供了包括单晶硅尖端顶点处的铂硅化物的提示。 此外，提供了用于创建提示的技术。 这些技术包括在单晶硅尖端上沉积一定量的铂（Pt），使铂和单晶硅尖端退火以形成铂硅化物，并相对于形成的铂硅化物选择性地蚀刻铂。

    Microsystem switches
    2.
    发明授权
    Microsystem switches 有权

    公开(公告)号：US07146067B2

    公开(公告)日：2006-12-05

    申请号：US10482828

    申请日：2002-06-07

    申请人： Michel Despont ,  Ute Drechsler ,  Hugo E. Rothuizen ,  Peter Vettiger ,  Roland W. Widmer

    发明人： Michel Despont ,  Ute Drechsler ,  Hugo E. Rothuizen ,  Peter Vettiger ,  Roland W. Widmer

    IPC分类号： G02B6/26 ,  G02B6/42

    CPC分类号： G11C23/00 ,  G02B6/122 ,  G02B6/3514 ,  G02B6/3518 ,  G02B6/3546 ,  G02B6/3576 ,  G02B6/358 ,  H01H1/0036 ,  H01H61/02 ,  H01H2001/0042 ,  H01H2001/0084 ,  H01H2061/006

    摘要： A microsystem switch (1, 20, 25, 30, 33) has a support (2) defining a recess (3), and a flexible bridge (6) is mounted on the support (2) bridging the recess (3). The bridge (6) is shaped so as to hold selectively a concave stable state, in which the bridge bulges into the recess (3), and a convex stable state in which the bridge bulges out of the recess (3). The switch includes an actuator (8, 9; 26, 27) for effecting flexing of the bridge (6) between the stable states, and a switching element (7, 31, 34) is mounted on the bridge (6) such that movement of the bridge between the stable states moves the switching element between an on position and an off position. According to another design, a microsystem switch (40, 55) has a support (41) defining a recess (42), and an elongate torsion member (44) is mounted on the support (41) bridging the recess (42). A flexible bridge (43, 56) is mounted on the support (41) bridging the recess (42) in a direction substantially perpendicular to the torsion member (44). The bridge (43, 56) is connected to the torsion member (44) at the cross-point thereof so that a first section of the bridge extends between the cross-point and one side of the recess (42) and a second section of the bridge extends between the cross-point and the opposite side of the recess (42). The bridge (43, 56) is shaped so as to hold selectively a first stable state, in which the first section of the bridge bulges into the recess and the second section of the bridge bulges out of the recess, and a second stable state in which this configuration is reversed. A switching element (45) is mounted at the cross-point of the bridge (43, 56) and torsion member (44), and an actuator (46a, 46b; 58a, 58b) is again provided for effecting flexing of the bridge (43, 56) between the stable states. Here, movement of the bridge (43, 56) between the stable states effects twisting of the torsion member (44) and rotation of the switching element (45) between an on position and an off position. Switching devices incorporating these switches, and switching apparatus comprising arrays of such switching devices, are also provided.

    Multilayer microfluidic probe head and method of fabrication thereof
    6.
    发明授权
    Multilayer microfluidic probe head and method of fabrication thereof 有权
    多层微流体探针头及其制造方法

    公开(公告)号：US08695639B2

    公开(公告)日：2014-04-15

    申请号：US13318675

    申请日：2010-05-07

    申请人： Emmanuel Delamarche ,  Ute Drechsler ,  Robert Lovchik

    发明人： Emmanuel Delamarche ,  Ute Drechsler ,  Robert Lovchik

    IPC分类号： F15C1/06

    CPC分类号： B01J19/0046 ,  B01J2219/00367 ,  B01J2219/00527 ,  B01J2219/00743 ,  B01L3/0241 ,  B01L3/502707 ,  B01L2300/0874 ,  B01L2300/0887 ,  Y10T29/494 ,  Y10T137/0318 ,  Y10T137/0402 ,  Y10T137/2224 ,  Y10T137/8359 ,  Y10T137/8593 ,  Y10T137/87153 ,  Y10T137/87885

    摘要： A micro fluidic probe head includes a first layer, a second layer, and a first tubing port extending from an upper face of the first layer. The first layer has a first via, enabling fluid communication between the first port and a lower face of the first layer. The second layer includes a first aperture on a face, and a first microchannel enabling fluid communication between an upper face of the second layer, facing the lower face of the first layer, and the first aperture. The head enables fluid communication between the first via and the first microchannel. At least a portion of the first microchannel is a groove open on the upper face of the second layer, closed by a portion of a lower face of a layer of the head. The probe head further comprises a second tubing port, a second via, a second aperture and a second micro channel.

    摘要翻译： 微流体探针头包括从第一层的上表面延伸的第一层，第二层和第一管口。 第一层具有第一通孔，使得能够在第一端口和第一层的下表面之间进行流体连通。 第二层包括面上的第一孔，以及第一微通道，其使第二层的上表面与第一层的下表面和第一孔之间能够流体连通。 头部使得第一通孔和第一微通道之间能够流体连通。 第一微通道的至少一部分是在第二层的上表面上开口的凹槽，由头部的一层的下表面的一部分封闭。 探头还包括第二管口，第二通孔，第二孔和第二微通道。

    MULTILAYER MICROFLUIDIC PROBE HEAD AND METHOD OF FABRICATION THEREOF
    8.
    发明申请
    MULTILAYER MICROFLUIDIC PROBE HEAD AND METHOD OF FABRICATION THEREOF 有权
    多层微流体探头及其制造方法

    公开(公告)号：US20120048391A1

    公开(公告)日：2012-03-01

    申请号：US13318675

    申请日：2010-05-07

    申请人： Emmanuel Delamarche ,  Ute Drechsler ,  Robert Lovchik

    发明人： Emmanuel Delamarche ,  Ute Drechsler ,  Robert Lovchik

    IPC分类号： B23P11/00 ,  F03B11/02

    CPC分类号： B01J19/0046 ,  B01J2219/00367 ,  B01J2219/00527 ,  B01J2219/00743 ,  B01L3/0241 ,  B01L3/502707 ,  B01L2300/0874 ,  B01L2300/0887 ,  Y10T29/494 ,  Y10T137/0318 ,  Y10T137/0402 ,  Y10T137/2224 ,  Y10T137/8359 ,  Y10T137/8593 ,  Y10T137/87153 ,  Y10T137/87885

    摘要： A micro fluidic probe head includes a first layer, a second layer, and a first tubing port extending from an upper face of the first layer. The first layer has a first via, enabling fluid communication between the first port and a lower face of the first layer. The second layer includes a first aperture on a face, and a first microchannel enabling fluid communication between an upper face of the second layer, facing the lower face of the first layer, and the first aperture. The head enables fluid communication between the first via and the first microchannel. At least a portion of the first microchannel is a groove open on the upper face of the second layer, closed by a portion of a lower face of a layer of the head. The probe head further comprises a second tubing port, a second via, a second aperture and a second micro channel.

    摘要翻译： 微流体探针头包括从第一层的上表面延伸的第一层，第二层和第一管口。 第一层具有第一通孔，使得能够在第一端口和第一层的下表面之间进行流体连通。 第二层包括面上的第一孔，以及第一微通道，其使第二层的上表面与第一层的下表面和第一孔之间能够流体连通。 头部使得第一通孔和第一微通道之间能够流体连通。 第一微通道的至少一部分是在第二层的上表面上开口的凹槽，由头部的一层的下表面的一部分封闭。 探头还包括第二管口，第二通孔，第二孔和第二微通道。

    Three-dimensional integrated CMOS-MEMS device and process for making the same
    9.
    发明授权
    Three-dimensional integrated CMOS-MEMS device and process for making the same 有权
    三维集成CMOS-MEMS器件及其制造方法

    公开(公告)号：US07071031B2

    公开(公告)日：2006-07-04

    申请号：US10446461

    申请日：2003-05-28

    申请人： H. Bernhard Pogge ,  Michel Despont ,  Ute Drechsler ,  Peter Vettiger ,  Roy Yu

    发明人： H. Bernhard Pogge ,  Michel Despont ,  Ute Drechsler ,  Peter Vettiger ,  Roy Yu

    IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

    CPC分类号： B81C1/00238 ,  B81B2203/0307 ,  H01L21/76898 ,  H01L2224/16225

    摘要： A vertically integrated structure includes a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS. The structure includes a metal stud connecting a surface of the chip and the MEMS; the MEMS has an anchor portion having a conducting pad on an underside thereof contacting the metal stud. The MEMS is spaced from the chip by a distance corresponding to a height of the metal stud, and the MEMS includes a doped region in contact with the conducting pad. In particular, the MEMS may include a cantilever structure, with the end portion including a tip extending in the vertical direction. A support structure (e.g. of polyimide) may surround the metal stud and contact both the underside of the MEMS and the surface of the chip. A temporary carrier plate is used to facilitate handling of the MEMS and alignment to the chip.

    摘要翻译： 垂直集成的结构包括微机电系统（MEMS）和用于将信号传递到MEMS的芯片。 该结构包括连接芯片表面和MEMS的金属螺柱; MEMS具有在其下侧具有接触金属螺柱的导电垫的锚固部分。 MEMS与芯片间隔一定距离对应于金属螺柱的高度，并且MEMS包括与导电焊盘接触的掺杂区域。 特别地，MEMS可以包括悬臂结构，其中端部包括在垂直方向上延伸的尖端。 支撑结构（例如聚酰亚胺）可以围绕金属螺柱并且接触MEMS的下侧和芯片的表面。 使用临时载体板来促进MEMS的处理和与芯片的对准。