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公开(公告)号：US20090102061A1
公开(公告)日：2009-04-23
申请号：US12324289
申请日：2008-11-26
IPC分类号： H01L25/065
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/82 , H01L25/0655 , H01L25/50 , H01L2221/68345 , H01L2224/04105 , H01L2224/24137 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/15787 , H01L2924/30105 , H01L2924/00
摘要： A polymer-based, self-aligned wafer-level heterogeneous integration system, SAWLIT, for integrating semiconductor integrated circuit (IC) chips to a substrate is presented. The system includes a method including preparing a substrate, flipping the substrate onto a polymer-based flat surface and securing the substrate to the flat surface, mounting semiconductor chips into the prepared substrate, integrating the chips to the substrate with another polymer-based material, and removing the resulting multi-chip module from the flat surface. The chips may then be connected with each other and regions off the multi-chip module with metal interconnect processing technology.A multi-chip module prepared by the polymer-based, self-aligned heterogeneous integration system including semiconductor chips mounted in a prepared substrate. The chips may be connected to the substrate by a polymer-based integrating material.
摘要翻译： 提出了一种用于将半导体集成电路（IC）芯片集成到衬底的基于聚合物的自对准晶片级异构集成系统（SAWLIT）。 该系统包括一种方法，包括制备基板，将基板翻转到基于聚合物的平坦表面上并将基板固定到平坦表面上，将半导体芯片安装到制备的基板中，将芯片与另一种聚合物基材料集成到基板上， 并从平坦表面移除所得到的多芯片模块。 然后可以利用金属互连处理技术将芯片彼此连接并且将多个芯片模块的区域连接。 通过基于聚合物的自对准异相集成系统制备的多芯片模块，其包括安装在制备的基板中的半导体芯片。 芯片可以通过基于聚合物的一体化材料连接到基板。
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2.发明申请公开(公告)号：US20080309567A1
公开(公告)日：2008-12-18
申请号：US11764060
申请日：2007-06-15
CPC分类号： H01Q21/28 , H01Q1/2241 , H01Q9/0421 , H01Q13/22
摘要： An antenna assembly that has particular application for a hand held reader that interrogates sensors embedded within a vehicle tire, such as RFID sensors and tire pressure sensors. In one embodiment, the antenna assembly includes a first antenna operating in the 432-435 MHz range that employs a meander-line slot that provides increased antenna cross-polarization so that the sensor can be interrogated regardless of the antenna orientation and polarization. The antenna assembly also includes two RFID antennas that operate in the 902-928 MHz range that are planar antenna that make the antenna bi-directional, polarization free and a wide enough bandwidth for the RFID interrogation.
摘要翻译： 一种天线组件，其特别适用于用于询问嵌入在车辆轮胎内的传感器的手持读取器，例如RFID传感器和轮胎压力传感器。 在一个实施例中，天线组件包括以432-435MHz范围工作的第一天线，该第一天线采用提供增加的天线交叉极化的曲折线槽，使得无论天线取向和极化如何，可以询问传感器。 天线组件还包括在902-928MHz范围内工作的两个RFID天线，其是平面天线，其使天线双向，无偏振，并且具有足够宽的带宽用于RFID询问。
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公开(公告)号：US20080309545A1
公开(公告)日：2008-12-18
申请号：US11764070
申请日：2007-06-15
IPC分类号： G01S13/02
CPC分类号： G01S7/03 , G01S13/58 , H01Q19/065
摘要： A speed measuring device that employs a Fresnel zone plate lens antenna. The Fresnel lens antenna is mounted to one end of a low profile collection housing, typically cylindrical in configuration. An opposite end of the collection housing includes a back plate having an opening. A transceiver unit is mounted to the outside surface of the back plate so that a transmitter and a detector within the transceiver are in communication with the opening. A signal is transmitted from the transceiver unit through the opening, and is directed by the lens antenna. A reflected signal is received and focused by the lens antenna, and collected by the housing to be directed through the opening to the transceiver.
摘要翻译： 一种采用菲涅耳带状透镜天线的速度测量装置。 菲涅耳透镜天线安装在通常为圆柱形的低剖面收集壳体的一端。 收集壳体的另一端包括具有开口的背板。 收发器单元安装到背板的外表面，使得收发器内的发射器和检测器与开口连通。 信号从收发器单元通过开口传输，并由透镜天线引导。 反射信号被透镜天线接收和聚焦，并由壳体收集以被引导通过开口到收发器。
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公开(公告)号：US20090246929A1
公开(公告)日：2009-10-01
申请号：US12056780
申请日：2008-03-27
IPC分类号： H01L21/20
摘要： A method for micro-machining a varactor that is part of a membrane suspended MEMS tunable filter. In one non-limiting embodiment, the method includes providing a main substrate; depositing a membrane on the main substrate; depositing and patterning a plurality of sacrificial photoresist layers at predetermined times during the fabrication of the varactor; depositing metal layers that define a fabricated varactor structure enclosed within photoresist; coupling a carrier substrate to the fabricated structure opposite to the main substrate using a release layer; etching a central portion of the main substrate to expose the membrane; removing the carrier substrate by dissolving the release layer in a material that attacks the release layer but does not dissolve the photoresist; and removing the photoresist layers to provide a released varactor.
摘要翻译： 一种用于微机械加工可变电抗器的方法，该变容二极管是膜悬浮的MEMS可调滤波器的一部分。 在一个非限制性实施例中，该方法包括提供主衬底; 在主衬底上沉积膜; 在制造变容二极管期间的预定时间沉积和图案化多个牺牲光致抗蚀剂层; 沉积限定在光致抗蚀剂内包围的制造的变容二极管结构的金属层; 使用剥离层将载体衬底耦合到与主衬底相对的制造结构; 蚀刻主衬底的中心部分以暴露膜; 通过将剥离层溶解在攻击剥离层但不溶解光致抗蚀剂的材料中去除载体基材; 并去除光致抗蚀剂层以提供释放的变容二极管。
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公开(公告)号：US20080252401A1
公开(公告)日：2008-10-16
申请号：US11735269
申请日：2007-04-13
IPC分类号： H01P1/219
CPC分类号： H01P1/219
摘要： An evanescent mode resonator including a cavity formed in a substrate of semiconductor material. The resonator includes a capacitive post positioned within the cavity, and a tuning element positioned within the wall of the cavity proximate to the capacitive post, where a gap between the flexible element and the post sets the tuning of the resonator.
摘要翻译： 包括形成在半导体材料的衬底中的空腔的消逝模式谐振器。 所述谐振器包括位于所述空腔内的电容柱，以及调谐元件，所述调谐元件位于靠近所述电容柱的所述腔的壁内，其中所述柔性元件和所述柱之间的间隙设定所述谐振器的调谐。
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