公开(公告)号：US07380698B2

公开(公告)日：2008-06-03

申请号：US10394601

申请日：2003-03-21

申请人： Heinrich Meyer ,  Konrad Crämer ,  Olaf Kurtz ,  Ralph Herber ,  Wolfgang Friz ,  Carsten Schwiekendick ,  Oliver Ringtunatus ,  Christian Madry

发明人： Heinrich Meyer ,  Konrad Crämer ,  Olaf Kurtz ,  Ralph Herber ,  Wolfgang Friz ,  Carsten Schwiekendick ,  Oliver Ringtunatus ,  Christian Madry

IPC分类号： B23K31/02

CPC分类号： B23K1/20 ,  B23K1/0012 ,  B23K35/001 ,  B23K35/002 ,  B23K35/0222 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/28 ,  B23K35/282 ,  B23K35/286 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/3053 ,  B23K35/3066 ,  B23K35/36 ,  B23K2103/04 ,  B23K2103/10 ,  B23K2103/12 ,  F28F2260/02

摘要： A method for joining microstructured component layers and a method for manufacturing microstructure component layers and the microstructure component layer is provided. At least one multifunctional barrier coating is applied to the joining surfaces of a base material layer for the microstructured component layers. The layers are made of aluminum/aluminum alloys and/or copper/copper alloys, and/or noble steels. At least one solder/brazing coating is applied to each barrier coating. The coated base material layers comprising the component layers are stacked. The stacked component layers are joined by solder/brazing using heat. The melting temperature of the solder/brazing coating is higher after the heat joining than before same.

摘要翻译： 提供一种连接微结构化组分层的方法和用于制造微结构组分层和微结构组分层的方法。 至少一个多功能阻挡涂层施加到用于微结构化组分层的基材层的接合表面。 这些层由铝/铝合金和/或铜/铜合金和/或贵金属钢制成。 至少一个焊料/钎焊涂层施加到每个阻挡涂层。 包含组分层的被覆基材层被堆叠。 堆叠的组件层通过焊接/钎焊加热连接。 焊接/钎焊涂层的熔化温度比热熔接后高。

公开(公告)号：US08042726B2

公开(公告)日：2011-10-25

申请号：US12307939

申请日：2007-08-02

申请人： Ralph Herber ,  Olaf Kurtz ,  Johannes Etzkorn ,  Christian Madry ,  Carsten Schwiekendick ,  Gerd Schafer

发明人： Ralph Herber ,  Olaf Kurtz ,  Johannes Etzkorn ,  Christian Madry ,  Carsten Schwiekendick ,  Gerd Schafer

IPC分类号： B23K31/02 ,  B23K35/24

CPC分类号： B23K20/233 ,  B23K20/023 ,  B23K20/227 ,  B23K2101/045 ,  B23K2101/14 ,  B23K2101/185 ,  B23K2103/05 ,  B23K2103/26 ,  B81C3/001 ,  B81C2203/035 ,  F28D9/00 ,  F28F2260/02 ,  Y10T428/12646

摘要： To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of said at least two work pieces by chemical or electrolytic metal plating method; the metal bonding layer being a nickel/phosphorous alloy having a prescribed phosphorous content and prescribed thickness; forming a bonding arrangement comprising said work pieces so that there is at least one metal bonding layer between said at least two respective work pieces; heating at a prescribed heating rate to a temperature above the melting temperature of the bonding layer; bonding the two work pieces by applying contact pressure within a prescribed range; and cooling at a prescribed rate.

摘要翻译： 为了形成适于生产由多个单独层制成的微结构部件的高性能接合连接，通过该步骤进行接合; 提供至少两个工件; 通过化学或电解金属电镀方法在所述至少两个工件中的至少一个的至少一侧上形成金属粘合层; 金属接合层是具有规定的磷含量和规定厚度的镍/磷合金; 形成包括所述工件的接合装置，使得在所述至少两个相应的工件之间存在至少一个金属结合层; 以规定的加热速度加热到高于接合层的熔融温度的温度; 通过施加规定范围内的接触压力来接合两个工件; 并以规定的速度冷却。

公开(公告)号：US20090202858A1

公开(公告)日：2009-08-13

申请号：US12307939

申请日：2007-08-02

申请人： Ralph Herber ,  Olaf Kurtz ,  Johannes Etzkorn ,  Christian Madry ,  Carsten Schwiekendick ,  Gerd Schäfer

发明人： Ralph Herber ,  Olaf Kurtz ,  Johannes Etzkorn ,  Christian Madry ,  Carsten Schwiekendick ,  Gerd Schäfer

IPC分类号： B32B15/18 ,  B23K31/02

CPC分类号： B23K20/233 ,  B23K20/023 ,  B23K20/227 ,  B23K2101/045 ,  B23K2101/14 ,  B23K2101/185 ,  B23K2103/05 ,  B23K2103/26 ,  B81C3/001 ,  B81C2203/035 ,  F28D9/00 ,  F28F2260/02 ,  Y10T428/12646

摘要： To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of said at least two work pieces by chemical or electrolytic metal plating method; the metal bonding layer being a nickel/phosphorous alloy having a prescribed phosphorous content and prescribed thickness; forming a bonding arrangement comprising said work pieces so that there is at least one metal bonding layer between said at least two respective work pieces; heating at a prescribed heating rate to a temperature above the melting temperature of the bonding layer; bonding the two work pieces by applying contact pressure within a prescribed range; and cooling at a prescribed rate.

摘要翻译： 为了形成适于生产由多个单独层制成的微结构部件的高性能接合连接，通过该步骤进行接合; 提供至少两个工件; 通过化学或电解金属电镀方法在所述至少两个工件中的至少一个的至少一侧上形成金属粘合层; 金属接合层是具有规定的磷含量和规定厚度的镍/磷合金; 形成包括所述工件的接合装置，使得在所述至少两个相应的工件之间存在至少一个金属结合层; 以规定的加热速度加热到高于接合层的熔融温度的温度; 通过施加规定范围内的接触压力来接合两个工件; 并以规定的速度冷却。