METHOD OF FORMING SOURCE AND DRAIN OF FIELD-EFFECT-TRANSISTOR AND STRUCTURE THEREOF
    1.
    发明申请
    METHOD OF FORMING SOURCE AND DRAIN OF FIELD-EFFECT-TRANSISTOR AND STRUCTURE THEREOF 失效
    形成源和场效应晶体管的方法及其结构

    公开(公告)号:US20080166847A1

    公开(公告)日:2008-07-10

    申请号:US11763561

    申请日:2007-06-15

    IPC分类号: H01L21/336

    摘要: Embodiments of the invention provide a method of forming a field-effect-transistor (FET). The method includes implanting one or more n-type dopants to create one or more implanted regions with at least a portion of the implanted regions being designated as regions for forming source and drain extensions of the FET; activating the implanted regions; etching with a chlorine based etchant to create openings in the implanted regions, and forming the source and drain extensions by exptaxially growing embedded silicon germanium in the openings. Structure of a semiconductor field-effect-transistor made thereof is also provided.

    摘要翻译: 本发明的实施例提供了形成场效应晶体管(FET)的方法。 该方法包括:注入一个或多个n型掺杂剂以产生一个或多个注入区,其中至少一部分注入区被指定为用于形成FET的源极和漏极扩展的区域; 激活植入区域; 用氯气蚀刻剂蚀刻以在注入区域中形成开口,以及通过在开口中外延生长嵌入式硅锗形成源极和漏极延伸部分。 还提供了由其制成的半导体场效应晶体管的结构。

    Method of forming source and drain of field-effect-transistor and structure thereof
    2.
    发明授权
    Method of forming source and drain of field-effect-transistor and structure thereof 失效
    形成场效应晶体管的源极和漏极的方法及其结构

    公开(公告)号:US08138053B2

    公开(公告)日:2012-03-20

    申请号:US11763561

    申请日:2007-06-15

    IPC分类号: H01L21/336

    摘要: Embodiments of the invention provide a method of forming a field-effect-transistor (FET). The method includes implanting one or more n-type dopants to create one or more implanted regions with at least a portion of the implanted regions being designated as regions for forming source and drain extensions of the FET; activating the implanted regions; etching with a chlorine based etchant to create openings in the implanted regions, and forming the source and drain extensions by exptaxially growing embedded silicon germanium in the openings. Structure of a semiconductor field-effect-transistor made thereof is also provided.

    摘要翻译: 本发明的实施例提供了形成场效应晶体管(FET)的方法。 该方法包括:注入一个或多个n型掺杂剂以产生一个或多个注入区,其中至少一部分注入区被指定为用于形成FET的源极和漏极扩展的区域; 激活植入区域; 用氯气蚀刻剂蚀刻以在注入区域中形成开口,以及通过在开口中外延生长嵌入式硅锗形成源极和漏极延伸部分。 还提供了由其制成的半导体场效应晶体管的结构。

    Capacitor top plate over source/drain to form a 1T memory device
    4.
    发明授权
    Capacitor top plate over source/drain to form a 1T memory device 有权
    源极/漏极上的电容器顶板形成1T存储器件

    公开(公告)号:US08716081B2

    公开(公告)日:2014-05-06

    申请号:US11686475

    申请日:2007-03-15

    IPC分类号: H01L29/76

    摘要: A method and structure for a memory device, such as a 1T-SRAM, having a capacitor top plate directly over a doped bottom plate region. An example device comprises the following. An isolation film formed as to surround an active area on a substrate. A gate dielectric and gate electrode formed over a portion of the active area. A source element and a drain element in the substrate adjacent to the gate electrode. The drain element is comprised of a drain region and a bottom plate region. The drain region is between the bottom plate region and the gate structure. A capacitor dielectric and a capacitor top plate are over at least portions of the bottom plate region.

    摘要翻译: 用于诸如1T-SRAM的存储器件的方法和结构,其具有直接在掺杂底板区域上方的电容器顶板。 示例设备包括以下。 形成为围绕衬底上的有源区域的隔离膜。 形成在有源区域的一部分上的栅极电介质和栅电极。 与栅电极相邻的衬底中的源极元件和漏极元件。 漏极元件由漏区和底板区组成。 漏极区域位于底板区域和栅极结构之间。 电容器电介质和电容器顶板在底板区域的至少部分上方。