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1.发明申请公开(公告)号：US20190201699A1
公开(公告)日：2019-07-04
申请号：US16233427
申请日：2018-12-27
CPC分类号： A61N1/3754
摘要： One aspect relates to an electrical contacting device for a medical implantable device, including an electrically insulating base body with a first and a second surface. The base body includes a ceramics, an electrically conductive conducting element that extends from the first surface of the base body through the base body. The conducting element includes a cermet and is connected to the ceramics of the base body in firmly bonded manner through a sintered connection, a contact element including a metal. The contact element is connected to the conducting element in electrically conductive manner and can be connected to an electrically conductive structure. The contacting device includes an adhesion element. The adhesion element is connected to the contact element in firmly bonded manner and wherein the adhesion element includes an adhesion promoter in order to form a firmly bonded connection at least to the first surface of the base body.
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2.发明申请公开(公告)号：US20180228943A1
公开(公告)日：2018-08-16
申请号：US15897246
申请日：2018-02-15
发明人： Jens Trötzschel , Detlef Gaiser , Stefan Schibli
IPC分类号： A61L31/12 , B33Y30/00 , B33Y70/00 , B33Y10/00 , B33Y80/00 , A61L31/06 , A61L29/06 , A61L27/34 , A61L27/44 , A61L29/12 , C09D183/04
CPC分类号： A61L31/126 , A61L27/34 , A61L27/443 , A61L29/06 , A61L29/126 , A61L31/06 , A61L2420/04 , A61L2420/06 , A61L2420/08 , B29C64/153 , B29C64/165 , B29C64/205 , B29C64/264 , B32B27/00 , B33Y10/00 , B33Y30/00 , B33Y70/00 , B33Y80/00 , C09D183/04 , H01B1/22 , H01B1/24
摘要： The invention relates to a composite (100), containing as mutually superimposed layers of a series of layers a) a substrate (101), and b) a first layer (102); wherein the first layer (102) contains i) a first layer surface (103), ii) a polymer, and iii) a plurality of electrically conductive particles; wherein the first layer surface (103) is adjacent to the substrate (101); wherein at least in a first region, (104) the first layer (102) at a first distance (105) from the first layer surface (103) is characterized by a first content (403) of the electrically conductive particles; wherein at least in the first region (104), the first layer (102) at a further distance (106) from the first layer surface (103) is characterized by a further content of the electrically conductive particles; wherein the first content is less than the further content; and wherein the first distance (105) is less than the further distance (106). The invention further relates to an apparatus (600), a method (800), an electrical component (1200), an electrical device (1201), a 3D printer (1100) and a use.
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公开(公告)号：US11806142B2
公开(公告)日：2023-11-07
申请号：US17117890
申请日：2020-12-10
发明人： Stefan Schibli , Robert Sievi , David Meder , Andreas Reisinger , Jens Trötzschel , Anna Fuchs , Heiko Specht
IPC分类号： A61B5/1486 , C23C18/06 , C23C18/08 , A61B5/145
CPC分类号： A61B5/14865 , C23C18/06 , C23C18/08 , A61B5/14532 , A61B2562/125
摘要： One aspect relates to a method for the manufacture of a medical electrode, including: (i) providing a substrate; (ii) applying a composition onto the substrate, wherein the composition comprises (a) a non-aqueous solvent and (b) an organic precious metal complex compound that is dissolved in the solvent; (iii) heating the composition and thereby forming a precious metal layer on the substrate, wherein the solubility of the organic precious metal complex compound in propylene glycol mono-propyl ether at 25° C. and 1013 hPa is at least 1 mass percent, or at least 2, 3, 4, 5 or 10 mass percent, in relation to the total mass of the composition.
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4.发明授权公开(公告)号：US10881866B2
公开(公告)日：2021-01-05
申请号：US16233427
申请日：2018-12-27
摘要： One aspect relates to an electrical contacting device for a medical implantable device, including an electrically insulating base body with a first and a second surface. The base body includes a ceramics, an electrically conductive conducting element that extends from the first surface of the base body through the base body. The conducting element includes a cermet and is connected to the ceramics of the base body in firmly bonded manner through a sintered connection, a contact element including a metal. The contact element is connected to the conducting element in electrically conductive manner and can be connected to an electrically conductive structure. The contacting device includes an adhesion element. The adhesion element is connected to the contact element in firmly bonded manner and wherein the adhesion element includes an adhesion promoter in order to form a firmly bonded connection at least to the first surface of the base body.
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公开(公告)号：US10413639B2
公开(公告)日：2019-09-17
申请号：US16151821
申请日：2018-10-04
发明人： Robert Dittmer , Ulrich Hausch , Jens Trötzschel , Peter Herzog , Josef Roth
摘要： One aspect relates to a composite, including a ceramic body having a first layer surface and a second layer surface and at least one cermet conductor that electrically connects the surfaces. The composite includes a first layer with the first layer surface, a first ceramic, a first hole and a first cermet element in the first hole, a second layer with the second layer surface, a second ceramic, a second hole and a second cermet element in the second hole, and an intermediate layer that is located between the first and the second layer. The intermediate layer includes an intermediate layer ceramic, an intermediate hole and one intermediate cermet element in the intermediate hole. A projection of the cross-section of the first hole and a projection of the cross section of the second hole onto a plane Px,y are arranged offset to each other.
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公开(公告)号：US11944830B2
公开(公告)日：2024-04-02
申请号：US17240430
申请日：2021-04-26
CPC分类号： A61N1/3754 , H01B17/303 , H01R13/5224 , H01L23/481 , H01R2201/12
摘要： One aspect is a feedthrough system including a) a feedthrough including i) an insulating body, ii) an electrically conductive pathway, wherein an end of the electrically conductive pathway is level with a surface of the insulating body, iii) an electrically conductive pad, wherein the electrically conductive pad is attached to the level end of the electrically conductive pathway, b) an electrical contact element including a metal, wherein the electrical contact element is attached to the level end of the electrically conductive pathway by a joint microstructure, or wherein, when the feedthrough includes an electrically conductive pad, the electrical contact element is attached to the electrically conductive pad by a joint microstructure. Furthermore, the present embodiment refers to a process for preparing the inventive feedthrough system, and to a device including the inventive feedthrough system.
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