公开(公告)号：US20170154863A1

公开(公告)日：2017-06-01

申请号：US15320492

申请日：2015-06-17

申请人： Heraeus Deutschland GmbH & Co. KG

发明人： Murali SARANGAPANI ,  Xi ZHANG ,  Ping Ha YEUNG ,  Eugen MILKE

IPC分类号： H01L23/00 ,  C22F1/08 ,  B21C1/02 ,  C22C9/00

CPC分类号： H01L24/45 ,  B21C1/003 ,  B21C1/02 ,  C22C9/00 ,  C22F1/08 ,  H01L24/43 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/43985 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45686 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0541 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/01204 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2924/00015

摘要： A copper wire having a diameter of 10 to 80 μm is provided. The copper wire bulk material is ≧99.99 wt.-% pure copper or a copper alloy consisting of 10 to 1000 wt.-ppm of silver and/or of 0.1 to 3 wt.-% of palladium with copper as the remainder to make up 100 wt.-%, and the copper wire has a 0.5 to