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1.发明授权Method of producing a cermet-containing bushing for an implantable medical device 有权生产用于可植入医疗装置的含金属陶瓷套管的方法公开(公告)号：US09480168B2
公开(公告)日：2016-10-25
申请号：US14171275
申请日：2014-02-03
发明人： Jens Troetzschel , Heiko Specht
CPC分类号： H01B17/306 , A61N1/3754 , H01B13/0036 , H01B19/00 , H05K3/30 , Y10T29/4913
摘要： One aspect relates to a method for producing an electrical bushing for an implantable medical device. The method includes generating an insulation element green compact for an insulation element from an insulating composition of materials. The insulation element green compact is partially sintered. At least one cermet-containing conduction element green compact for a conduction element is formed. The at least one conduction element green compact is introduced into the insulation element green compact. The insulation element green compact and the at least one conduction element green compact are fired to obtain an insulation element with at least one conduction element.
摘要翻译： 一个方面涉及一种用于生产用于可植入医疗装置的电气套管的方法。 该方法包括从绝缘材料组合物产生用于绝缘元件的绝缘元件生坯。 绝缘元件生坯被部分烧结。 形成用于导电元件的至少一个含金属陶瓷的导电元件绿色压块。 将至少一个导电元件绿色压块引入绝缘元件绿色压块中。 烧结绝缘元件绿色压块和至少一个导电元件压坯以获得具有至少一个导电元件的绝缘元件。
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公开(公告)号：US09498142B2
公开(公告)日：2016-11-22
申请号：US14323163
申请日：2014-07-03
发明人： Jami A. Hafiz , Stefan Schibli , Jens Troetzschel
IPC分类号： A61N1/05 , A61B5/04 , H01B7/04 , H01B1/12 , H01B3/30 , A61B5/00 , B21F19/00 , H01L51/00 , A61M25/09
CPC分类号： A61B5/04 , A61B5/0422 , A61B5/6846 , A61B5/6851 , A61B2562/046 , A61B2562/125 , A61M2025/09108 , A61N1/05 , B21F19/00 , C08G2261/1424 , C08G2261/3223 , C08G2261/51 , C08G2261/65 , C08G2261/70 , C08G2261/79 , C08G2261/90 , H01B1/127 , H01B1/128 , H01B3/307 , H01B7/048 , H01L51/0037
摘要： One aspect relates to a method for producing a layered structure, including providing a substrate, forming a first layer onto at least part of the substrate, the first layer being a first polymer, and forming a second layer onto at least part of the first layer, the second layer being a second polymer. The substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive. Forming each of the first and second layers includes forming such that each layer is no more than one tenth of the thickness of the substrate.
摘要翻译： 一个方面涉及一种用于制造层状结构的方法，包括提供基底，在所述基底的至少一部分上形成第一层，所述第一层是第一聚合物，以及在所述第一层的至少一部分上形成第二层 ，第二层是第二聚合物。 衬底和第二层是导电的，并且第一层是绝缘的，或者衬底和第二层是绝缘的，并且第一层是导电的。 形成第一和第二层中的每一个包括形成使得每个层不超过衬底的厚度的十分之一。
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公开(公告)号：US20160005509A1
公开(公告)日：2016-01-07
申请号：US14323163
申请日：2014-07-03
发明人： Jami A. Hafiz , Stefan Schibli , Jens Troetzschel
CPC分类号： A61B5/04 , A61B5/0422 , A61B5/6846 , A61B5/6851 , A61B2562/046 , A61B2562/125 , A61M2025/09108 , A61N1/05 , B21F19/00 , C08G2261/1424 , C08G2261/3223 , C08G2261/51 , C08G2261/65 , C08G2261/70 , C08G2261/79 , C08G2261/90 , H01B1/127 , H01B1/128 , H01B3/307 , H01B7/048 , H01L51/0037
摘要： One aspect relates to a method for producing a layered structure, including providing a substrate, forming a first layer onto at least part of the substrate, the first layer being a first polymer, and forming a second layer onto at least part of the first layer, the second layer being a second polymer. The substrate and the second layer are electrically conductive and the first layer is insulating or the substrate and the second layer are insulating and the first layer is electrically conductive. Forming each of the first and second layers includes forming such that each layer is no more than one tenth of the thickness of the substrate.
摘要翻译： 一个方面涉及一种用于制造层状结构的方法，包括提供基底，在所述基底的至少一部分上形成第一层，所述第一层是第一聚合物，以及在所述第一层的至少一部分上形成第二层 ，第二层是第二聚合物。 衬底和第二层是导电的，并且第一层是绝缘的，或者衬底和第二层是绝缘的，并且第一层是导电的。 形成第一和第二层中的每一个包括形成使得每个层不超过衬底的厚度的十分之一。
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公开(公告)号：US08886320B2
公开(公告)日：2014-11-11
申请号：US13942685
申请日：2013-07-15
CPC分类号： H02G3/02 , A61F2/02 , A61N1/3754 , B28B1/00 , H01R43/00 , H02G3/18 , Y10T29/49117
摘要： One aspect relates to an electrical bushing for an implantable device including an electrically insulating base body and at least one electrically conductive bushing body that is embedded in at least one bushing opening that extends through the base body. The base body is produced from a sintered ceramic material, characterized in that the at least one bushing body is made of a sintered cermet material or a sintered metallic material. The base body and the at least one bushing body comprise a firmly bonded sintered connection.
摘要翻译： 一个方面涉及一种用于可植入装置的电气套管，其包括电绝缘基体和至少一个导电衬套主体，其嵌入延伸穿过基体的至少一个衬套开口中。 基体由烧结陶瓷材料制成，其特征在于，所述至少一个衬套主体由金属陶瓷烧结材料或烧结金属材料制成。 基体和至少一个衬套主体包括牢固结合的烧结连接。
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5.发明申请METHOD OF PRODUCING A CERMET-CONTAINING BUSHING FOR AN IMPLANTABLE MEDICAL DEVICE 有权生产用于可植入医疗装置的含盖牙刷的方法公开(公告)号：US20140144014A1
公开(公告)日：2014-05-29
申请号：US14171275
申请日：2014-02-03
发明人： Jens Troetzschel , Heiko Specht
IPC分类号： H05K3/30
CPC分类号： H01B17/306 , A61N1/3754 , H01B13/0036 , H01B19/00 , H05K3/30 , Y10T29/4913
摘要： One aspect relates to a method for producing an electrical bushing for an implantable medical device. The method includes generating an insulation element green compact for an insulation element from an insulating composition of materials. The insulation element green compact is partially sintered. At least one cermet-containing conduction element green compact for a conduction element is formed. The at least one conduction element green compact is introduced into the insulation element green compact. The insulation element green compact and the at least one conduction element green compact are fired to obtain an insulation element with at least one conduction element.
摘要翻译： 一个方面涉及一种用于生产用于可植入医疗装置的电气套管的方法。 该方法包括从绝缘材料组合物产生用于绝缘元件的绝缘元件生坯。 绝缘元件生坯被部分烧结。 形成用于导电元件的至少一个含金属陶瓷的导电元件绿色压块。 将至少一个导电元件绿色压块引入绝缘元件绿色压块中。 烧结绝缘元件绿色压块和至少一个导电元件压坯以获得具有至少一个导电元件的绝缘元件。
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公开(公告)号：US20130177470A1
公开(公告)日：2013-07-11
申请号：US13782407
申请日：2013-03-01
CPC分类号： C22C27/02 , A61L31/022 , B22F2998/10 , C22C1/045 , C22C30/00 , B22F9/04 , B22F1/0003 , C22C1/02
摘要： One aspect is an alloy consisting of niobium, zirconium, tantalum, and tungsten. The alloy is formed with a melt metallurgical route such that all four metals solidify as a homogeneous alloy having no inclusions more than 10 μm in size.
摘要翻译： 一个方面是由铌，锆，钽和钨组成的合金。 该合金由熔融冶金方法形成，使得所有四种金属均匀地固化成不含大于10um的夹杂物的均匀合金。
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公开(公告)号：US08778262B2
公开(公告)日：2014-07-15
申请号：US13782407
申请日：2013-03-01
CPC分类号： C22C27/02 , A61L31/022 , B22F2998/10 , C22C1/045 , C22C30/00 , B22F9/04 , B22F1/0003 , C22C1/02
摘要： One aspect is an alloy consisting of niobium, zirconium, tantalum, and tungsten. The alloy is formed with a melt metallurgical route such that all four metals solidify as a homogeneous alloy having no inclusions more than 10 μm in size.
摘要翻译： 一个方面是由铌，锆，钽和钨组成的合金。 该合金由熔融冶金路线形成，使得所有四种金属固化为不具有大于10μm的夹杂物的均匀合金。
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公开(公告)号：US09407076B2
公开(公告)日：2016-08-02
申请号：US14023096
申请日：2013-09-10
CPC分类号： H02G3/22 , B28B1/00 , B28B11/24 , B29C71/02 , H02G1/00 , H02G3/18 , Y10T29/49117 , Y10T29/49158 , Y10T29/49163
摘要： One aspect relates to a method for producing an electrical bushing for an implantable device, an electrical bushing, and an implantable device. The method according to one embodiment includes forming a base body from a ceramic slurry and introducing a bushing conductor made of a metal or cermet material with a metal fraction into the base body. The metal fraction in the bushing conductor is provided to decrease towards the base body. It includes sintering the green blank that includes the base body and the bushing conductor.
摘要翻译： 一个方面涉及一种用于生产用于可植入装置的电气套管，电气衬套和可植入装置的方法。 根据一个实施例的方法包括从陶瓷浆料形成基体，并将由金属或金属陶瓷材料制成的套管导体与金属部分引入基体。 衬套导体中的金属部分设置成朝向基体减小。 它包括烧结包括基体和套管导体的绿色坯料。
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公开(公告)号：US20140008121A1
公开(公告)日：2014-01-09
申请号：US14023096
申请日：2013-09-10
CPC分类号： H02G3/22 , B28B1/00 , B28B11/24 , B29C71/02 , H02G1/00 , H02G3/18 , Y10T29/49117 , Y10T29/49158 , Y10T29/49163
摘要： One aspect relates to a method for producing an electrical bushing for an implantable device, an electrical bushing, and an implantable device. The method according to one embodiment includes forming a base body from a ceramic slurry and introducing a bushing conductor made of a metal or cermet material with a metal fraction into the base body. The metal fraction in the bushing conductor is provided to decrease towards the base body. It includes sintering the green blank that includes the base body and the bushing conductor.
摘要翻译： 一个方面涉及一种用于生产用于可植入装置的电气套管，电气衬套和可植入装置的方法。 根据一个实施例的方法包括从陶瓷浆料形成基体，并将由金属或金属陶瓷材料制成的套管导体与金属部分引入基体。 衬套导体中的金属部分设置成朝向基体减小。 它包括烧结包括基体和套管导体的绿色坯料。
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公开(公告)号：US20130299233A1
公开(公告)日：2013-11-14
申请号：US13942685
申请日：2013-07-15
IPC分类号： H02G3/02
CPC分类号： H02G3/02 , A61F2/02 , A61N1/3754 , B28B1/00 , H01R43/00 , H02G3/18 , Y10T29/49117
摘要： One aspect relates to an electrical bushing for an implantable device including an electrically insulating base body and at least one electrically conductive bushing body that is embedded in at least one bushing opening that extends through the base body. The base body is produced from a sintered ceramic material, characterized in that the at least one bushing body is made of a sintered cermet material or a sintered metallic material. The base body and the at least one bushing body comprise a firmly bonded sintered connection.
摘要翻译： 一个方面涉及一种用于可植入装置的电气套管，其包括电绝缘基体和至少一个导电衬套主体，其嵌入延伸穿过基体的至少一个衬套开口中。 基体由烧结陶瓷材料制成，其特征在于，所述至少一个衬套主体由金属陶瓷烧结材料或烧结金属材料制成。 基体和至少一个衬套主体包括牢固结合的烧结连接。
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