公开(公告)号：US11148227B2

公开(公告)日：2021-10-19

申请号：US16098104

申请日：2016-07-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Krzysztof Nauka ,  Tom Anthony

IPC: B23K26/34 ,  B33Y10/00 ,  B33Y30/00 ,  B23K26/342 ,  B33Y50/02 ,  B29C64/153 ,  B29C64/393 ,  B29C64/295 ,  B23K26/062 ,  B23K26/70 ,  B29C64/268 ,  B23K26/00 ,  B23K26/03 ,  B23K26/14 ,  B33Y40/00 ,  B23K103/16

Abstract: According to an example, an apparatus may include a heating lamp to illuminate and heat an area of a layer of build materials, in which the build materials may be one of a metallic and a plastic powder. The apparatus may also include a laser source to generate a laser beam and a controller to control the heating lamp to heat the build materials in the area of the layer of build materials to a temperature that is between about 100° C. to about 400° C. below a temperature at which the build materials begin to melt and to control the laser source to output a laser beam to melt the build materials in a portion of the heated area of the layer of build materials.

公开(公告)号：US09527308B2

公开(公告)日：2016-12-27

申请号：US14567874

申请日：2014-12-11

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Omer Gila ,  Daihua Zhang ,  Tom Anthony ,  Hou T. Ng

IPC: B41F9/10 ,  B41F23/00 ,  B05C1/08 ,  B41J11/00 ,  B41M5/00 ,  B41M7/00

CPC classification number: B41J11/0015 ,  B05C1/0817 ,  B05C1/0834 ,  B41F9/10 ,  B41F9/1072 ,  B41F23/00 ,  B41M5/0017 ,  B41M7/0018

Abstract: Substrate treatment apparatus, printers, and methods to treat a print substrate are disclosed. An example apparatus includes a first roller having a rigid surface to receive a treatment fluid from a reservoir, a blade to apply a first pressure to the first roller to adjust an amount of the treatment fluid present on the first roller, and a second roller having a non-rigid surface to apply a second pressure to the first roller, to receive an adjusted amount of the treatment fluid from the first roller and to apply the treatment fluid to a substrate, the first pressure and the second pressure being selected such that the second roller applies the treatment fluid to the substrate in an amount resulting in a layer of treatment fluid less than about 0.4 micrometers thick on the substrate.

Abstract translation: 公开了用于处理印刷基板的基板处理设备，打印机和方法。 示例性装置包括具有刚性表面以从贮存器接收处理流体的第一辊，将第一压力施加到第一辊以调节存在于第一辊上的处理流体的量的刀片，以及具有 用于向第一辊施加第二压力的非刚性表面，以接收来自第一辊的调节量的处理流体并将处理流体施加到基底，第一压力和第二压力被选择为使得 第二辊将处理流体施加到基底上，其量导致在基底上小于约0.4微米厚的处理流体层。

公开(公告)号：US20190134750A1

公开(公告)日：2019-05-09

申请号：US16098104

申请日：2016-07-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Krzysztof Nauka ,  Tom Anthony

IPC: B23K26/342 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B29C64/153 ,  B29C64/268 ,  B29C64/393 ,  B23K26/00 ,  B23K26/03 ,  B23K26/062 ,  B23K26/14 ,  B23K26/70

Abstract: According to an example, an apparatus may include a heating lamp to illuminate and heat an area of a layer of build materials, in which the build materials may be one of a metallic and a plastic powder. The apparatus may also include a laser source to generate a laser beam and a controller to control the heating lamp to heat the build materials in the area of the layer of build materials to a temperature that is between about 100 C to about 400 C below a temperature at which the build materials begin to melt and to control the laser source to output a laser beam to melt the build materials in a portion of the heated area of the layer of build materials.

公开(公告)号：US20180272427A1

公开(公告)日：2018-09-27

申请号：US15764871

申请日：2016-01-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kris J ERICKSON ,  Krzysztof Nauka ,  Tom Anthony ,  Lihua Zhao ,  Howard S Tom

IPC: B22F3/00 ,  B33Y10/00

CPC classification number: B22F3/008 ,  B33Y10/00 ,  B82B1/00 ,  B82B3/00 ,  C23C18/08 ,  C23C18/30 ,  C23C24/08 ,  C23C24/10 ,  C23C24/106

Abstract: Apparatus and methods for making metal-connected particle articles. A metal containing fluid is selectively applied to a layer of particles. The metal in the fluid is used to form metal connections between particles. The metal connections are formed at temperatures below the sintering temperature of the particles in the layer of particles.

公开(公告)号：US09740155B2

公开(公告)日：2017-08-22

申请号：US15112937

申请日：2014-01-23

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Tom Anthony ,  Napoleon J Leoni ,  Henryk Birecki ,  Matthew G Lopez ,  Omer Gila

IPC: G03G15/00 ,  B41F23/00 ,  B41M7/00 ,  B41F23/08 ,  C09D11/00

CPC classification number: G03G15/6585 ,  B41F23/08 ,  B41M7/00 ,  C09D11/00 ,  G03G15/205 ,  G03G2215/00426 ,  G03G2215/00805

Abstract: Print glossing is described. Print glossing can be performed on a glossing drum having a location affixed to a circumferential outer surface thereof, where the location transits from a first position in an apparatus having a first temperature range selected to enable reflow of ink applied to a substrate that is placed at the location to a second position in the apparatus having a second temperature range selected for clean release from the location of the ink applied to the substrate.