公开(公告)号：US20050286210A1

公开(公告)日：2005-12-29

申请号：US10533524

申请日：2004-04-09

申请人： Hideki Ishida ,  Eizo Fujii ,  Yasuhiro Kishimoto ,  Hitoshi Ibuta

发明人： Hideki Ishida ,  Eizo Fujii ,  Yasuhiro Kishimoto ,  Hitoshi Ibuta

IPC分类号： H01G9/012 ,  H01G9/00 ,  H05K3/34 ,  H01G9/04

CPC分类号： H01G9/012 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： The present invention provides a solid electrolytic capacitor comprising a capacitor element in which a dielectric coating layer and a cathode layer are sequentially formed on a surface of an anode element having an anode lead member planted on one end surface thereof, an anode terminal connected with the anode lead member, a platy cathode terminal mounting the capacitor element thereon and connected with the cathode layer, and an enclosure resin coating the capacitor element, a part of the cathode terminal and a part of the anode terminal being exposed on a same plane from the enclosure resin. The cathode terminal is provided with a cathode exposed portion exposed from the enclosure resin in at least two locations on the same plane.

摘要翻译： 本发明提供一种固体电解电容器，其包括电容器元件，其中在其一端表面上具有阳极引线构件的阳极元件的表面上依次形成电介质涂层和阴极层，阳极端子与 阳极引线构件，将电容器元件安装在其上并与阴极层连接的板状阴极端子，以及涂覆电容器元件的封装树脂，阴极端子的一部分和阳极端子的一部分在同一平面上从 外壳树脂。 阴极端子设置有在同一平面上的至少两个位置处从外壳树脂露出的阴极暴露部分。

公开(公告)号：US07110245B2

公开(公告)日：2006-09-19

申请号：US10533524

申请日：2004-04-09

申请人： Hideki Ishida ,  Eizo Fujii ,  Yasuhiro Kishimoto ,  Hitoshi Ibuta

发明人： Hideki Ishida ,  Eizo Fujii ,  Yasuhiro Kishimoto ,  Hitoshi Ibuta

IPC分类号： H01G4/228 ,  H01G9/10

CPC分类号： H01G9/012 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： The present invention provides a solid electrolytic capacitor comprising a capacitor element in which a dielectric coating layer and a cathode layer are sequentially formed on a surface of an anode element having an anode lead member planted on one end surface thereof, an anode terminal connected with the anode lead member, a platy cathode terminal mounting the capacitor element thereon and connected with the cathode layer, and an enclosure resin coating the capacitor element, a part of the cathode terminal and a part of the anode terminal being exposed on a same plane from the enclosure resin. The cathode terminal is provided with a cathode exposed portion exposed from the enclosure resin in at least two locations on the same plane.

摘要翻译： 本发明提供一种固体电解电容器，其包括电容器元件，其中在其一端表面上具有阳极引线构件的阳极元件的表面上依次形成电介质涂层和阴极层，阳极端子与 阳极引线构件，将电容器元件安装在其上并与阴极层连接的板状阴极端子，以及涂覆电容器元件的封装树脂，阴极端子的一部分和阳极端子的一部分在同一平面上从 外壳树脂。 阴极端子设置有在同一平面上的至少两个位置处从外壳树脂露出的阴极暴露部分。

公开(公告)号：US20060082953A1

公开(公告)日：2006-04-20

申请号：US11296388

申请日：2005-12-08

申请人： Hideki Ishida ,  Eizo Fujii ,  Yasuhiro Kishimoto ,  Hitoshi Ibuta

发明人： Hideki Ishida ,  Eizo Fujii ,  Yasuhiro Kishimoto ,  Hitoshi Ibuta

IPC分类号： H01G4/228

CPC分类号： H01G9/012 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： The present invention provides a solid electrolytic capacitor comprising a capacitor element in which a dielectric coating layer and a cathode layer are sequentially formed on a surface of an anode element having an anode lead member planted on one end surface thereof, an anode terminal connected with the anode lead member, a platy cathode terminal mounting the capacitor element thereon and connected with the cathode layer, and an enclosure resin coating the capacitor element, a part of the cathode terminal and a part of the anode terminal being exposed on a same plane from the enclosure resin. The cathode terminal is provided with a cathode exposed portion exposed from the enclosure resin in at least two locations on the same plane.

公开(公告)号：US07136276B2

公开(公告)日：2006-11-14

申请号：US11296388

申请日：2005-12-08

申请人： Hideki Ishida ,  Eizo Fujii ,  Yasuhiro Kishimoto ,  Hitoshi Ibuta

发明人： Hideki Ishida ,  Eizo Fujii ,  Yasuhiro Kishimoto ,  Hitoshi Ibuta

IPC分类号： H01G4/228 ,  H01G9/00

CPC分类号： H01G9/012 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： A solid electrolytic capacitor which includes a capacitor element in which a dielectric coating layer and a cathode layer are sequentially formed on a surface of an anode element having an anode lead member planted on one end surface thereof, an anode terminal connected with the anode lead member, a platy cathode terminal mounting the capacitor element thereon and connected with the cathode layer, and an enclosure resin coating the capacitor element, a part of the cathode terminal and a part of the anode terminal being exposed on a same plane from the enclosure resin. The cathode terminal is provided with a cathode exposed portion exposed from the enclosure resin in at least two locations on the same plane.

摘要翻译： 一种固体电解电容器，其包括电容器元件，其中在其一端表面上具有阳极引线构件的阳极元件的表面上依次形成有电介质被覆层和阴极层，阳极端子与阳极引线构件 ，将电容器元件安装在其上并与阴极层连接的板状阴极端子，以及涂覆电容器元件的封装树脂，阴极端子的一部分和阳极端子的一部分在外壳树脂的同一平面上露出。 阴极端子设置有在同一平面上的至少两个位置处从外壳树脂露出的阴极暴露部分。

公开(公告)号：US20060012946A1

公开(公告)日：2006-01-19

申请号：US11171356

申请日：2005-07-01

申请人： Hideki Ishida ,  Eizo Fujii ,  Takeshi Takamatsu

发明人： Hideki Ishida ,  Eizo Fujii ,  Takeshi Takamatsu

IPC分类号： H01G9/00

CPC分类号： H01G9/012 ,  H01G2/06 ,  H01G9/042

摘要： An anode terminal or a cathode terminal is provided with an exposure portion that extends substantially perpendicularly to an arrangement direction of the two terminals and that have an end face exposed on a side face of a housing. At least the end face on the exposure portion is plated for improving the solder wettability. Furthermore, a front end portion of the exposure portion is bent upwards along a peripheral face of the housing.

公开(公告)号：US20050152099A1

公开(公告)日：2005-07-14

申请号：US11075729

申请日：2005-03-10

申请人： Eizo Fujii ,  Hideki Ishida

发明人： Eizo Fujii ,  Hideki Ishida

IPC分类号： H01G2/12 ,  H01G9/00 ,  H01G9/004 ,  H01G9/012 ,  H01G9/15 ,  H01G13/00

CPC分类号： H01G9/012 ,  H01G9/15 ,  H01G11/56 ,  Y02E60/13 ,  Y10T29/417

摘要： The invention provides a process for fabricating a solid electrolytic capacitor of the chip type which process includes the steps of plating a fabrication frame comprising an anode terminal member and a cathode terminal member projecting from a pair of side frame members respectively so as to be opposed to each other, the anode terminal member being stepped so as to provide a lower portion toward the cathode terminal member, a hole extending vertically and being formed in each of the anode terminal member and a higher portion of the cathode terminal member, joining an anode lead of a capacitor element to an upper surface of the cathode terminal member and a bottom surface of the capacitor element to an upper surface of the lower portion of the cathode terminal member, forming a packaging resin portion around the capacitor element without permitting resin to ingress into the holes, and cutting the anode and cathode terminal members along vertical planes extending through the respective holes.

摘要翻译： 本发明提供了一种制造芯片型固体电解电容器的方法，该方法包括以下步骤：分别对从包括一对侧框架构件突出的阳极端子构件和阴极端子构件的制造框架进行电镀以与 另一方面，阳极端子部件是阶梯状的，以向阴极端子部件提供下部，垂直延伸并形成在阳极端子部件和阴极端子部件的较高部分中的孔，将阳极引线 电容器元件的上表面和电容器元件的底表面到阴极端子构件的下部的上表面，在电容器元件周围形成封装树脂部分，而不允许树脂进入 孔，并且沿着延伸穿过相应的垂直平面切割阳极和阴极端子构件 孔。

公开(公告)号：US20060146482A1

公开(公告)日：2006-07-06

申请号：US11365834

申请日：2006-03-02

申请人： Eizo Fujii ,  Hideki Ishida

发明人： Eizo Fujii ,  Hideki Ishida

IPC分类号： H01G9/00

CPC分类号： H01G9/012 ,  H01G9/15 ,  H01G11/56 ,  Y02E60/13 ,  Y10T29/417

摘要： The invention provides a process for fabricating a solid electrolytic capacitor of the chip type which process includes the steps of plating a fabrication frame comprising an anode terminal member and a cathode terminal member projecting from a pair of side frame members respectively so as to be opposed to each other, the anode terminal member being stepped so as to provide a lower portion toward the cathode terminal member, a hole extending vertically and being formed in each of the anode terminal member and a higher portion of the cathode terminal member, joining an anode lead of a capacitor element to an upper surface of the cathode terminal member and a bottom surface of the capacitor element to an upper surface of the lower portion of the cathode terminal member, forming a packaging resin portion around the capacitor element without permitting resin to ingress into the holes, and cutting the anode and cathode terminal members along vertical planes extending through the respective holes.

摘要翻译： 本发明提供了一种制造芯片型固体电解电容器的方法，该方法包括以下步骤：分别对从包括一对侧框架构件突出的阳极端子构件和阴极端子构件的制造框架进行电镀以与 另一方面，阳极端子部件是阶梯状的，以向阴极端子部件提供下部，垂直延伸并形成在阳极端子部件和阴极端子部件的较高部分中的孔，将阳极引线 电容器元件的上表面和电容器元件的底表面到阴极端子构件的下部的上表面，在电容器元件周围形成封装树脂部分，而不允许树脂进入 孔，并且沿着延伸穿过相应的垂直平面切割阳极和阴极端子构件 孔。

公开(公告)号：US07158368B2

公开(公告)日：2007-01-02

申请号：US11365834

申请日：2006-03-02

申请人： Eizo Fujii ,  Hideki Ishida

发明人： Eizo Fujii ,  Hideki Ishida

IPC分类号： H01G4/228 ,  H01G9/10

CPC分类号： H01G9/012 ,  H01G9/15 ,  H01G11/56 ,  Y02E60/13 ,  Y10T29/417

摘要： The invention provides a process for fabricating a solid electrolytic capacitor of the chip type which process includes the steps of plating a fabrication frame comprising an anode terminal member and a cathode terminal member projecting from a pair of side frame members respectively so as to be opposed to each other, the anode terminal member being stepped so as to provide a lower portion toward the cathode terminal member, a hole extending vertically and being formed in each of the anode terminal member and a higher portion of the cathode terminal member, joining an anode lead of a capacitor element to an upper surface of the cathode terminal member and a bottom surface of the capacitor element to an upper surface of the lower portion of the cathode terminal member, forming a packaging resin portion around the capacitor element without permitting resin to ingress into the holes, and cutting the anode and cathode terminal members along vertical planes extending through the respective holes.

摘要翻译： 本发明提供了一种制造芯片型固体电解电容器的方法，该方法包括以下步骤：分别对从包括一对侧框架构件突出的阳极端子构件和阴极端子构件的制造框架进行电镀以与 另一方面，阳极端子部件是阶梯状的，以向阴极端子部件提供下部，垂直延伸并形成在阳极端子部件和阴极端子部件的较高部分中的孔，将阳极引线 电容器元件的上表面和电容器元件的底表面到阴极端子构件的下部的上表面，在电容器元件周围形成封装树脂部分，而不允许树脂进入 孔，并且沿着延伸穿过相应的垂直平面切割阳极和阴极端子构件 孔。

公开(公告)号：US07113391B2

公开(公告)日：2006-09-26

申请号：US11171356

申请日：2005-07-01

申请人： Hideki Ishida ,  Eizo Fujii ,  Takeshi Takamatsu

发明人： Hideki Ishida ,  Eizo Fujii ,  Takeshi Takamatsu

IPC分类号： H01G4/228 ,  H01G9/00 ,  H01G2/10

CPC分类号： H01G9/012 ,  H01G2/06 ,  H01G9/042

摘要： An anode terminal or a cathode terminal is provided with an exposure portion that extends substantially perpendicularly to an arrangement direction of the two terminals and that have an end face exposed on a side face of a housing. At least the end face on the exposure portion is plated for improving the solder wettability. Furthermore, a front end portion of the exposure portion is bent upwards along a peripheral face of the housing.

公开(公告)号：US07326260B2

公开(公告)日：2008-02-05

申请号：US11075729

申请日：2005-03-10

申请人： Eizo Fujii ,  Hideki Ishida

发明人： Eizo Fujii ,  Hideki Ishida

IPC分类号： H01G9/00

CPC分类号： H01G9/012 ,  H01G9/15 ,  H01G11/56 ,  Y02E60/13 ,  Y10T29/417

摘要： The invention provides a process for fabricating a solid electrolytic capacitor of the chip type which process includes the steps of plating a fabrication frame comprising an anode terminal member and a cathode terminal member projecting from a pair of side frame members respectively so as to be opposed to each other, the anode terminal member being stepped so as to provide a lower portion toward the cathode terminal member, a hole extending vertically and being formed in each of the anode terminal member and a higher portion of the cathode terminal member, joining an anode lead of a capacitor element to an upper surface of the cathode terminal member and a bottom surface of the capacitor element to an upper surface of the lower portion of the cathode terminal member, forming a packaging resin portion around the capacitor element without permitting resin to ingress into the holes, and cutting the anode and cathode terminal members along vertical planes extending through the respective holes.

摘要翻译： 本发明提供了一种制造芯片型固体电解电容器的方法，该方法包括以下步骤：分别对从包括一对侧框架构件突出的阳极端子构件和阴极端子构件的制造框架进行电镀以与 另一方面，阳极端子部件是阶梯状的，以向阴极端子部件提供下部，垂直延伸并形成在阳极端子部件和阴极端子部件的较高部分中的孔，将阳极引线 电容器元件的上表面和电容器元件的底表面到阴极端子构件的下部的上表面，在电容器元件周围形成封装树脂部分，而不允许树脂进入 孔，并且沿着延伸穿过相应的垂直平面切割阳极和阴极端子构件 孔。