Plasma processing apparatus and plasma processing method
    1.
    发明授权
    Plasma processing apparatus and plasma processing method 失效
    等离子体处理装置和等离子体处理方法

    公开(公告)号:US5792376A

    公开(公告)日:1998-08-11

    申请号:US580824

    申请日:1995-12-29

    IPC分类号: H01J37/32 H05H1/00

    摘要: A plasma processing apparatus includes a first electrode which is substantially flat and has a substrate mounting region mounted with a substrate to be treated, a chamber for containing the first electrode, gas introducing means for introducing a predetermined gas into the chamber, gas exhausting means for exhausting the gas from the chamber, a second electrode constituted of one of a metal portion of the chamber and a metal plate provided inside the chamber, power supply means for supplying high-frequency power between the first electrode and the second electrode, and an insulative cover for covering a surface of the first electrode other than the substrate mounting region. The substrate mounting region is formed as a convex portion on the first electrode, and an outside shape thereof is smaller than that of the substrate. The substrate is mounted on the substrate mounting region so as to completely cover the substrate mounting region.

    摘要翻译: 一种等离子体处理装置,包括:第一电极,其基本上是平的,并且具有安装有要处理的基板的基板安装区域,用于容纳第一电极的室,用于将预定气体引入到所述室中的气体引入装置,用于 从所述室排出气体,由所述室的金属部分和设置在所述室内的金属板之一构成的第二电极,用于在所述第一电极和所述第二电极之间提供高频电力的电源装置和绝缘体 盖,用于覆盖除基板安装区域之外的第一电极的表面。 基板安装区域形成为第一电极上的凸部,其外形小于基板的外形。 基板安装在基板安装区域上,以完全覆盖基板安装区域。

    Developing method, substrate treating method, and substrate treating apparatus
    2.
    发明授权
    Developing method, substrate treating method, and substrate treating apparatus 有权
    显影方法,基板处理方法和基板处理装置

    公开(公告)号:US07094522B2

    公开(公告)日:2006-08-22

    申请号:US10969018

    申请日:2004-10-21

    IPC分类号: G03F7/30 G03D15/00

    CPC分类号: G03F7/30 Y10S438/906

    摘要: A developing method comprises determining in advance the relation of resist dissolution concentration in a developing solution and resist dissolution speed by the developing solution, estimating in advance the resist dissolution concentration where the resist dissolution speed is a desired speed or more from the relation, and developing in a state in which the resist dissolution concentration in the developing solution is the estimated dissolution concentration or less.

    摘要翻译: 一种显影方法包括:预先确定显影液中的抗蚀剂溶解浓度与显影液的抵抗溶解速度的关系,提前估计抗蚀剂溶解浓度,其中抗蚀剂溶解速度为所需速度或更高的关系,显影 在显影液中的抗蚀剂溶解浓度为估计的溶解浓度以下的状态。

    Template inspection method and manufacturing method for semiconductor device
    5.
    发明授权
    Template inspection method and manufacturing method for semiconductor device 有权
    半导体器件的模板检查方法和制造方法

    公开(公告)号:US08227267B2

    公开(公告)日:2012-07-24

    申请号:US12553906

    申请日:2009-09-03

    IPC分类号: H01L21/66

    摘要: A template inspection method for performing defect inspection of a template, by bringing a pattern formation surface of a template used to form a pattern close to a first fluid coated on a flat substrate, filling the first fluid into a pattern of the template, and by performing optical observation of the template in a state that the first fluid is sandwiched between the template and the substrate, wherein a difference between an optical constant of the first fluid and an optical constant of the template is larger than a difference between an optical constant of air and the optical constant of the template.

    摘要翻译: 一种用于对模板进行缺陷检查的模板检查方法,通过将用于形成图案的模板的图案形成表面靠近涂覆在平坦基板上的第一流体,将第一流体填充到模板的图案中,以及通过 在第一流体夹在模板和基板之间的状态下进行模板的光学观察,其中第一流体的光学常数与模板的光学常数之间的差异大于模板的光学常数之间的差异 空气和模板的光学常数。

    Developing method, substrate treating method, and substrate treating apparatus
    6.
    发明授权
    Developing method, substrate treating method, and substrate treating apparatus 有权
    显影方法,基板处理方法和基板处理装置

    公开(公告)号:US07390365B2

    公开(公告)日:2008-06-24

    申请号:US10969017

    申请日:2004-10-21

    IPC分类号: B05C11/10

    CPC分类号: G03F7/30 Y10S438/906

    摘要: A developing method comprises determining in advance the relation of resist dissolution concentration in a developing solution and resist dissolution speed by the developing solution, estimating in advance the resist dissolution concentration where the resist dissolution speed is a desired speed or more from the relation, and developing in a state in which the resist dissolution concentration in the developing solution is the estimated dissolution concentration or less.

    摘要翻译: 一种显影方法包括:预先确定显影液中的抗蚀剂溶解浓度与显影液的抵抗溶解速度的关系,提前估计抗蚀剂溶解浓度,其中抗蚀剂溶解速度为所需速度或更高的关系,显影 在显影液中的抗蚀剂溶解浓度为估计的溶解浓度以下的状态。

    TEMPLATE INSPECTION METHOD AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
    8.
    发明申请
    TEMPLATE INSPECTION METHOD AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE 有权
    用于半导体器件的模板检测方法和制造方法

    公开(公告)号:US20100075443A1

    公开(公告)日:2010-03-25

    申请号:US12553906

    申请日:2009-09-03

    IPC分类号: H01L21/66 G06K9/00

    摘要: A template inspection method for performing defect inspection of a template, by bringing a pattern formation surface of a template used to form a pattern close to a first fluid coated on a flat substrate, filling the first fluid into a pattern of the template, and by performing optical observation of the template in a state that the first fluid is sandwiched between the template and the substrate, wherein a difference between an optical constant of the first fluid and an optical constant of the template is larger than a difference between an optical constant of air and the optical constant of the template.

    摘要翻译: 一种用于对模板进行缺陷检查的模板检查方法,通过将用于形成图案的模板的图案形成表面靠近涂覆在平坦基板上的第一流体,将第一流体填充到模板的图案中,以及通过 在第一流体夹在模板和基板之间的状态下进行模板的光学观察,其中第一流体的光学常数与模板的光学常数之间的差异大于模板的光学常数之间的差异 空气和模板的光学常数。

    Developing method, substrate treating method, and substrate treating apparatus
    9.
    发明授权
    Developing method, substrate treating method, and substrate treating apparatus 有权
    显影方法,基板处理方法和基板处理装置

    公开(公告)号:US06929903B2

    公开(公告)日:2005-08-16

    申请号:US10653611

    申请日:2003-08-28

    CPC分类号: G03F7/30 Y10S438/906

    摘要: A developing method comprises determining in advance the relation of resist dissolution concentration in a developing solution and resist dissolution speed by the developing solution, estimating in advance the resist dissolution concentration where the resist dissolution speed is a desired speed or more from the relation, and developing in a state in which the resist dissolution concentration in the developing solution is the estimated dissolution concentration or less.

    摘要翻译: 一种显影方法包括:预先确定显影液中的抗蚀剂溶解浓度与显影液的抵抗溶解速度的关系,提前估计抗蚀剂溶解浓度,其中抗蚀剂溶解速度为所需速度或更高的关系,显影 在显影液中的抗蚀剂溶解浓度为估计的溶解浓度以下的状态。

    Developing method, substrate treating method, and substrate treating apparartus
    10.
    发明申请
    Developing method, substrate treating method, and substrate treating apparartus 有权
    显影方法,底物处理方法和底物处理方法

    公开(公告)号:US20050081996A1

    公开(公告)日:2005-04-21

    申请号:US10969018

    申请日:2004-10-21

    CPC分类号: G03F7/30 Y10S438/906

    摘要: A developing method comprises determining in advance the relation of resist dissolution concentration in a developing solution and resist dissolution speed by the developing solution, estimating in advance the resist dissolution concentration where the resist dissolution speed is a desired speed or more from the relation, and developing in a state in which the resist dissolution concentration in the developing solution is the estimated dissolution concentration or less.

    摘要翻译: 一种显影方法包括:预先确定显影液中的抗蚀剂溶解浓度与显影液的抵抗溶解速度的关系,提前估计抗蚀剂溶解浓度,其中抗蚀剂溶解速度为所需速度或更高的关系,显影 在显影液中的抗蚀剂溶解浓度为估计的溶解浓度以下的状态。