利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

62 条记录 (耗时 0.02 秒)

    Semiconductor module and electronic circuit-integrated motor device using same
    1.
    发明授权
    Semiconductor module and electronic circuit-integrated motor device using same 有权
    半导体模块和电子电路集成电机器件使用相同

    公开(公告)号：US08247937B2

    公开(公告)日：2012-08-21

    申请号：US12822403

    申请日：2010-06-24

    申请人： Hideki Minato ,  Hideki Kabune ,  Atsushi Furumoto ,  Ayako Iwai

    发明人： Hideki Minato ,  Hideki Kabune ,  Atsushi Furumoto ,  Ayako Iwai

    IPC分类号： H02K11/00 ,  H02K9/00

    CPC分类号： H05K1/18 ,  H01L2224/73221 ,  H01L2924/0002 ,  H02K11/33 ,  H02K2211/03 ,  H02M7/003 ,  H05K2201/1003 ,  H05K2201/1053 ,  H05K2201/10659 ,  H01L2924/00

    摘要： A V1 semiconductor module has a coil terminal, which is directly connectable to a lead wire of a coil. As a result, the number of parts required to connect electronic parts is reduced. Further, since no printed circuit board is required, the coil terminal can be shaped in any size without being limited in correspondence to the thickness of a copper film of the substrate. The coil terminal and control terminals, which are connected to the printed circuit board having a control circuit for controlling current supply to the coil, are provided on different wall surfaces of a resin part. Thus, the coil and the printed circuit board can be readily connected to the coil terminal and the control terminals, respectively, resulting in simplification of the device.

    摘要翻译： V1半导体模块具有可直接连接到线圈的引线的线圈端子。 结果，减少了连接电子部件所需的部件数量。 此外，由于不需要印刷电路板，所以线圈端子可以成形为任何尺寸，而不受对应于基板的铜膜厚度的限制。 连接到具有用于控制向线圈供电的控制电路的印刷电路板的线圈端子和控制端子设置在树脂部件的不同壁面上。 因此，线圈和印刷电路板可以分别容易地连接到线圈端子和控制端子，从而简化了装置。

    SEMICONDUCTOR MODULE AND ELECTRONIC CIRCUIT-INTEGRATED MOTOR DEVICE USING SAME
    5.
    发明申请
    SEMICONDUCTOR MODULE AND ELECTRONIC CIRCUIT-INTEGRATED MOTOR DEVICE USING SAME 有权
    使用相同的半导体模块和电子电路集成电动机

    公开(公告)号：US20100327709A1

    公开(公告)日：2010-12-30

    申请号：US12822403

    申请日：2010-06-24

    申请人： Hideki MINATO ,  Hideki Kabune ,  Atsushi Furumoto ,  Ayako Iwai

    发明人： Hideki MINATO ,  Hideki Kabune ,  Atsushi Furumoto ,  Ayako Iwai

    IPC分类号： H02K5/22 ,  H02K11/00 ,  H05K1/02

    CPC分类号： H05K1/18 ,  H01L2224/73221 ,  H01L2924/0002 ,  H02K11/33 ,  H02K2211/03 ,  H02M7/003 ,  H05K2201/1003 ,  H05K2201/1053 ,  H05K2201/10659 ,  H01L2924/00

    摘要： A V1 semiconductor module has a coil terminal, which is directly connectable to a lead wire of a coil. As a result, the number of parts required to connect electronic parts is reduced. Further, since no printed circuit board is required, the coil terminal can be shaped in any size without being limited in correspondence to the thickness of a copper film of the substrate. The coil terminal and control terminals, which are connected to the printed circuit board having a control circuit for controlling current supply to the coil, are provided on different wall surfaces of a resin part. Thus, the coil and the printed circuit board can be readily connected to the coil terminal and the control terminals, respectively, resulting in simplification of the device.

    摘要翻译： V1半导体模块具有可直接连接到线圈的引线的线圈端子。 结果，减少了连接电子部件所需的部件数量。 此外，由于不需要印刷电路板，所以线圈端子可以成形为任何尺寸，而不受对应于基板的铜膜厚度的限制。 连接到具有用于控制向线圈供电的控制电路的印刷电路板的线圈端子和控制端子设置在树脂部件的不同壁面上。 因此，线圈和印刷电路板可以分别容易地连接到线圈端子和控制端子，从而简化了装置。

    DRIVE APPARATUS
    7.
    发明申请
    DRIVE APPARATUS 有权
    驱动装置

    公开(公告)号：US20120098361A1

    公开(公告)日：2012-04-26

    申请号：US13379096

    申请日：2010-06-23

    申请人： Masashi Yamasaki ,  Atsushi Furumoto ,  Hideki Kabune

    发明人： Masashi Yamasaki ,  Atsushi Furumoto ,  Hideki Kabune

    IPC分类号： H02K9/00

    CPC分类号： H02K11/0073 ,  B62D5/0406 ,  H02K5/225 ,  H02K11/33 ,  H02K2211/03

    摘要： A heat sink has two heat radiation blocks. The heat radiation block is formed in a wide column shape. The heat radiation block has connection parts at both ends. The connection parts have respective holes formed to pass through in the axial direction of a motor. One screw is inserted in one connection part and threaded into a motor case. The other screw is inserted in the other connection part and threaded into the motor case together with a cover. A power module forming an inverter circuit of each of two power supply systems is arranged on each heat radiation blocks.

    摘要翻译： 散热片有两个散热块。 散热块形成为宽的柱状。 散热块在两端具有连接部分。 连接部具有形成为沿电动机的轴向通过的各个孔。 一个螺丝插入一个连接部分并拧入电机外壳。 另一个螺钉插入另一个连接部分，并与盖子一起拧入电机外壳。 形成两个电源系统中的每一个的逆变器电路的功率模块布置在每个散热块上。

    Electronic circuit-integrated motor apparatus
    8.
    发明授权
    Electronic circuit-integrated motor apparatus 有权
    电子电路集成电机装置

    公开(公告)号：US08338998B2

    公开(公告)日：2012-12-25

    申请号：US12822627

    申请日：2010-06-24

    申请人： Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto

    发明人： Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto

    IPC分类号： H02K9/00 ,  H02K11/00

    CPC分类号： H02K9/22 ,  H01L23/36 ,  H01L25/11 ,  H01L2924/0002 ,  H02K11/33 ,  H01L2924/00

    摘要： An electronic circuit including semiconductor modules and capacitors is positioned in the axial direction of a motor. Each semiconductor module is longitudinally positioned in contact with a heat sink. More specifically, a line perpendicular to the surface of a semiconductor chip included in the semiconductor module is perpendicular to the axis line of the motor. Consequently, each capacitor is positioned so that at least a part of the positional range of the capacitor in the axial direction of the motor coincides with the positional ranges of the semiconductor module and the heat sink in the axial direction.

    摘要翻译： 包括半导体模块和电容器的电子电路位于电机的轴向。 每个半导体模块纵向定位成与散热器接触。 更具体地，垂直于包括在半导体模块中的半导体芯片的表面的线垂直于电动机的轴线。 因此，每个电容器被定位成使得电动机在电动机轴向上的位置范围的至少一部分与半导体模块和散热器在轴向方向上的位置范围一致。

    DRIVE APPARATUS
    9.
    发明申请
    DRIVE APPARATUS 有权
    驱动装置

    公开(公告)号：US20120098365A1

    公开(公告)日：2012-04-26

    申请号：US13380309

    申请日：2010-06-23

    申请人： Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto

    发明人： Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto

    IPC分类号： H02K11/00

    CPC分类号： H02K9/22 ,  B62D5/0406 ,  H02K3/50 ,  H02K5/225 ,  H02K11/33

    摘要： A heat sink of a drive apparatus includes a heat receiving surface located in a rising direction from an end surface wall of a motor case formed in an axial direction of the motor case. A power module includes a mold part and is arranged along the heat receiving surface of the heat sink. Motor leads are taken out from the motor case and electrically connected to the power module and winding wires. The drive apparatus has the motor case, a control circuit substrate, the heat sink, the power module and a power circuit substrate arranged in this order in the axial direction. The motor leads are connected to the power module at an opposite side of the motor case relative to the mold part in the axial direction.

    摘要翻译： 驱动装置的散热器包括从沿电动机壳体的轴向方向形成的电动机壳体的端面壁沿上升方向设置的受热面。 功率模块包括模具部件并且沿着散热器的热接收表面布置。 电机引线从电机外壳中取出并与电源模块和绕组电线电连接。 驱动装置具有马达壳体，控制电路基板，散热器，电源模块和沿轴向依次布置的电源电路基板。 马达引线在轴向方向上相对于模具部件在马达壳体的相对侧连接到功率模块。

    Drive apparatus
    10.
    发明授权
    Drive apparatus 有权
    驱动装置

    公开(公告)号：US08710705B2

    公开(公告)日：2014-04-29

    申请号：US13336492

    申请日：2011-12-23

    申请人： Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto

    发明人： Masashi Yamasaki ,  Hideki Kabune ,  Atsushi Furumoto

    IPC分类号： H02K9/00

    CPC分类号： H02K11/0073 ,  B62D5/0406 ,  H02K3/50 ,  H02K5/225 ,  H02K9/22 ,  H02K11/33

    摘要： An electronic control unit (50, 70) including semiconductor modules (501 to 506) and capacitors (701 to 706) is disposed in the axial direction of a motor (30). The semiconductor modules (501 to 506) are placed longitudinally and brought into contact with a heat sink (601). The vertical line to each of surfaces of semiconductor chips included in the semiconductor modules (501 to 506) is perpendicular to the axial line of the motor (30). Accordingly, the capacitors (701 to 706) are disposed so that at least a part of the capacitors (701 to 706) overlap the semiconductor modules (501 to 506) and heat sink (601) in the axial direction of the motor (30).

    摘要翻译： 包括半导体模块（501至506）和电容器（701至706）的电子控制单元（50,70）设置在电动机（30）的轴向上。 半导体模块（501至506）被纵向放置并与散热器（601）接触。 包括在半导体模块（501至506）中的半导体芯片的每个表面的垂直线垂直于电动机（30）的轴线。 因此，电容器（701〜706）的配置使得至少一部分电容器（701〜706）在电动机（30）的轴向上与半导体模块（501〜506）和散热片（601）重叠， 。