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    Chip type electronic part
    1.
    发明授权
    Chip type electronic part 有权
    片式电子部件

    公开(公告)号：US06576971B2

    公开(公告)日：2003-06-10

    申请号：US09320661

    申请日：1999-05-27

    申请人： Hidenobu Kimoto ,  Masahiko Kawase ,  Norimitsu Kitoh

    发明人： Hidenobu Kimoto ,  Masahiko Kawase ,  Norimitsu Kitoh

    IPC分类号： H01L2348

    CPC分类号： H01G4/232 ,  H01C1/148 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/10636 ,  H05K2201/10909 ,  Y02P70/611 ,  Y02P70/613

    摘要： The present invention is to provide a chip type electronic part without the risk of generating a tombstone at the time of soldering on a circuit substrate. External electrodes are formed at both end parts of an electronic part element, with the external electrodes comprising electrodes at the base layer formed as a thin film and solders at the outermost layer, with the solders at the outermost layer containing Sn and Pb as the main component and 0.1 to 0.4% by weight of Ag.

    摘要翻译： 本发明是提供一种芯片型电子部件，在电路基板上的焊接时不会产生逻辑生成的风险。 外部电极形成在电子部件元件的两端部，外部电极在底层形成电极，形成为薄膜，在最外层形成焊料，最外层的焊料含有Sn和Pb作为主体 组分和0.1至0.4重量％的Ag。

    Methods of making thermistor chips
    3.
    发明授权
    Methods of making thermistor chips 有权
    制造热敏电阻芯片的方法

    公开(公告)号：US6100110A

    公开(公告)日：2000-08-08

    申请号：US304900

    申请日：1999-05-04

    申请人： Masahiko Kawase ,  Hidenobu Kimoto ,  Norimitsu Kito ,  Ikuya Taniguchi

    发明人： Masahiko Kawase ,  Hidenobu Kimoto ,  Norimitsu Kito ,  Ikuya Taniguchi

    IPC分类号： H01C1/14 ,  H01C1/142 ,  H01C7/00 ,  H01C7/04 ,  H01C17/00 ,  H01C17/28 ,  H01L21/00

    CPC分类号： H01C17/006 ,  H01C1/142 ,  H01C17/28

    摘要： A thermistor chip is made by first forming first metal layers with a three-layer structure at both end parts of a thermistor block and then forming second metal layers with a three-layer structure on the first metal layers so as to have edge parts that are formed directly in contact with a surface area of the thermistor block and will reduce its normal temperature resistance value. The first and second metal layers are each of a three-layer structure with a lower layer made of a metal with resistance against soldering heat, a middle layer made of a metal with both wettability to solder and resistance against soldering heat, and an upper layer made of a metal having wettability to solder.

    摘要翻译： 热敏电阻芯片通过首先在热敏电阻块的两个端部形成具有三层结构的第一金属层，然后在第一金属层上形成具有三层结构的第二金属层，以便具有边缘部分 直接与热敏电阻块的表面区域接触，并降低其常温电阻值。 第一金属层和第二金属层各自具有由金属制成的具有耐焊接热的下层的三层结构，具有对焊料的润湿性和耐焊接热性的金属制成的中间层，以及上层 由具有可焊性的金属制成。

    Thermistor chips and methods of making same
    4.
    发明授权
    Thermistor chips and methods of making same 失效
    热敏电阻芯片及其制造方法

    公开(公告)号：US5952911A

    公开(公告)日：1999-09-14

    申请号：US943724

    申请日：1997-10-03

    申请人： Masahiko Kawase ,  Hidenobu Kimoto ,  Norimitsu Kito ,  Ikuya Taniguchi

    发明人： Masahiko Kawase ,  Hidenobu Kimoto ,  Norimitsu Kito ,  Ikuya Taniguchi

    IPC分类号： H01C1/14 ,  H01C1/142 ,  H01C7/00 ,  H01C7/04 ,  H01C17/00 ,  H01C17/28 ,  H01C7/10

    CPC分类号： H01C17/006 ,  H01C1/142 ,  H01C17/28

    摘要： A thermistor chip is made by first forming first metal layers with a three-layer structure at both end parts of a thermistor element and then forming second metal layers with a three-layer structure on the first metal layers so as to have edge parts that are formed directly in contact with a surface area of the thermistor element and will reduce its normal temperature resistance value. The first and second metal layers are each of a three-layer structure with a lower layer made of a metal with resistance against soldering heat, a middle layer made of a metal with both wettability to solder and resistance against soldering heat, and an upper layer made of a metal having wettability to solder.

    摘要翻译： 通过首先在热敏电阻元件的两个端部形成具有三层结构的第一金属层，然后在第一金属层上形成具有三层结构的第二金属层，以便具有边缘部分 形成为直接与热敏电阻元件的表面区域接触并且将降低其常温电阻值。 第一金属层和第二金属层各自具有由金属制成的具有耐焊接热的下层的三层结构，具有对焊料的润湿性和耐焊接热性的金属制成的中间层，以及上层 由具有可焊性的金属制成。