公开(公告)号：US20090236036A1

公开(公告)日：2009-09-24

申请号：US12306610

申请日：2007-06-22

申请人： Hidenori Miyakawa ,  Ryou Kuwabara ,  Shigeaki Sakatani ,  Atsushi Yamaguchi ,  Susumu Saitoh ,  Arata Kishi

发明人： Hidenori Miyakawa ,  Ryou Kuwabara ,  Shigeaki Sakatani ,  Atsushi Yamaguchi ,  Susumu Saitoh ,  Arata Kishi

IPC分类号： B32B38/10 ,  C08L63/00 ,  B32B38/00 ,  B23K31/02

CPC分类号： H05K3/305 ,  C08G59/66 ,  C08G59/686 ,  C08K9/04 ,  C08L63/00 ,  H05K3/225 ,  H05K3/306 ,  H05K2201/0209 ,  H05K2203/1105 ,  H05K2203/176 ,  Y02P20/582 ,  Y02P70/613

摘要： A resin composition is provided that makes it possible to prevent low-heat resistant components from being damaged when heated in a process of mounting electronic components on a circuit board. There are also provided a method for easily repairing circuit boards that are determined to be off-specification products in the mounting process, and a method for separating and recovering useful circuit boards and/or electronic components from the circuit boards that are determined to be off-specification products in the mounting process. The resin composition comprises (A) 100 parts by weight of an epoxy resin, (B) 30 to 200 parts by weight of a thiol-based curing agent, (C) 5 to 200 parts by weight of an organic-inorganic composite insulating filler and (D) 0.5 to 20 parts by weight of an imidazole-based curing accelerator. According to the recovering method, the resin composition is softened by heating a part or whole of the circuit board in the mounting process, to a temperature in range not lower than the glass transition point of the resin composition and not higher than 110° C., and separating and recovering the electronic components from the circuit board.

摘要翻译： 提供了一种树脂组合物，其可以在将电子部件安装在电路板上的过程中，在加热时防止低耐热性部件被损坏。 还提供了一种容易修复在安装过程中被确定为不合规格产品的电路板的方法，以及用于从确定为关闭的电路板分离和恢复有用的电路板和/或电子部件的方法 - 在安装过程中确定产品。 树脂组合物包含（A）100重量份的环氧树脂，（B）30〜200重量份的硫醇系固化剂，（C）5〜200重量份的有机 - 无机复合绝缘填料 和（D）0.5〜20重量份的咪唑类固化促进剂。 根据回收方法，通过在安装工序中将电路板的一部分或全部加热到树脂组合物的玻璃化转变温度以上且不高于110℃的温度，使树脂组合物软化。 ，并且从电路板分离和回收电子部件。