公开(公告)号：US20090236036A1

公开(公告)日：2009-09-24

申请号：US12306610

申请日：2007-06-22

申请人： Hidenori Miyakawa ,  Ryou Kuwabara ,  Shigeaki Sakatani ,  Atsushi Yamaguchi ,  Susumu Saitoh ,  Arata Kishi

发明人： Hidenori Miyakawa ,  Ryou Kuwabara ,  Shigeaki Sakatani ,  Atsushi Yamaguchi ,  Susumu Saitoh ,  Arata Kishi

IPC分类号： B32B38/10 ,  C08L63/00 ,  B32B38/00 ,  B23K31/02

CPC分类号： H05K3/305 ,  C08G59/66 ,  C08G59/686 ,  C08K9/04 ,  C08L63/00 ,  H05K3/225 ,  H05K3/306 ,  H05K2201/0209 ,  H05K2203/1105 ,  H05K2203/176 ,  Y02P20/582 ,  Y02P70/613

摘要： A resin composition is provided that makes it possible to prevent low-heat resistant components from being damaged when heated in a process of mounting electronic components on a circuit board. There are also provided a method for easily repairing circuit boards that are determined to be off-specification products in the mounting process, and a method for separating and recovering useful circuit boards and/or electronic components from the circuit boards that are determined to be off-specification products in the mounting process. The resin composition comprises (A) 100 parts by weight of an epoxy resin, (B) 30 to 200 parts by weight of a thiol-based curing agent, (C) 5 to 200 parts by weight of an organic-inorganic composite insulating filler and (D) 0.5 to 20 parts by weight of an imidazole-based curing accelerator. According to the recovering method, the resin composition is softened by heating a part or whole of the circuit board in the mounting process, to a temperature in range not lower than the glass transition point of the resin composition and not higher than 110° C., and separating and recovering the electronic components from the circuit board.

摘要翻译： 提供了一种树脂组合物，其可以在将电子部件安装在电路板上的过程中，在加热时防止低耐热性部件被损坏。 还提供了一种容易修复在安装过程中被确定为不合规格产品的电路板的方法，以及用于从确定为关闭的电路板分离和恢复有用的电路板和/或电子部件的方法 - 在安装过程中确定产品。 树脂组合物包含（A）100重量份的环氧树脂，（B）30〜200重量份的硫醇系固化剂，（C）5〜200重量份的有机 - 无机复合绝缘填料 和（D）0.5〜20重量份的咪唑类固化促进剂。 根据回收方法，通过在安装工序中将电路板的一部分或全部加热到树脂组合物的玻璃化转变温度以上且不高于110℃的温度，使树脂组合物软化。 ，并且从电路板分离和回收电子部件。

公开(公告)号：US08450859B2

公开(公告)日：2013-05-28

申请号：US13000391

申请日：2009-10-27

申请人： Naomichi Ohashi ,  Shigeaki Sakatani ,  Arata Kishi ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

发明人： Naomichi Ohashi ,  Shigeaki Sakatani ,  Arata Kishi ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49894 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13566 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/0105

摘要： A semiconductor device mounted structure includes a semiconductor device having a plurality of first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it.

摘要翻译： 半导体器件安装结构包括具有多个第一电极的半导体器件，具有多个第二电极的电路板，分别形成在多个第一电极上的多个凸块，分别位于凸块之间的多个接合部件和 所述第二电极经由所述凸块将所述第一电极与所述第二电极电连接，以及分别位于所述接合部件周围的多个增强树脂部件，以至少覆盖所述接合部件和所述凸块之间的接合部件和接合部。 相邻的增强树脂构件彼此间隔开，以便不与半导体器件接触而彼此不接触。 该半导体器件安装结构提高了接头在耐冲击性方面的可靠性，并且使其易于修复。

公开(公告)号：US20110095423A1

公开(公告)日：2011-04-28

申请号：US13000391

申请日：2009-10-27

申请人： Naomichi Ohashi ,  Shigeaki Sakatani ,  Arata Kishi ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

发明人： Naomichi Ohashi ,  Shigeaki Sakatani ,  Arata Kishi ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L23/49894 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13566 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10977 ,  H05K2201/10992 ,  Y02P70/613 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/0105

摘要： A semiconductor device mounted structure includes a semiconductor device having a plurality first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it.

摘要翻译： 半导体器件安装结构包括具有多个第一电极的半导体器件，具有多个第二电极的电路板，分别形成在多个第一电极上的多个凸块，分别位于凸块和第二电极之间的多个接合部件 第二电极，经由凸块将第一电极与第二电极电连接;以及多个加强树脂部件，分别位于接合部件周围，以至少覆盖接合部件和接合部件与凸块之间的接合区域。 相邻的增强树脂构件彼此间隔开，以便不与半导体器件接触而彼此不接触。 该半导体器件安装结构提高了接头在耐冲击性方面的可靠性，并且使其易于修复。

公开(公告)号：US08378472B2

公开(公告)日：2013-02-19

申请号：US12738430

申请日：2008-10-16

申请人： Koso Matsuno ,  Atsushi Yamaguchi ,  Shigeaki Sakatani ,  Hidenori Miyakawa ,  Mikiya Ueda

发明人： Koso Matsuno ,  Atsushi Yamaguchi ,  Shigeaki Sakatani ,  Hidenori Miyakawa ,  Mikiya Ueda

IPC分类号： H01L23/22

CPC分类号： H01L21/563 ,  H01L23/13 ,  H01L23/3121 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/15313 ,  H05K1/0224 ,  H05K3/28 ,  H05K3/3452 ,  H05K2201/0969 ,  H05K2201/0989 ,  H05K2201/10977

摘要： In order to easily inject underfill resin and perform molding with reliability, groove sections are formed on a surface of a circuit board such that the ends of the groove sections extend to semiconductor elements. Low-viscosity underfill resin applied dropwise is guided by the groove sections and flows between the circuit board and the semiconductor elements. The underfill resin hardly expands to regions outside the semiconductor elements.

摘要翻译： 为了容易地注入底部填充树脂并且可靠地进行模制，在电路板的表面上形成槽部，使得槽部的端部延伸到半导体元件。 滴下的低粘度底部填充树脂由槽部引导，在电路基板与半导体元件之间流动。 底部填充树脂几乎不扩展到半导体元件外部的区域。

公开(公告)号：US20110110050A1

公开(公告)日：2011-05-12

申请号：US12675080

申请日：2008-10-21

申请人： Shigeaki Sakatani ,  Koso Matsuno ,  Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Mikiya Ueda

发明人： Shigeaki Sakatani ,  Koso Matsuno ,  Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Mikiya Ueda

IPC分类号： H05K7/00 ,  H05K3/30 ,  H05K1/16 ,  H05K1/00

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L23/295 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06572 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15151 ,  H01L2924/18301 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49139 ,  H01L2924/00

摘要： A structure with electronic component mounted therein includes a wiring board on which an electronic component is mounted at least on its first face, resin provided at least between the electronic component and the wiring board, and a plurality of holes formed in the wiring board at region corresponding to a mounting position of the electronic component. The holes are filled with the resin. This suppresses warpage of the structure with electronic component mounted therein, and also improves reliability by reducing a stress applied to a bonding section between the wiring board and the electronic component.

摘要翻译： 安装有电子部件的结构包括：至少在其第一面上安装有电子部件的布线基板，至少设置在电子部件和布线基板之间的树脂，以及在布线基板上形成的多个孔 对应于电子部件的安装位置。 孔用树脂填充。 这抑制了安装有电子部件的结构的翘曲，并且还通过减小施加到布线板和电子部件之间的接合部的应力来提高可靠性。

公开(公告)号：US08012379B2

公开(公告)日：2011-09-06

申请号：US12870275

申请日：2010-08-27

申请人： Hidenori Miyakawa ,  Shigeaki Sakatani ,  Kumiko Sugiyama ,  Takayuki Higuchi ,  Atsushi Yamaguchi

发明人： Hidenori Miyakawa ,  Shigeaki Sakatani ,  Kumiko Sugiyama ,  Takayuki Higuchi ,  Atsushi Yamaguchi

IPC分类号： H01B1/02 ,  B05D7/00

CPC分类号： H05K1/095 ,  C08G59/66 ,  C08G59/687 ,  C08K5/37 ,  C09J163/00 ,  H01B1/22 ,  H05K3/321 ,  H05K3/4069 ,  H05K2201/0224 ,  H05K2203/122

摘要： A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.

摘要翻译： 提供具有改善的保存稳定性并且当需要时硬化的导电粘合材料优选在低温下立即硬化。 在一个发明中，导电接合材料包括导电颗粒成分，环氧树脂成分和用于所述环氧树脂的硬化剂成分和用于所述环氧树脂的硬化剂成分，还包含具有硫醇基的重整剂。 在另一发明中，包含环氧树脂硬化成分的导电性接合材料，其中所述环氧树脂硬化成分含有具有可与金属粒子表面配位的端基的含硫化合物，含硫化合物进入 通过从金属颗粒的表面离解，作为环氧树脂的硬化剂。 导电接合材料可能含有香料。

公开(公告)号：US20090116205A1

公开(公告)日：2009-05-07

申请号：US12260219

申请日：2008-10-29

申请人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Shigeaki Sakatani ,  Koso Matsuno

发明人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Shigeaki Sakatani ,  Koso Matsuno

IPC分类号： H05K7/00

CPC分类号： H05K3/3484 ,  B23K35/264 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3463 ,  H01L2924/3512 ,  H01L2924/00

摘要： A plurality of semiconductor elements is adjacently mounted on a substrate by a solder with a melting point of 200° C. or lower, an electronic part other than the semiconductor elements is mounted on the substrate between the adjacently mounted semiconductor elements by a solder with a melting point of 200° C. or lower, and spaces between the plurality of semiconductor elements and the substrate, spaces between the electronic part and the substrate, and spaces between the plurality of semiconductor elements and the electronic part are integrally molded with a molding resin.

摘要翻译： 多个半导体元件通过熔点为200℃以下的焊料相邻地安装在基板上，除了半导体元件之外的电子部件通过焊料与相邻安装的半导体元件之间的基板安装在基板上 熔点为200℃以下，多个半导体元件与基板之间的空间，电子部件与基板之间的空间以及多个半导体元件与电子部件之间的空间与成形树脂一体成型 。

公开(公告)号：US08345444B2

公开(公告)日：2013-01-01

申请号：US12675080

申请日：2008-10-21

申请人： Shigeaki Sakatani ,  Koso Matsuno ,  Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Mikiya Ueda

发明人： Shigeaki Sakatani ,  Koso Matsuno ,  Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Mikiya Ueda

IPC分类号： H05K1/11

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L23/295 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06572 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15151 ,  H01L2924/18301 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49139 ,  H01L2924/00

摘要： A structure with electronic component mounted therein includes a wiring board on which an electronic component is mounted at least on its first face, resin provided at least between the electronic component and the wiring board, and a plurality of holes formed in the wiring board at region corresponding to a mounting position of the electronic component. The holes are filled with the resin. This suppresses warpage of the structure with electronic component mounted therein, and also improves reliability by reducing a stress applied to a bonding section between the wiring board and the electronic component.

摘要翻译： 安装有电子部件的结构包括：至少在其第一面上安装有电子部件的布线板，至少设置在电子部件和布线基板之间的树脂，以及在布线基板上形成的多个孔 对应于电子部件的安装位置。 孔用树脂填充。 这抑制了安装有电子部件的结构的翘曲，并且还通过减小施加到布线板和电子部件之间的接合部的应力来提高可靠性。

公开(公告)号：US08179686B2

公开(公告)日：2012-05-15

申请号：US12259661

申请日：2008-10-28

申请人： Shigeaki Sakatani ,  Atsushi Yamaguchi ,  Koso Matsuno ,  Hidenori Miyakawa

发明人： Shigeaki Sakatani ,  Atsushi Yamaguchi ,  Koso Matsuno ,  Hidenori Miyakawa

IPC分类号： H05K7/00

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01079 ,  H01L2924/15151 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00

摘要： Including a wiring board having an electronic component mounted at least on a first surface, a resin applied at least between the electronic component and the wiring board, and a through-hole provided in a region corresponding to the mounting position of the electronic component in the wiring board, a protrusion is formed on the wiring board so as to overlap at least with the electronic component, around a region corresponding to the mounting position of the electronic component.

摘要翻译： 包括具有至少安装在第一表面上的电子部件的布线板，至少施加在电子部件和布线板之间的树脂，以及设置在与电子部件的安装位置对应的区域中的通孔 在布线基板上，至少与电子部件重叠，在与电子部件的安装位置对应的区域上形成突起。

公开(公告)号：US20100316794A1

公开(公告)日：2010-12-16

申请号：US12870275

申请日：2010-08-27

申请人： Hidenori MIYAKAWA ,  Shigeaki Sakatani ,  Kumiko Sugiyama ,  Takayuki Higuchi ,  Atsushi Yamaguchi

发明人： Hidenori MIYAKAWA ,  Shigeaki Sakatani ,  Kumiko Sugiyama ,  Takayuki Higuchi ,  Atsushi Yamaguchi

IPC分类号： H05K3/10

CPC分类号： H05K1/095 ,  C08G59/66 ,  C08G59/687 ,  C08K5/37 ,  C09J163/00 ,  H01B1/22 ,  H05K3/321 ,  H05K3/4069 ,  H05K2201/0224 ,  H05K2203/122

摘要： A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.

摘要翻译： 提供具有改善的保存稳定性并且当需要时硬化的导电粘合材料优选在低温下立即硬化。 在一个发明中，导电接合材料包括导电颗粒成分，环氧树脂成分和用于所述环氧树脂的硬化剂成分和用于所述环氧树脂的硬化剂成分，还包含具有硫醇基的重整剂。 在另一发明中，包含环氧树脂硬化成分的导电性接合材料，其中所述环氧树脂硬化成分含有具有可与金属粒子表面配位的端基的含硫化合物，含硫化合物进入 通过从金属颗粒的表面离解，作为环氧树脂的硬化剂。 导电接合材料可能含有香料。