公开(公告)号：US20080043400A1

公开(公告)日：2008-02-21

申请号：US11837059

申请日：2007-08-10

申请人： Hidetaka Fukudome ,  Masashi Nishimura ,  Masaaki Taniguchi ,  Yoshio Kawaguchi

发明人： Hidetaka Fukudome ,  Masashi Nishimura ,  Masaaki Taniguchi ,  Yoshio Kawaguchi

IPC分类号： H01G4/30 ,  H05K1/14

CPC分类号： H05K1/0231 ,  H01G4/2325 ,  H01G4/30 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15313 ,  H01L2924/3011 ,  H05K1/185 ,  H05K2201/10712 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A monolithic capacitor includes a laminate of ceramic layers, the laminate having first and second surfaces, at least one pair of first and second internal electrodes, first and second external electrodes disposed on the first surface, third and fourth external electrodes disposed on the second surface, a first via conductor that electrically connects the first external electrode to the first internal electrode and to the third external electrode and that contains a metal oxide, and a second via conductor that electrically connects the second external electrode to the second internal electrode and to the fourth external electrode and that contains a metal oxide, wherein, in each of the first and second via conductors, the metal oxide content at an end on the second surface side is higher than the metal oxide content at a center or at an end on the first surface side.

摘要翻译： 单片电容器包括陶瓷层的层叠体，层叠体具有第一表面和第二表面，至少一对第一和第二内部电极，设置在第一表面上的第一和第二外部电极，设置在第二表面上的第三和第四外部电极 第一通孔导体，其将第一外部电极与第一内部电极和第三外部电极电连接并且包含金属氧化物;以及第二通路导体，其将第二外部电极与第二内部电极电连接， 第四外部电极，其含有金属氧化物，其中，在所述第一和第二导体导体的每一个中，所述第二表面侧的端部的金属氧化物含量高于所述第二和第二导体的中心或末端的金属氧化物含量 第一表面。

公开(公告)号：US07430107B2

公开(公告)日：2008-09-30

申请号：US11837059

申请日：2007-08-10

申请人： Hidetaka Fukudome ,  Masashi Nishimura ,  Masaaki Taniguchi ,  Yoshio Kawaguchi

发明人： Hidetaka Fukudome ,  Masashi Nishimura ,  Masaaki Taniguchi ,  Yoshio Kawaguchi

IPC分类号： H01G4/228

CPC分类号： H05K1/0231 ,  H01G4/2325 ,  H01G4/30 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15313 ,  H01L2924/3011 ,  H05K1/185 ,  H05K2201/10712 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A monolithic capacitor includes a laminate of ceramic layers, the laminate having first and second surfaces, at least one pair of first and second internal electrodes, first and second external electrodes disposed on the first surface, third and fourth external electrodes disposed on the second surface, a first via conductor that electrically connects the first external electrode to the first internal electrode and to the third external electrode and that contains a metal oxide, and a second via conductor that electrically connects the second external electrode to the second internal electrode and to the fourth external electrode and that contains a metal oxide, wherein, in each of the first and second via conductors, the metal oxide content at an end on the second surface side is higher than the metal oxide content at a center or at an end on the first surface side.

摘要翻译： 单片电容器包括陶瓷层的层叠体，层叠体具有第一表面和第二表面，至少一对第一和第二内部电极，设置在第一表面上的第一和第二外部电极，设置在第二表面上的第三和第四外部电极 第一通孔导体，其将第一外部电极与第一内部电极和第三外部电极电连接并且包含金属氧化物;以及第二通路导体，其将第二外部电极与第二内部电极电连接， 第四外部电极，其含有金属氧化物，其中，在所述第一和第二导体导体的每一个中，所述第二表面侧的端部的金属氧化物含量高于所述第二和第二导体的中心或末端的金属氧化物含量 第一表面。

公开(公告)号：US20050269013A1

公开(公告)日：2005-12-08

申请号：US11142594

申请日：2005-06-01

申请人： Hidetaka Fukudome ,  Masaaki Taniguchi ,  Yoshio Kawaguchi

发明人： Hidetaka Fukudome ,  Masaaki Taniguchi ,  Yoshio Kawaguchi

IPC分类号： H01G4/12 ,  B32B18/00 ,  C03B29/00 ,  H01G4/232 ,  H01G4/30 ,  H05K1/03 ,  H05K3/40 ,  H05K3/46

CPC分类号： H01G4/232 ,  B32B18/00 ,  C04B2237/32 ,  C04B2237/62 ,  C04B2237/64 ,  C04B2237/68 ,  H05K1/0306 ,  H05K3/4061 ,  H05K3/4623 ,  H05K3/4629 ,  H05K2203/061

摘要： A first laminate block including inner conductors is manufactured, and thin holes are formed in the first laminate block so as to extend between top and bottom surfaces of the first laminate block. The thin holes are filled with conductive paste to form via holes. Then, a ceramic sheet layer is laminated on the bottom surface of the first laminate block, and a second laminate block including inner conductors is laminated on the bottom surface of the ceramic sheet layer to obtain a laminate body. Then, thin holes are formed in the laminate body so as to extend between top and bottom surfaces of the laminate body, and are filled with conductive paste to obtain through via hole.

摘要翻译： 制造包括内部导体的第一层压块，并且在第一层压块中形成细孔，以便在第一层压块的顶表面和底表面之间延伸。 细孔填充有导电膏以形成通孔。 然后，在第一层叠块的底面层叠陶瓷片层，在陶瓷片层的底面层叠包含内导体的第二层叠块，得到层叠体。 然后，在层压体中形成薄壁，以便在层压体的顶面和底面之间延伸，并且填充有导电膏以获得通孔。

公开(公告)号：US07894202B2

公开(公告)日：2011-02-22

申请号：US11836601

申请日：2007-08-09

申请人： Hidetaka Fukudome ,  Masaaki Taniguchi

发明人： Hidetaka Fukudome ,  Masaaki Taniguchi

IPC分类号： H05K1/18

CPC分类号： H01G4/232 ,  H01G4/30 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/15313 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/185 ,  H05K2201/10712 ,  Y10T29/435

摘要： A multilayer capacitor includes a laminate of ceramic layers, and a capacitor unit provided in the laminate. In the multilayer capacitor, the relationships P≧Ra and P≧W are established, wherein P represents the average projection height of first and second via conductors from the upper surface, Ra represents the surface roughness of the upper surface, and W represents an amount of curvature of the laminate. Further, the projecting portions of the first and second via conductors projecting from the upper surface are buried in first and second external electrodes, respectively.

摘要翻译： 多层电容器包括陶瓷层的层压体和设置在层叠体中的电容器单元。 在层叠电容器中，建立了P≥Ra和P≥W的关系，其中P表示第一和第二通孔导体从上表面的平均突出高度，Ra表示上表面的表面粗糙度，W表示 的层叠体的曲率。 此外，从上表面突出的第一和第二通孔导体的突出部分分别埋在第一和第二外部电极中。

公开(公告)号：US09236184B2

公开(公告)日：2016-01-12

申请号：US13437971

申请日：2012-04-03

申请人： Hidetaka Fukudome

发明人： Hidetaka Fukudome

IPC分类号： H01K3/10 ,  H01R43/00 ,  H05K3/00 ,  H05K3/36 ,  H01G4/30 ,  H01L27/108 ,  H01L29/94 ,  H01G4/12 ,  H01G4/232 ,  H01L23/50

CPC分类号： H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L23/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/3011 ,  Y10T29/435 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： In a method for manufacturing a monolithic ceramic electronic component, when an inner conductor is formed by printing an electrically conductive paste, a smear may be generated in an opening of the inner conductor at a side of the opening near to a position from which printing is started in a printing direction. The smear may cause an unwanted contact between the inner conductor and a via conductor, which is a conductor extending through the opening and having a potential different from that of the inner conductor, so as to cause a short-circuit. The inner conductor is printed such that the center of each via conductor is deviated from the center of the opening in the direction in which the electrically conductive paste is printed. With this structure, even if the smear is generated in the opening, the probability of a short-circuit is minimized.

摘要翻译： 在制造单体陶瓷电子部件的方法中，当通过印刷导电性糊剂形成内部导体时，可以在开口侧的内侧导体的开口部附近产生污迹，接近印刷位置 从打印方向开始。 涂抹可能导致内部导体和通孔导体之间的不期望的接触，通孔导体是延伸穿过开口并具有不同于内部导体的电位的导体，从而导致短路。 内部导体被印刷成使得每个通孔导体的中心沿着印刷导电浆料的方向从开口的中心偏离。 利用这种结构，即使在开口中产生拖尾，短路的概率也被最小化。

公开(公告)号：US08174815B2

公开(公告)日：2012-05-08

申请号：US12504831

申请日：2009-07-17

申请人： Hidetaka Fukudome

发明人： Hidetaka Fukudome

IPC分类号： H01G4/00

CPC分类号： H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01L23/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/3011 ,  Y10T29/435 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： In a method for manufacturing a monolithic ceramic electronic component, when an inner conductor is formed by printing an electrically conductive paste, a smear may be generated in an opening of the inner conductor at a side of the opening near to a position from which printing is started in a printing direction. The smear may cause an unwanted contact between the inner conductor and a via conductor, which is a conductor extending through the opening and having a potential different from that of the inner conductor, and cause a short-circuit. The inner conductor is printed in such a manner that the center of each of the via conductors is deviated from the center of the opening in the direction in which the electrically conductive paste is printed. With this structure, even if the smear is generated in the opening, the probability that the inner conductor contact the via conductor and cause a short-circuit is minimized.

摘要翻译： 在制造单体陶瓷电子部件的方法中，当通过印刷导电性糊剂形成内部导体时，可以在开口侧的内侧导体的开口部附近产生污迹，接近印刷位置 从打印方向开始。 涂抹可能导致内部导体和通孔导体之间的不期望的接触，该通孔导体是延伸穿过开口并具有不同于内部导体的电位的导体，并且导致短路。 内部导体被印刷成使得每个通孔导体的中心沿着印刷导电浆料的方向从开口的中心偏离。 利用这种结构，即使在开口中产生污迹，内部导体与通孔导体接触并引起短路的可能性也被最小化。