ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    电子设备及其制造方法

    公开(公告)号:US20120103666A1

    公开(公告)日:2012-05-03

    申请号:US13238413

    申请日:2011-09-21

    CPC classification number: H05K3/361 H05K3/321

    Abstract: An electronic device includes a first substrate on which a thin-film circuit layer is provided at a side of a first face, a second substrate on which a wiring layer is provided, and an isotropic conductive material which electrically connects a terminal portion of the thin-film circuit layer and the wiring layer. In the electronic device, the conductive material is in film-formed from on the terminal portion to on the wiring layer. When the terminal portion of the thin-film circuit layer and the wiring layer of a connection substrate are electrically connected to each other, the terminal portion is not required to be excessively pressurized and heated. Therefore, the terminal portion can be prevented from being damaged.

    Abstract translation: 电子设备包括:第一基板,在第一基板的一侧设置有薄膜电路层,在其上设置有布线层的第二基板,以及电连接薄片的端子部分的各向同性导电材料 膜电路层和布线层。 在电子设备中,导电材料从端子部分到布线层成膜。 当薄膜电路层的端子部分和连接基板的布线层彼此电连接时,端子部分不需要被过度加压和加热。 因此,能够防止端子部的损伤。

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