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公开(公告)号：US12078546B2
公开(公告)日：2024-09-03
申请号：US18324917
申请日：2023-05-26
申请人： Calumino Pty Ltd.
发明人： Gabrielle de Wit , Marek Steffanson
CPC分类号： G01J5/20 , G01J1/0414 , G01J1/44 , G01J5/0225 , G01J5/40 , G02B26/0833 , G02B26/085 , G02B26/0866 , G01J2005/0077 , G01J2005/106
摘要： Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.
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公开(公告)号：US20240272004A1
公开(公告)日：2024-08-15
申请号：US18108154
申请日：2023-02-10
发明人： Enri DUQI , Giorgio ALLEGATO
CPC分类号： G01J5/10 , B81B7/0038 , B81B7/007 , B81C1/00285 , B81C1/00301 , B81B2201/0278 , B81B2207/012 , B81B2207/07 , B81B2207/097 , B81C2203/0109 , B81C2203/0792 , G01J2005/106
摘要： Disclosed herein is a method of forming a thermal sensor, including patterning an active layer on a first face of a handle substrate to form a frame, a mass carrying at least one thermally isolated MOS (TMOS) transistor, and a spring structure connecting the mass to the frame while thermally isolating the mass from the frame. The frame is then bonded to pads on a first face of an integrated circuit substrate. The handle substrate is removed, and a top cap is bonded to the first face of the integrated circuit substrate to enclose at least the mass and spring within the sealed cavity.
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公开(公告)号：US20230304868A1
公开(公告)日：2023-09-28
申请号：US18324917
申请日：2023-05-26
申请人： Calumino Pty Ltd.
发明人： Gabrielle de Wit , Marek Steffanson
CPC分类号： G01J5/20 , G01J5/0225 , G01J5/40 , G02B26/0866 , G02B26/085 , G01J1/0414 , G01J1/44 , G02B26/0833 , G01J2005/106
摘要： Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.
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公开(公告)号：US11754447B2
公开(公告)日：2023-09-12
申请号：US17874845
申请日：2022-07-27
申请人： Calumino Pty Ltd.
发明人： Gabrielle de Wit
CPC分类号： G01J5/20 , G01J1/0414 , G01J1/44 , G01J5/0225 , G01J5/40 , G02B26/085 , G02B26/0833 , G02B26/0866 , G01J2005/0077 , G01J2005/106
摘要： Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The radiation sensing apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit can include a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can also include an enclosure configured to enclose at least the beamsplitter and a light source. With the apparatuses, the light source can be attached to a printed circuit board (PCB). Also, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter.
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5.发明公开公开(公告)号：US20230213389A1
公开(公告)日：2023-07-06
申请号：US17996125
申请日：2021-04-14
发明人： Geoffroy DUMONT , Jean-Jacques YON
CPC分类号： G01J5/045 , G01J5/10 , G01J5/046 , G01J5/0225 , B81B7/0051 , B81C1/00325 , G01J2005/106 , B81B2201/0278 , B81B2203/0127 , B81C2201/0109 , B81C2201/0133
摘要： The invention relates to a method for fabricating a detection device, comprising the following steps: producing thermal detectors and an encapsulating structure by way of mineral sacrificial layers; partially removing the mineral sacrificial layers, by wet chemical etching in an acid medium, so as to free the thermal detectors and to obtain a peripheral wall, and to free an upper portion of the encapsulating thin layer; the peripheral wall then having a lateral recess resulting in a vertical enlargement of the cavity, between the readout substrate and the upper portion, this lateral recess defining an intermediate area; producing reinforcing pillars, arranged in the intermediate area around the matrix-array of thermal detectors.
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公开(公告)号：US20180356289A1
公开(公告)日：2018-12-13
申请号：US16001844
申请日：2018-06-06
发明人： Kin Chung Fong
CPC分类号： G01J5/0806 , G01J1/42 , G01J1/44 , G01J5/0803 , G01J5/0818 , G01J5/0837 , G01J5/20 , G01J2005/106 , H01L29/1606
摘要： A bolometer. In one embodiment a graphene sheet is configured to absorb electromagnetic waves. The graphene sheet has two contacts connected to an amplifier, and a power detector connected to the amplifier. Electromagnetic power in the evanescent electromagnetic waves is absorbed in the graphene sheet, heating the graphene sheet. The power of Johnson noise generated at the contacts is proportional to the temperature of the graphene sheet. The Johnson noise is amplified and the power in the Johnson noise is used as a measure of the temperature of the graphene sheet, and of the amount of electromagnetic wave power absorbed by the graphene sheet.
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公开(公告)号：US20180283956A1
公开(公告)日：2018-10-04
申请号：US15997836
申请日：2018-06-05
发明人： Carl VAN BUGGENHOUT , Ben MAES , Karel VANROYE , Stijn REEKMANS
CPC分类号： G01J5/06 , G01J5/045 , G01J5/10 , G01J2005/0048 , G01J2005/065 , G01J2005/067 , G01J2005/106
摘要： An infrared sensor assembly for sensing infrared radiation comprises infrared sensing elements and the infrared sensing compensation elements that are different so that, for a same flux on the infrared sensing elements and the infrared sensing compensation elements, the radiation responsive element of the infrared sensing elements absorbs more radiation than the radiation responsive element of the infrared sensing compensation elements, as to receive substantially more radiation than the radiation responsive element of the infrared sensing compensation elements. An output of the sensor array is a subtractive function of a sum of the signals of the plurality of infrared sensing elements and a sum of the signals of the plurality of the infrared sensing compensation elements such that at least linear and/or non-linear parasitic thermal fluxes are at least partly compensated for.
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公开(公告)号：US09933310B2
公开(公告)日：2018-04-03
申请号：US14794591
申请日：2015-07-08
发明人： Kin Chung Fong
CPC分类号： G01J5/0818 , G01J1/42 , G01J1/44 , G01J5/20 , G01J2005/106 , H01L29/1606
摘要： An infrared bolometer. In one embodiment a waveguide configured to transmit infrared radiation is arranged to be adjacent a graphene sheet and configured so that evanescent waves from the waveguide overlap the graphene sheet. The graphene sheet has two contacts connected to an amplifier, and a power detector connected to the amplifier. Infrared electromagnetic power in the evanescent waves is absorbed in the graphene sheet, heating the graphene sheet. The power of Johnson noise generated at the contacts is proportional to the temperature of the graphene sheet. The Johnson noise is amplified and the power in the Johnson noise is used as a measure of the temperature of the graphene sheet, and of the amount of infrared power propagating in the waveguide.
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公开(公告)号：US09906736B2
公开(公告)日：2018-02-27
申请号：US14530810
申请日：2014-11-02
发明人： Edward Patton , Robert Benson
CPC分类号： H04N5/33 , F41G1/32 , F41G3/165 , F41J5/10 , G01J5/10 , G01J2005/0077 , G01J2005/0081 , G01J2005/106 , G02B23/14
摘要： A sight attachable to a weapon and comprising an objective lens, an image display, and a digital reticle. The objective lens focuses infrared light received from a scene onto a thermal imager, which is comprised of a focal plane array that detects infrared radiation in the scene focused by the lens. The image display is in signal communication with the thermal imager and provides an image of the received infrared light from the scene. The image rendered by the display is visible to the user. The digital reticle is rendered on the display and provides an aim point of the weapon upon a target in the scene. The image of the scene and superimposed reticle are directly viewable by a user with the aim point of the weapon upon the target being maintained constant over a range of viewing angles that depart from a viewing angle perpendicular to the display.
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公开(公告)号：US09810581B1
公开(公告)日：2017-11-07
申请号：US14810363
申请日：2015-07-27
发明人： Marek Steffanson
CPC分类号： G01J5/20 , G01J5/0225 , G01J5/023 , G01J5/024 , G01J5/10 , G01J5/40 , G01J2005/0077 , G01J2005/106
摘要： Systems, methods, and apparatus for providing an improved electromagnetic radiation sensing micromechanical device to be utilized in high pixel-density pixel sensor arrays. The device includes an improved design for improved and adjustable performance through simple geometric or fabrication means. Furthermore, the design of the device lends itself to simple micromechanical manufacturing procedures. Additionally, the manufacturing procedures include a method to enable high uniformity and high yield sensor arrays. Arrays of the device can be utilized as IR imaging detectors for use in applications such as human presence detection, nonvisual environment monitoring, security and safety, surveillance, energy monitoring, fire detection and people counting.
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