DEVICES FOR COOLING AND POWER
    2.
    发明申请
    DEVICES FOR COOLING AND POWER 审中-公开
    冷却和动力装置

    公开(公告)号:US20090139244A1

    公开(公告)日:2009-06-04

    申请号:US11948639

    申请日:2007-11-30

    IPC分类号: F25B21/02 F25B21/00 B21D53/02

    摘要: Certain embodiments disclosed herein are directed to devices for cooling. In certain examples, a thermoelectric device comprising a substrate and a superlattice coupled to the substrate is disclosed. In some examples, the superlattice includes a first semi-conducting material and a second semi-conducting material coupled to the first semi-conducting material to provide an interface between the first and second semi-conducting materials.

    摘要翻译: 本文公开的某些实施例涉及用于冷却的装置。 在某些实例中,公开了一种包括衬底和耦合到衬底的超晶格的热电器件。 在一些示例中,超晶格包括耦合到第一半导体材料的第一半导体材料和第二半导体材料,以提供第一和第二半导电材料之间的界面。