公开(公告)号：US20100062273A1

公开(公告)日：2010-03-11

申请号：US12525309

申请日：2008-02-18

申请人： Hiroaki Makabe ,  Koji Terakawa

发明人： Hiroaki Makabe ,  Koji Terakawa

IPC分类号： B32B27/06 ,  C08J3/28 ,  B32B9/04

CPC分类号： H01L21/02118 ,  C08G73/10 ,  C08G73/22 ,  C08L79/04 ,  C08L79/08 ,  G03F7/022 ,  G03F7/0233 ,  H01L21/02282 ,  H01L21/312 ,  Y10T428/31721

摘要： A photosensitive resin composition includes an alkali-soluble resin having a polybenzoxazol precursor structure or a polyimide precursor structure, or both, and a photosensitizer, the alkali-soluble resin having a ratio ([A]/[B]) of a cyclization rate [A] (%) at 250° C. to a cyclization rate [B] (%) at 300° C. of 0.70 or more. According to the present invention, a photosensitive resin composition which is highly sensitive and has high productivity in the manufacture of semiconductor devices, a cured film, a protective film, an insulating film, and a semiconductor device and a display device using the cured film can be provided.

摘要翻译： 光敏树脂组合物包括具有聚苯并恶唑前体结构的碱溶性树脂或聚酰亚胺前体结构，或二者均为光敏剂，所述碱溶性树脂的环化速率[（A] / [B]）为[ A]（％）在300℃下的环化速率[B]（％）为0.70以上。 根据本发明，在半导体器件，固化膜，保护膜，绝缘膜和半导体器件的制造中具有高灵敏度和高生产率的感光性树脂组合物以及使用该固化膜的显示装置 提供。

公开(公告)号：US20100044888A1

公开(公告)日：2010-02-25

申请号：US12446751

申请日：2007-10-23

申请人： Koji Terakawa

发明人： Koji Terakawa

IPC分类号： H01L23/29 ,  C07C211/55 ,  C08G65/38 ,  G03F7/004

CPC分类号： G03F7/0226 ,  C08G73/1025 ,  C08G73/18 ,  Y10T428/10

摘要： A bis(aminophenol) derivative having substituents at positions adjacent to two amino groups is provided. The bis(aminophenol) derivative is used as a raw material of a polyamide resin for a positive-tone photosensitive resin composition. A polyamide resin comprising bis(aminophenol) and a structure derived from a carboxylic acid is also provided, the bis(aminophenol) having substituents at positions adjacent to the two amino groups. A positive-tone photosensitive resin composition comprising a polybenzooxazole precursor resin, exhibiting high sensitivity and a high cyclization rate even when cured at a low temperature is provided. Also provided is a positive-tone photosensitive resin composition comprising a polyamide resin having an imide structure, an imide precursor structure, or an amide acid ester structure. The composition exhibits high sensitivity and produces a cured product having low water absorption even when cured at a low temperature.

摘要翻译： 提供了在与两个氨基相邻的位置具有取代基的双（氨基苯酚）衍生物。 双（氨基苯酚）衍生物用作正性感光性树脂组合物的聚酰胺树脂的原料。 还提供了包含双（氨基苯酚）和衍生自羧酸的结构的聚酰胺树脂，双（氨基苯酚）在与两个氨基相邻的位置具有取代基。 提供包含聚苯并恶唑前体树脂的正性感光性树脂组合物，即使在低温下固化也表现出高灵敏度和高环化率。 还提供了包含具有酰亚胺结构的酰亚胺树脂，酰亚胺前体结构或酰胺酸酯结构的正性感光性树脂组合物。 组合物表现出高灵敏度，并且即使在低温下固化也产生具有低吸水性的固化产物。

公开(公告)号：US08269358B2

公开(公告)日：2012-09-18

申请号：US12446751

申请日：2007-10-23

申请人： Koji Terakawa

发明人： Koji Terakawa

IPC分类号： H01L23/29 ,  C07C211/55 ,  C08G65/38 ,  G03F7/004

CPC分类号： G03F7/0226 ,  C08G73/1025 ,  C08G73/18 ,  Y10T428/10

摘要： A bis(aminophenol) derivative having substituents at positions adjacent to two amino groups is provided. The bis(aminophenol) derivative is used as a raw material of a polyamide resin for a positive-tone photosensitive resin composition. A polyamide resin comprising bis(aminophenol) and a structure derived from a carboxylic acid is also provided, the bis(aminophenol) having substituents at positions adjacent to the two amino groups. A positive-tone photosensitive resin composition comprising a polybenzooxazole precursor resin, exhibiting high sensitivity and a high cyclization rate even when cured at a low temperature is provided. Also provided is a positive-tone photosensitive resin composition comprising a polyamide resin having an imide structure, an imide precursor structure, or an amide acid ester structure. The composition exhibits high sensitivity and produces a cured product having low water absorption even when cured at a low temperature.

摘要翻译： 提供了在与两个氨基相邻的位置具有取代基的双（氨基苯酚）衍生物。 双（氨基苯酚）衍生物用作正性感光性树脂组合物的聚酰胺树脂的原料。 还提供了包含双（氨基苯酚）和衍生自羧酸的结构的聚酰胺树脂，双（氨基苯酚）在与两个氨基相邻的位置具有取代基。 提供包含聚苯并恶唑前体树脂的正性感光性树脂组合物，即使在低温下固化也表现出高灵敏度和高环化率。 还提供了包含具有酰亚胺结构的酰亚胺树脂，酰亚胺前体结构或酰胺酸酯结构的正性感光性树脂组合物。 组合物表现出高灵敏度，并且即使在低温下固化也产生具有低吸水性的固化产物。