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    Powder coating composition
    1.
    发明授权
    Powder coating composition 有权
    粉末涂料组合物

    公开(公告)号：US06239215B1

    公开(公告)日：2001-05-29

    申请号：US09274337

    申请日：1999-03-23

    申请人： Hirokazu Morita ,  Tatsuo Fujii ,  Hiroyuki Shiraki

    发明人： Hirokazu Morita ,  Tatsuo Fujii ,  Hiroyuki Shiraki

    IPC分类号： C09D503

    CPC分类号： C09D5/03 ,  C09D5/031

    摘要： A powder coating composition comprising a multilayer polymer particle, in which at least one inner layer is a polymer layer having a glass transition temperature (Tg) of not over 20° C. and the outermost layer is a polymer layer having a Tg of not less than 60° C. and, the monomer components forming the polymer layer having a Tg of not over 20° C. are those having an unsaturated double bond in the molecule, and among the monomer components, a crosslinking monomer and a grafting monomer are used, respectively, within the ranges of 0.3 to 5 weight % and of 1 to 10 weight %, is dispersed in an amount of 1 to 30 parts by weight per 100 parts by weight of the total components other than the multilayer polymer particle can show excellent dispersibility to various powder coatings and can improve workability and impact resistance of a coat film while maintaining inherent characteristics of a powder coating such as appearance of a coat film and an anti-blocking property.

    摘要翻译： 一种粉末涂料组合物，其包含多层聚合物颗粒，其中至少一层内层是玻璃化转变温度（Tg）不超过20℃的聚合物层，最外层是Tg不低于 60℃以上，形成Tg不高于20℃的聚合物层的单体成分是分子中具有不饱和双键的单体成分，单体成分中使用交联单体和接枝单体 分别在0.3〜5重量％和1〜10重量％的范围内，相对于多层聚合物粒子以外的总成分100重量份，以1〜30重量份的量分散，能够显示优异的 可分散到各种粉末涂料中，并且可以提高涂膜的可加工性和抗冲击性，同时保持涂层的外观和防粘连性等粉末涂料的固有特性。

    Capacitor
    2.
    发明授权
    Capacitor 失效
    电容器

    公开(公告)号：US07443655B2

    公开(公告)日：2008-10-28

    申请号：US11597812

    申请日：2005-07-07

    申请人： Katsumasa Miki ,  Tatsuo Fujii ,  Yuji Midou ,  Suzushi Kimura

    发明人： Katsumasa Miki ,  Tatsuo Fujii ,  Yuji Midou ,  Suzushi Kimura

    IPC分类号： H01G5/38 ,  H01G4/228

    CPC分类号： H01G9/042 ,  H01G9/012 ,  H01G9/048

    摘要： A capacitor includes a first capacitor element and a second capacitor element laminated on this first capacitor element. The first capacitor element is a solid electrolytic capacitor including a through-hole electrode penetrating a valve metal sheet and having one surface on which cathode and anode terminal portions are taken out. The second capacitor element has first and second electrodes which are provided via a dielectric layer, and second through-hole electrodes penetrating the dielectric layer. The second through-hole electrodes are coupled to the first electrode and insulated from the second electrode. Lead-out portions of the second electrodes are exposed from the dielectric layer. The second through-hole electrodes and the lead-out portions are disposed alternately. The first electrode is electrically coupled to the first through-hole electrode and the second electrode is electrically coupled to the valve metal sheet.

    摘要翻译： 电容器包括层叠在该第一电容器元件上的第一电容器元件和第二电容器元件。 第一电容器元件是固体电解电容器，其包括穿透阀金属片的通孔电极，并且具有其上取出阴极和阳极端子部分的一个表面。 第二电容器元件具有通过电介质层提供的第一和第二电极，以及穿过电介质层的第二通孔电极。 第二通孔电极耦合到第一电极并与第二电极绝缘。 第二电极的引出部分从电介质层露出。 第二通孔电极和引出部分交替设置。 第一电极电耦合到第一通孔电极，第二电极电耦合到阀金属片。

    Chip solid electrolytic capacitor
    3.
    发明授权
    Chip solid electrolytic capacitor 失效
    芯片固体电解电容器

    公开(公告)号：US07057882B2

    公开(公告)日：2006-06-06

    申请号：US11222964

    申请日：2005-09-12

    申请人： Tatsuo Fujii ,  Junichi Kurita ,  Yuji Midou ,  Tsuyoshi Yoshino

    发明人： Tatsuo Fujii ,  Junichi Kurita ,  Yuji Midou ,  Tsuyoshi Yoshino

    IPC分类号： H01G9/00 ,  H01G4/228 ,  H01G9/10

    CPC分类号： H01G9/012 ,  H01G9/042 ,  H01G9/08 ,  H01G9/14

    摘要： A chip solid electrolytic capacitor includes a capacitor element with an anode portion and a cathode portion, an anode lead frame, a cathode lead frame and packaging resin. The anode lead frame includes a first plane, an anode junction and an anode terminal. The anode junction is formed on one end of the first plane and connected to the anode portion. The anode terminal is formed on the other side of the first plane. The cathode lead frame has a second plane and a cathode terminal. The second plane has the cathode portion mounted thereon, is connected to the cathode portion, and is stacked on the first plane. The cathode terminal is formed on the same side of the second plane as the anode terminal. The packaging resin has a surface to be mounted and covers the capacitor element, with the anode terminal and the cathode terminal exposed on the surface to be mounted.

    摘要翻译： 芯片固体电解电容器包括具有阳极部分和阴极部分的电容器元件，阳极引线框架，阴极引线框架和封装树脂。 阳极引线框架包括第一平面，阳极结和阳极端子。 阳极结形成在第一平面的一端并连接到阳极部分。 阳极端子形成在第一平面的另一侧上。 阴极引线框架具有第二平面和阴极端子。 第二平面具有安装在其上的阴极部分，连接到阴极部分，并且堆叠在第一平面上。 阴极端子形成在与阳极端子相同的第二平面的一侧。 包装树脂具有要安装的表面并且覆盖电容器元件，阳极端子和阴极端子暴露在要安装的表面上。

    Chip solid electrolytic capacitor
    4.
    发明申请
    Chip solid electrolytic capacitor 失效
    芯片固体电解电容器

    公开(公告)号：US20060056136A1

    公开(公告)日：2006-03-16

    申请号：US11222964

    申请日：2005-09-12

    申请人： Tatsuo Fujii ,  Junichi Kurita ,  Yuji Midou ,  Tsuyoshi Yoshino

    发明人： Tatsuo Fujii ,  Junichi Kurita ,  Yuji Midou ,  Tsuyoshi Yoshino

    IPC分类号： H01G9/00

    CPC分类号： H01G9/012 ,  H01G9/042 ,  H01G9/08 ,  H01G9/14

    摘要： The chip solid electrolytic capacitor includes a capacitor element with an anode portion and a cathode portion, an anode lead frame, a cathode lead frame and packaging resin. The anode lead frame includes a first plane, an anode junction and an anode terminal. The anode junction is formed on one end of the first plane and connected to the anode portion. The anode terminal is formed on the other side of the first plane. The cathode lead frame has a second plane and a cathode terminal. The second plane mounts the cathode portion thereon and connected to the cathode portion, and is stacked on the first plane. The cathode terminal is formed on the same side of the second plane as the anode terminal. The packaging resin has a surface to be mounted and covers the capacitor element, with the anode terminal and the cathode terminal exposed on the surface to be mounted.

    摘要翻译： 芯片固体电解电容器包括具有阳极部分和阴极部分的电容器元件，阳极引线框架，阴极引线框架和封装树脂。 阳极引线框架包括第一平面，阳极结和阳极端子。 阳极结形成在第一平面的一端并连接到阳极部分。 阳极端子形成在第一平面的另一侧上。 阴极引线框架具有第二平面和阴极端子。 第二平面将阴极部分安装在其上并连接到阴极部分，并且堆叠在第一平面上。 阴极端子形成在与阳极端子相同的第二平面的一侧。 包装树脂具有要安装的表面并且覆盖电容器元件，阳极端子和阴极端子暴露在要安装的表面上。

    Easy opening film package and a method of preparing the same
    5.
    发明授权
    Easy opening film package and a method of preparing the same 失效
    易开封膜包装及其制备方法

    公开(公告)号：US5316209A

    公开(公告)日：1994-05-31

    申请号：US983406

    申请日：1992-11-30

    申请人： Maya Tomisawa ,  Shuji Higashi ,  Koji Sasagawa ,  Tatsuo Fujii

    发明人： Maya Tomisawa ,  Shuji Higashi ,  Koji Sasagawa ,  Tatsuo Fujii

    IPC分类号： B65B11/54 ,  B65D75/58 ,  B65D75/60 ,  B65D75/62 ,  B65D27/00 ,  B65D27/34

    CPC分类号： B65D75/5855 ,  Y10S229/923

    摘要： An easy opening film package for wrapping cubic or rectangular shaped articles is prepared from a film having a printed portion containing ink and a compatible thermoplastic resin on one surface of the film. The film is wrapped around the article and heat sealed in the area of overlap of the film ends. The printed portion extends to the ends of the film and across the film over a width substantially coextensive with the width of the face of the article on which the seal is to be located.

    摘要翻译： 用于包装立方体或矩形制品的容易开封薄膜包装由具有印刷部分的薄膜制成，所述印刷部分包含墨水和相容的热塑性树脂。 将薄膜缠绕在物品上并热封在膜端部重叠的区域。 印刷部分延伸到膜的端部并且跨过膜，其宽度基本上与要在其上定位密封件的物品的面的宽度共同延伸。

    Chip type solid electrolytic capacitor
    10.
    发明授权
    Chip type solid electrolytic capacitor 有权
    片式固体电解电容器

    公开(公告)号：US07778011B2

    公开(公告)日：2010-08-17

    申请号：US11719029

    申请日：2006-01-19

    申请人： Tatsuo Fujii ,  Junichi Kurita ,  Hiroshi Fujii ,  Tsuyoshi Yoshino

    发明人： Tatsuo Fujii ,  Junichi Kurita ,  Hiroshi Fujii ,  Tsuyoshi Yoshino

    IPC分类号： H01G9/00

    CPC分类号： H01G9/012 ,  H01G2/06 ,  H01G9/004 ,  H01G9/14 ,  H01G9/15

    摘要： A chip type solid electrolytic capacitor includes a capacitor element-laminate. In the capacitor element-laminate, a plurality of capacitor elements, each having an anode portion and a cathode portion, are laminated so that the anode portions of the adjacent capacitor elements are disposed in the direction opposite to each other. Anode lead terminals are joined to the bottom faces of the anode portions of the capacitor elements disposed at both ends of the capacitor element-laminate. A cathode lead terminal is joined to the bottom face of the cathode portion of the capacitor element disposed in the center of the capacitor element-laminate. An Electrically insulating exterior resin coats the capacitor element-laminate so as to expose at least a part of the bottom faces of the anode lead terminals and a part of the cathode lead terminal.

    摘要翻译： 芯片型固体电解电容器包括电容器元件层叠体。 在电容器元件层叠体中，层叠多个具有阳极部和阴极部的电容器元件，使得相邻的电容器元件的阳极部沿相反方向配置。 阳极引线端子连接到设置在电容器元件 - 层叠体的两端的电容器元件的阳极部分的底面。 阴极引线端子连接到设置在电容器元件 - 层叠体的中心的电容器元件的阴极部分的底面。 电绝缘外部树脂涂覆电容器元件层压体，以暴露阳极引线端子和阴极引线端子的一部分的至少一部分底面。