Radio frequency power amplifying module with hetero junction bipolar transistor
    1.
    发明授权
    Radio frequency power amplifying module with hetero junction bipolar transistor 有权
    具有异质结双极晶体管的射频功率放大模块

    公开(公告)号:US07486142B2

    公开(公告)日:2009-02-03

    申请号:US11618197

    申请日:2006-12-29

    IPC分类号: H03G3/30

    摘要: The present invention is directed to compensate electric properties of an RF power module depending on changes with time, temperature dependency, variations, and the like of grounded emitter current amplification factor of an HBT. A compound semiconductor integrated circuit supplies reference current of a reference HBT depending on hFE of an HBT to an input terminal of a first current mirror of a bias circuit of a silicon semiconductor integrated circuit. The base of an output HBT of the compound semiconductor integrated circuit is biased with bias current which increases in response to decrease in hFE of the HBT from an output of the first current mirror of the silicon semiconductor integrated circuit.

    摘要翻译: 本发明旨在根据HBT的接地发射极电流放大因子随时间,温度依赖性,变化等的变化来补偿RF功率模块的电性能。 化合物半导体集成电路将HBT的hFE的参考电流提供给硅半导体集成电路的偏置电路的第一电流镜的输入端。 化合物半导体集成电路的输出HBT的基极由偏置电流偏置,该偏置电流响应于HBT的hFE从硅半导体集成电路的第一电流镜的输出的减小而增加。

    RADIO FREQUENCY POWER AMPLIFYING MODULE WITH HETERO JUNCTION BIPOLAR TRANSISTOR
    2.
    发明申请
    RADIO FREQUENCY POWER AMPLIFYING MODULE WITH HETERO JUNCTION BIPOLAR TRANSISTOR 有权
    具有异质结双极晶体管的无线电频率功率放大模块

    公开(公告)号:US20070194852A1

    公开(公告)日:2007-08-23

    申请号:US11618197

    申请日:2006-12-29

    IPC分类号: H03G3/10

    摘要: The present invention is directed to compensate electric properties of an RF power module depending on changes with time, temperature dependency, variations, and the like of grounded emitter current amplification factor of an HBT. A compound semiconductor integrated circuit supplies reference current of a reference HBT depending on hFE of an HBT to an input terminal of a first current mirror of a bias circuit of a silicon semiconductor integrated circuit. The base of an output HBT of the compound semiconductor integrated circuit is biased with bias current which increases in response to decrease in hFE of the HBT from an output of the first current mirror of the silicon semiconductor integrated circuit.

    摘要翻译: 本发明旨在根据HBT的接地发射极电流放大因子随时间,温度依赖性,变化等的变化来补偿RF功率模块的电性能。 化合物半导体集成电路将HBT的hFE的参考电流提供给硅半导体集成电路的偏置电路的第一电流镜的输入端。 化合物半导体集成电路的输出HBT的基极由偏置电流偏置,该偏置电流响应于HBT的hFE从硅半导体集成电路的第一电流镜的输出的减小而增加。

    High frequency power amplifier circuit, high frequency power amplifier electronic component and method thereof
    8.
    发明授权
    High frequency power amplifier circuit, high frequency power amplifier electronic component and method thereof 有权
    高频功率放大器电路,高频功率放大器电子元件及其方法

    公开(公告)号:US07501896B2

    公开(公告)日:2009-03-10

    申请号:US11822183

    申请日:2007-07-03

    IPC分类号: H03F3/04

    摘要: A high frequency power amplifier electronic component (RF power module) is so constituted as to apply bias to an amplifier FET in current mirror configuration. In this RF power module, deviation of a bias point due to the short channel effect of the FET is corrected, and variation in high frequency power amplifier characteristics is reduced. The high frequency power amplifier circuit (RF power module) is so constituted that the bias voltage for the amplifier transistor in a high frequency power amplifier circuit is supplied from a bias transistor connected with the amplifier transistor in current mirror configuration. In addition to a pad (external terminal) connected with the control terminal of the amplifier transistor, a second pad is provided which is connected with the control terminal of the bias transistor connected with the amplifier transistor in current mirror configuration.

    摘要翻译: 高频功率放大器电子部件(RF功率模块)被构造成以当前反射镜配置向放大器FET施加偏压。 在该RF功率模块中,由于FET的短沟道效应导致​​的偏置点的偏差被校正,并且降低了高频功率放大器特性的变化。 高频功率放大器电路(RF功率模块)被构造成使得高频功率放大器电路中的放大器晶体管的偏置电压以与当前反射镜配置的放大器晶体管连接的偏置晶体管提供。 除了与放大器晶体管的控制端子连接的焊盘(外部端子)之外,还提供了第二焊盘,其以与电流镜配置的放大器晶体管连接的偏置晶体管的控制端子连接。

    High frequency power amplifier circuit, high frequency power amplifier electronic component and method thereof
    9.
    发明申请
    High frequency power amplifier circuit, high frequency power amplifier electronic component and method thereof 有权
    高频功率放大器电路,高频功率放大器电子元件及其方法

    公开(公告)号:US20080191806A1

    公开(公告)日:2008-08-14

    申请号:US11822183

    申请日:2007-07-03

    IPC分类号: H03F3/04

    摘要: A high frequency power amplifier electronic component (RF power module) is so constituted as to apply bias to an amplifier FET in current mirror configuration. In this RF power module, deviation of a bias point due to the short channel effect of the FET is corrected, and variation in high frequency power amplifier characteristics is reduced. The high frequency power amplifier circuit (RF power module) is so constituted that the bias voltage for the amplifier transistor in a high frequency power amplifier circuit is supplied from a bias transistor connected with the amplifier transistor in current mirror configuration. In addition to a pad (external terminal) connected with the control terminal of the amplifier transistor, a second pad is provided which is connected with the control terminal of the bias transistor connected with the amplifier transistor in current mirror configuration.

    摘要翻译: 高频功率放大器电子部件(RF功率模块)被构造成以当前反射镜配置向放大器FET施加偏压。 在该RF功率模块中,由于FET的短沟道效应导致​​的偏置点的偏差被校正,并且降低了高频功率放大器特性的变化。 高频功率放大器电路(RF功率模块)被构造成使得高频功率放大器电路中的放大器晶体管的偏置电压以与当前反射镜配置的放大器晶体管连接的偏置晶体管提供。 除了与放大器晶体管的控制端子连接的焊盘(外部端子)之外,还提供了第二焊盘,其以与电流镜配置的放大器晶体管连接的偏置晶体管的控制端子连接。

    High frequency power amplifier circuit, high frequency power amplifier electronic component and method thereof
    10.
    发明授权
    High frequency power amplifier circuit, high frequency power amplifier electronic component and method thereof 有权
    高频功率放大器电路,高频功率放大器电子元件及其方法

    公开(公告)号:US07245184B2

    公开(公告)日:2007-07-17

    申请号:US10858373

    申请日:2004-06-02

    IPC分类号: H03F3/04

    摘要: A high frequency power amplifier electronic component (RF power module) is so constituted as to apply bias to an amplifier FET in current mirror configuration. In this RF power module, deviation of a bias point due to the short channel effect of the FET is corrected, and variation in high frequency power amplifier characteristics reduced. The high frequency power amplifier circuit (RF power module) is so constituted that the bias voltage for the amplifier transistor in a high frequency power amplifier circuit is supplied from a bias transistor connected with the amplifier transistor in current mirror configuration. In addition to a pad (external terminal) connected with the control terminal of the amplifier transistor, a second pad is provided which is connected with the control terminal of the bias transistor connected with the amplifier transistor in current mirror configuration.

    摘要翻译: 高频功率放大器电子部件(RF功率模块)被构造成以当前反射镜配置向放大器FET施加偏压。 在该RF功率模块中,校正了由于FET的短沟道效应引起的偏置点的偏差,并且降低了高频功率放大器特性的变化。 高频功率放大器电路(RF功率模块)被构造成使得高频功率放大器电路中的放大器晶体管的偏置电压以与当前反射镜配置的放大器晶体管连接的偏置晶体管提供。 除了与放大器晶体管的控制端子连接的焊盘(外部端子)之外,还提供了第二焊盘,其以与电流镜配置的放大器晶体管连接的偏置晶体管的控制端子连接。