摘要:
Expandable styrene resin beads are described, which, when expanded to a bulk density of 20 g/l, give pre-expanded beads in which the number of cells present along those surface parts of radii which range from the bead surface to a depth of 0.2 mm from the surface is from 3 to 20 per mm and the number of cells present along those inner parts of the radii which range from a depth of 1 mm from the bead surface to the bead center is 10 or larger per mm, the number of cells present along said surface parts being smaller than the number of cells present along said inner parts.
摘要:
An expandable styrene resin bead containing voids therein, wherein the number of the voids present in the area from the surface of the bead to a depth of 0.1 mm along the radial direction is not more than 100 per mm.sup.2 as counted on a cross section passing through approximately the center of the bead. A process for producing expandable styrene resin beads by suspension polymerization is also disclosed in which a styrene monomer is suspended in an aqueous medium in the presence of an initiator and a suspending agent, and a blowing agent is incorporated into polymer beads produced, wherein an alkali metal salt or ammonium salt of persulfuric acid is added to the reaction system in an amount of 0.5 to 30 ppm based on the aqueous medium while the degree of conversion of said monomer is in the range of from 0 to 30%, and an electrolyte is added to the reaction system in a concentration of 0.02 to 5.0 mol/l based on the aqueous medium when the degree of conversion is 30% or higher. The expandable styrene resin bead does not require aging and, when pre-expanded, show little variation in the state of the cells, i.e., expandable styrene resin beads which hardly undergo influences of storage conditions.
摘要:
Expandable styrene resin beads are described, which, when expanded to a bulk density of 20 g/l, give pre-expanded beads in which the number of cells present along those surface parts of radii which range from the bead surface to a depth of 0.2 mm from the surface is from 3 to 20 per mm and to the bead center is 10 or larger per mm, the number of the number of cells present along those inner parts of the radii which range from a depth of 1 mm from the bead surface to the bead center is 10 or larger per mm, the number of cells present along said surface parts being smaller than the number of cells present along said inner parts.
摘要:
A semiconductor device includes an interelectrode insulating film formed between a charge storage layer and a control electrode layer. The interelectrode insulating film is formed in a first region above an upper surface of an element isolation insulating film, a second region along a sidewall of the charge storage layer, and a third region above an upper surface of the charge storage layer. The interelectrode insulating film includes a first stack including a first silicon nitride film or a high dielectric constant film interposed between a first and a second silicon oxide film or a second stack including a second high dielectric constant film and a third silicon oxide film, and a second silicon nitride film formed between the control electrode layer and the first or the second stack. The second silicon nitride film is relatively thinner in the third region than in the first region.
摘要:
According to one embodiment, a nonvolatile semiconductor memory device includes a semiconductor region, a tunnel insulator provided above the semiconductor region, a charge storage insulator provided above the tunnel insulator, a block insulator provided above the charge storage insulator, a control gate electrode provided above the block insulator, and an interface region including a metal element, the interface region being provided at one interface selected from between the semiconductor region and the tunnel insulator, the tunnel insulator and the charge storage insulator, the charge storage insulator and the block insulator, and the block insulator and the control gate electrode.
摘要:
According to one embodiment, a method for manufacturing a semiconductor device includes: forming an underlayer film that contains atoms selected from the group consisting of aluminum, boron and alkaline earth metal; and forming a silicon oxide film on the underlayer film by a CVD method or an ALD method by use of a silicon source containing at least one of an ethoxy group, a halogen group, an alkyl group and an amino group, or a silicon source of a siloxane system.
摘要:
[Problem]An object of the present invention is to provide an image processing apparatus used for acquisition assistance of optimal low-resolution image set for super-resolution processing.[Means for solving the problem]The image processing apparatus of the present invention comprises a processing unit for computing displacement amounts between a basis image and each reference image, a processing unit for generating a plurality of deformed images based on the displacement amounts, the basis image and a plurality of reference images, a processing unit for setting a threshold of a parameter used at the time of image information selection, a processing unit for selecting image information used in the super-resolution processing from the reference image by using the threshold of the parameter, a processing unit for generating composed images and weighted images based on the basis image, the displacement amounts and the image information, a processing unit for generating high-resolution grid images by dividing the composed image by the weighted image, a processing unit for generating simplified interpolation images based on high-resolution grid images, a processing unit for generating assistance images, a display unit for displaying the assistance images, and a control unit that respectively controls a processing concerning the image input, a processing concerning the basis image selection, a processing concerning the reference image selection and a processing concerning the threshold setting of the parameter as necessary.
摘要:
A semiconductor device includes a semiconductor substrate, a first insulating film formed on the semiconductor substrate, a charge storage layer formed on the first insulating film, a second insulating film formed on the charge storage layer, and a control electrode formed on the second insulating film, the second insulating film including a lower silicon nitride film, a lower silicon oxide film formed on the lower silicon nitride film, an intermediate insulating film formed on the lower silicon oxide film and containing a metal element, the intermediate insulating film having a relative dielectric constant of greater than 7, an upper silicon oxide film formed on the intermediate insulating film, and an upper silicon nitride film formed on the upper silicon oxide film.
摘要:
A protocol converting unit stores identification information for identifying a transfer path for data in a second network and a transmission source address specified in a packet in a corresponding manner. A failure detecting unit detects a transfer path in which a failure has occurred in the second network. A dummy-packet transmitting unit obtains a transmission source address corresponding to identification information of the transfer path in which the failure is detected, and transmits a dummy packet in which the obtained transmission source address is specified as the transmission source address to a first network.
摘要:
An object of the present invention is to provide a curable composition excellent in on-site formability, excellent in heat resistance, chemical resistance and oil resistance, and low in compression set. The invention relates to a curable composition comprising (a) a vinyl-based polymer containing at least one (meth)acryloyl group in a molecule thereof and having a number average molecular weight of 500 to 1,000,000, (b) an ethylenic unsaturated group-containing compound, (c) a thixotropic property-imparting agent, (d) fumed silica surface-treated with a (meth)acryloyl group-containing silane and (e) a photopolymerization initiator.