公开(公告)号：US08550875B2

公开(公告)日：2013-10-08

申请号：US13474898

申请日：2012-05-18

申请人： Hiroomi Torii ,  Hiroaki Nishida ,  Hiroyuki Kaneko ,  Misao Date ,  Takashi Mitsuya ,  Takamasa Nakamura

发明人： Hiroomi Torii ,  Hiroaki Nishida ,  Hiroyuki Kaneko ,  Misao Date ,  Takashi Mitsuya ,  Takamasa Nakamura

IPC分类号： B24B49/00

CPC分类号： H01L21/67751 ,  B24B37/345

摘要： A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.

公开(公告)号：US20120231703A1

公开(公告)日：2012-09-13

申请号：US13474898

申请日：2012-05-18

申请人： Hiroomi Torii ,  Hiroaki Nishida ,  Hiroyuki Kaneko ,  Misao Date ,  Takashi Mitsuya ,  Takamasa Nakamura

发明人： Hiroomi Torii ,  Hiroaki Nishida ,  Hiroyuki Kaneko ,  Misao Date ,  Takashi Mitsuya ,  Takamasa Nakamura

IPC分类号： B24B51/00

CPC分类号： H01L21/67751 ,  B24B37/345

摘要： A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.

摘要翻译： 一种操作基板处理装置的方法，在装置中发生非致命故障时，使得可以继续进行基板的部分装置操作以清洁和恢复基板或者容易地从装置排出基板，而不停止 整个设备，从而降低了衬底变得不可处理的风险。 操作具有研磨部，清洗部和转印机构的基板处理装置的方法包括：根据所述部位，在检测到所述研磨部，所述清洗部和所述转印机构中的任何一个的故障的情况下对基板进行分类 的故障和基板在基板处理装置中的位置; 并且在检测到故障之后对每个基板执行操作，该操作根据基板的分类而变化。

公开(公告)号：US08202139B2

公开(公告)日：2012-06-19

申请号：US12320251

申请日：2009-01-22

申请人： Hiroomi Torii ,  Hiroaki Nishida ,  Hiroyuki Kaneko ,  Misao Date ,  Takashi Mitsuya ,  Takamasa Nakamura

发明人： Hiroomi Torii ,  Hiroaki Nishida ,  Hiroyuki Kaneko ,  Misao Date ,  Takashi Mitsuya ,  Takamasa Nakamura

IPC分类号： B24B49/00

CPC分类号： H01L21/67751 ,  B24B37/345

摘要： A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.

摘要翻译： 一种操作基板处理装置的方法，在装置中发生非致命故障时，使得可以继续进行基板的部分装置操作以清洁和恢复基板或者容易地从装置排出基板，而不停止 整个设备，从而降低了衬底变得不可处理的风险。 操作具有研磨部，清洗部和转印机构的基板处理装置的方法包括：根据所述部位，在检测到所述研磨部，所述清洗部和所述转印机构中的任何一个的故障的情况下对基板进行分类 的故障和基板在基板处理装置中的位置; 并且在检测到故障之后对每个基板执行操作，该操作根据基板的分类而变化。

公开(公告)号：US20090186557A1

公开(公告)日：2009-07-23

申请号：US12320251

申请日：2009-01-22

申请人： Hiroomi Torii ,  Hiroaki Nishida ,  Hiroyuki Kaneko ,  Misao Date ,  Takashi Mitsuya ,  Takamasa Nakamura

发明人： Hiroomi Torii ,  Hiroaki Nishida ,  Hiroyuki Kaneko ,  Misao Date ,  Takashi Mitsuya ,  Takamasa Nakamura

IPC分类号： B24B1/00 ,  B08B7/00

CPC分类号： H01L21/67751 ,  B24B37/345

摘要： A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus, thereby reducing the risk of a substrate becoming unprocessable. The method of operating a substrate processing apparatus having a polishing section, a cleaning section and a transferring mechanism, includes: classifying substrates, upon detection of a malfunction in any of the polishing section, the cleaning section and the transferring mechanism, according to the site of the malfunction and to the positions of the substrates in the substrate processing apparatus; and carrying out an operation for each of the substrates after the detection of the malfunction, the operation varying depending on the classification of the substrate.

摘要翻译： 一种操作基板处理装置的方法，在装置中发生非致命故障时，使得可以继续进行基板的部分装置操作以清洁和恢复基板或者容易地从装置排出基板，而不停止 整个设备，从而降低了衬底变得不可处理的风险。 操作具有研磨部，清洗部和转印机构的基板处理装置的方法包括：根据所述部位，在检测到所述研磨部，所述清洗部和所述转印机构中的任何一个的故障的情况下对基板进行分类 的故障和基板在基板处理装置中的位置; 并且在检测到故障之后对每个基板执行操作，该操作根据基板的分类而变化。

公开(公告)号：US20120193506A1

公开(公告)日：2012-08-02

申请号：US13404409

申请日：2012-02-24

申请人： Nobuyuki TAKAHASHI ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

发明人： Nobuyuki TAKAHASHI ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

IPC分类号： F16M11/20

CPC分类号： H01L21/67219 ,  B24B37/345 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/68707

摘要： The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections each for polishing a semiconductor wafer (W), and a swing transporter for transferring the wafer (W). The swing transporter includes a wafer clamp mechanism adapted to clamp the wafer (W), a vertically moving mechanism for vertically moving the wafer clamp mechanism along a frame of a casing of the polishing section, and a swing mechanism for swinging the wafer clamp mechanism about a shaft adjacent to the frame.

摘要翻译： 本发明涉及能够提高基板处理的节拍时间的基板处理装置。 作为基板处理设备的抛光装置包括用于抛光半导体晶片（W）的多个抛光部分和用于传送晶片（W）的摆动传送器。 摆动传送器包括适于夹紧晶片（W）的晶片夹持机构，用于沿着抛光部分的壳体的框架垂直移动晶片夹持机构的垂直移动机构，以及用于使晶片夹紧机构摆动的摆动机构 靠近框架的轴。

公开(公告)号：US20090067959A1

公开(公告)日：2009-03-12

申请号：US11665963

申请日：2007-02-21

申请人： Nobuyuki Takahashi ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

发明人： Nobuyuki Takahashi ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

IPC分类号： H01L21/67

CPC分类号： H01L21/67219 ,  B24B37/345 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/68707

摘要： The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections (3a, 3b) each for polishing a semiconductor wafer (W), and a swing transporter (7) for transferring the wafer (W). The swing transporter (7) includes a wafer clamp mechanism (112) adapted to clamp the wafer (W), a vertically moving mechanism (104, 106) for vertically moving the wafer clamp mechanism (112) along a frame (102) of a casing of the polishing section (3a), and a swing mechanism (108, 110) for swinging the wafer clamp mechanism (112) about a shaft adjacent to the frame (102).

摘要翻译： 本发明涉及能够提高基板处理的节拍时间的基板处理装置。 作为基板处理装置的研磨装置包括：用于研磨半导体晶片（W）的多个研磨部（3a，3b）和用于转印晶片（W）的摆动传送装置（7）。 摆动传送器（7）包括适于夹紧晶片（W）的晶片夹紧机构（112），用于沿着晶片夹持机构（102）的框架（102）垂直移动的垂直移动机构（104,106） 抛光部分（3a）的外壳和用于使晶片夹紧机构（112）围绕与框架（102）相邻的轴摆动的摆动机构（108,110）。

公开(公告)号：US20130206287A1

公开(公告)日：2013-08-15

申请号：US13816905

申请日：2011-08-15

申请人： Jun Sato ,  Shinya Imano ,  Mototsugu Osaki ,  Shigeki Ueta ,  Kiyohito Ishida ,  Toshihiro Omori ,  Hiroaki Nishida ,  Masahiro Hayashi ,  Tomoki Shiota

发明人： Jun Sato ,  Shinya Imano ,  Mototsugu Osaki ,  Shigeki Ueta ,  Kiyohito Ishida ,  Toshihiro Omori ,  Hiroaki Nishida ,  Masahiro Hayashi ,  Tomoki Shiota

IPC分类号： C22F1/10 ,  C22C30/00 ,  C22C19/05

CPC分类号： C22F1/10 ,  C22C19/055 ,  C22C19/056 ,  C22C19/057 ,  C22C30/00 ,  F01D5/28 ,  F05C2201/0463 ,  F05D2300/17 ,  Y02T50/671

摘要： A Co-based alloy containing not less than 0.001 mass % and less than 0.100 mass % of C, not less than 9.0 mass % and less than 20.0 mass % of Cr, not less than 2.0 mass % and less than 5.0 mass % of Al, not less than 13.0 mass % and less than 20.0 mass % of W, and not less than 39.0 mass % and less than 55.0 mass % of Ni, with the remainder being made up by Co and unavoidable impurities, wherein the contents of Mo, Nb, Ti and Ta which are included in the unavoidable impurities are as follows: Mo

摘要翻译： 含有不小于0.001质量％且小于0.100质量％的C，不小于9.0质量％且小于20.0质量％的Cr的Co基合金，不小于2.0质量％且小于5.0质量％的Al ，不小于13.0质量％且小于20.0质量％的W，不小于39.0质量％且小于55.0质量％的Ni，其余由Co和不可避免的杂质构成，其中Mo， 包含在不可避免的杂质中的Nb，Ti和Ta如下：Mo <0.010质量％，Nb <0.010质量％，Ti <0.010质量％，Ta <0.010质量％。