Method and apparatus for manufacturing single-crystal ingot
    8.
    发明授权
    Method and apparatus for manufacturing single-crystal ingot 有权
    制造单晶锭的方法和装置

    公开(公告)号:US06858076B1

    公开(公告)日:2005-02-22

    申请号:US09569086

    申请日:2000-05-10

    IPC分类号: C30B15/14 C30B29/06 C30B13/30

    摘要: There are provided a system for manufacturing a single-crystal ingot which is equipped with a cooler for cooling the single-crystal ingot being pulled and is capable of forming a tail without involvement of excessive heating of a crucible, as well as to a method for controlling the system. In a system for manufacturing a single-crystal ingot having a cooler for cooling a single-crystal ingot which is being pulled from molten raw material (called a single-crystal pulled ingot), when a tail of the single-crystal pulled ingot is formed, the cooler is moved away from the solid/melt interface between the single-crystal ingot and the molten raw material, to thereby reduce the power dissipated by the system. In the system, the cooler is moved upward after the end of a product area of the single-crystal ingot has been cooled until it passes through a grown-in defect temperature range.

    摘要翻译: 提供了一种用于制造单晶锭的系统,其具有用于冷却被拉动的单晶锭的冷却器,并且能够形成尾部而不涉及坩埚的过度加热,以及用于 控制系统。 在用于制造用于冷却从熔融原料(称为单晶拉锭)中拉出的单晶锭的冷却器的单晶锭的系统中,当形成单晶拉晶锭的尾部时 ,将冷却器从单晶锭和熔融原料之间的固体/熔融界面移开,从而减少系统消耗的功率。 在系统中,冷却器在单晶锭的产品区域结束已经被冷却直到其通过生长的缺陷温度范围之后向上移动。

    Method for producing silicon wafer
    10.
    发明授权
    Method for producing silicon wafer 有权
    硅晶片的制造方法

    公开(公告)号:US07329317B2

    公开(公告)日:2008-02-12

    申请号:US10533147

    申请日:2003-10-31

    CPC分类号: C30B29/06 C30B15/203

    摘要: The present invention is to produce a silicon crystal wherein the boron concentration in the silicon crystal and the growth condition V/G are controlled so that the boron concentration in the silicon crystal is no less than 1×1018 atoms/cm3 and the growth condition V/G falls within the epitaxial defect-free region α2 whose lower limit line LN1 is the line indicating that the growth rate V gradually drops as the boron concentration increases. A silicon wafer is also produced wherein the boron concentration in the silicon crystal and the growth condition V/G are controlled so as to include at least the epitaxial defect region β1, and both the heat treatment condition and the oxygen concentration of the silicon crystal are controlled so that no OSF nuclei grow to OSFs.

    摘要翻译: 本发明是为了制造硅晶体,其中硅晶体中的硼浓度和生长条件V / G被控制,使得硅晶体中的硼浓度不低于1×10 18原子/ cm 3,并且生长条件V / G落在外延缺陷区域α2N中,其下限线LN 1是表示生长速率V逐渐下降的线 随着硼浓度的增加。 还生产硅晶片,其中硅晶体中的硼浓度和生长条件V / G被控制为至少包括外延缺陷区β1,并且热处理条件和 控制硅晶体的氧浓度使得OSF核不生长到OSF。