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公开(公告)号：US07312528B2
公开(公告)日：2007-12-25
申请号：US10778234
申请日：2004-02-17
IPC分类号： H01L23/48 , H01L23/52 , H01L23/522
CPC分类号： H01L23/5227 , H01L24/05 , H01L2224/02166 , H01L2224/04042 , H01L2224/05554 , H01L2224/0603 , H01L2224/4813 , H01L2224/4847 , H01L2924/00
摘要： A semiconductor device includes first and second antenna connection electrodes placed on the periphery of a semiconductor chip, an on-chip antenna connection electrode placed in the inner area of the semiconductor chip compared to the first and second antenna connection electrodes, and an internal circuit formed in the semiconductor chip. The first and second antenna connection electrodes are connected to the internal circuit by internal lines. The on-chip antenna connection electrode is connected to the internal circuit and the second antenna connection electrode by internal lines. An on-chip antenna is connected to the second antenna connection electrode and the on-chip antenna connection electrode. An external antenna is connected to the first and second antenna connection electrodes.
摘要翻译： 半导体器件包括放置在半导体芯片周围的第一和第二天线连接电极，与第一和第二天线连接电极相比放置在半导体芯片的内部区域中的片上天线连接电极和形成的内部电路 在半导体芯片中。 第一和第二天线连接电极通过内部线路连接到内部电路。 片上天线连接电极通过内部线路连接到内部电路和第二天线连接电极。 片上天线连接到第二天线连接电极和片上天线连接电极。 外部天线连接到第一和第二天线连接电极。
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公开(公告)号：US07327266B2
公开(公告)日：2008-02-05
申请号：US10518299
申请日：2003-06-17
申请人： Hiroto Watanabe , Kazuhiko Daido
发明人： Hiroto Watanabe , Kazuhiko Daido
IPC分类号： G08B13/14
CPC分类号： G06K19/07728 , G06K19/07749
摘要： A contactless communication system information carrier which is high in handleability and yield but low in cost is provided. It includes a core piece 11 in which an IC chip 1 with an antenna coil 3 integrally formed on one surface is fitted inside a recess 6 of a core piece body 5, a non-metal spacer 14 in which the core piece 11 is fitted to a fitting part 16 located in a center of the spacer 14 to retain the core piece 11, and a metal weight 15 placed and coupled so as to surround an outer periphery of the spacer 14. The antenna coil 3 and the metal weight 14 are separated from each other via the spacer 14.
摘要翻译： 提供了可处理性和产量高但成本低的非接触通信系统信息载体。 它包括芯片11，其中具有一体地形成在一个表面上的天线线圈3的IC芯片1装配在芯片体5的凹部6中，非金属间隔件14，其中芯片11被安装到 位于隔离物14的中心以保持芯片11的配合部分16以及围绕隔离物14的外周放置和联接的金属重物15。 天线线圈3和金属重物14经由间隔件14彼此分离。
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公开(公告)号：US20060016895A1
公开(公告)日：2006-01-26
申请号：US10518299
申请日：2003-06-17
申请人： Hiroto Watanabe , Kazuhiko Daido
发明人： Hiroto Watanabe , Kazuhiko Daido
IPC分类号： G06K19/06
CPC分类号： G06K19/07728 , G06K19/07749
摘要： A contactless communication system information carrier which is high in handleability and yield but low in cost is provided. It includes a core piece 11 in which an IC chip 1 with an antenna coil 3 integrally formed on one surface is fitted inside a recess 6 of a core piece body 5, a non-metal spacer 14 in which the core piece 11 is fitted to a fitting part 16 located in a center of the spacer 14 to retain the core piece 11, and a metal weight 15 placed and coupled so as to surround an outer periphery of the spacer 14. The antenna coil 3 and the metal weight 14 are separated from each other via the spacer 14.
摘要翻译： 提供了可处理性和产量高但成本低的非接触通信系统信息载体。 它包括芯片11，其中具有一体地形成在一个表面上的天线线圈3的IC芯片1装配在芯片体5的凹部6中，非金属间隔件14，其中芯片11被安装到 位于间隔件14的中心以保持芯片11的配合部分16以及围绕隔离物14的外周放置并联接的金属重物15.天线线圈3和金属重物14分离 通过间隔件14彼此连接。
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公开(公告)号：US07334734B2
公开(公告)日：2008-02-26
申请号：US09769293
申请日：2001-01-26
申请人： Yoshiharu Hino , Kazuhiko Daido
发明人： Yoshiharu Hino , Kazuhiko Daido
IPC分类号： G06K19/06
CPC分类号： H01Q1/2225 , H01Q1/22 , H01Q7/00
摘要： An accessed object having a non-contact IC module including a semiconductor device and a module-side antenna formed extending over two sides of an accessed object, wherein the module-side antenna consists of a first module-side antenna and a second module-side antenna continuous to the first module-side antenna, wherein the first module-side antenna secures a necessary antenna effective area by coming into face-to-face relation with a first apparatus-side antenna on communication apparatus to communicate with the accessed object, and wherein the second module-side antenna is disposed close to the second apparatus-side antenna in an access direction different from the direction in which the first apparatus-side antenna makes access to the accessed object.
摘要翻译： 具有非接触IC模块的被访问对象包括半导体器件和形成在被访问对象的两侧上的模块侧天线，其中模块侧天线由第一模块侧天线和第二模块侧 天线连接到第一模块侧天线，其中第一模块侧天线通过与通信装置上的第一装置侧天线面对面地关系来确保必要的天线有效区域，以与所访问的对象进行通信，以及 其中所述第二模块侧天线在与所述第一装置侧天线访问所访问对象的方向不同的访问方向上设置为靠近所述第二装置侧天线。
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公开(公告)号：US20080117118A1
公开(公告)日：2008-05-22
申请号：US12013339
申请日：2008-01-11
申请人： Yoshiharu HINO , Kazuhiko Daido
发明人： Yoshiharu HINO , Kazuhiko Daido
IPC分类号： H01Q7/00
CPC分类号： H01Q1/2225 , H01Q1/22 , H01Q7/00
摘要： An accessed object having a non-contact IC module including a semiconductor device and a module-side antenna formed extending over two sides of an accessed object, wherein the module-side antenna consists of a first module-side antenna and a second module-side antenna continuous to the first module-side antenna, wherein the first module-side antenna secures a necessary antenna effective area by coming into face-to-face relation with a first apparatus-side antenna on communication apparatus to communicate with the accessed object, and wherein the second module-side antenna is disposed close to the second apparatus-side antenna in an access direction different from the direction in which the first apparatus-side antenna makes access to the accessed object.
摘要翻译： 具有非接触IC模块的被访问对象包括半导体器件和形成在被访问对象的两侧上的模块侧天线，其中模块侧天线由第一模块侧天线和第二模块侧 天线连接到第一模块侧天线，其中第一模块侧天线通过与通信装置上的第一装置侧天线面对面地关系来确保必要的天线有效区域，以与所访问的对象进行通信，以及 其中所述第二模块侧天线在与所述第一装置侧天线访问所访问对象的方向不同的访问方向上设置为靠近所述第二装置侧天线。
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公开(公告)号：US07748638B2
公开(公告)日：2010-07-06
申请号：US12013339
申请日：2008-01-11
申请人： Yoshiharu Hino , Kazuhiko Daido
发明人： Yoshiharu Hino , Kazuhiko Daido
IPC分类号： G06K19/06
CPC分类号： H01Q1/2225 , H01Q1/22 , H01Q7/00
摘要： An accessed object having a non-contact IC module including a semiconductor device and a module-side antenna formed extending over two sides of an accessed object, wherein the module-side antenna consists of a first module-side antenna and a second module-side antenna continuous to the first module-side antenna, wherein the first module-side antenna secures a necessary antenna effective area by coming into face-to-face relation with a first apparatus-side antenna on communication apparatus to communicate with the accessed object, and wherein the second module-side antenna is disposed close to the second apparatus-side antenna in an access direction different from the direction in which the first apparatus-side antenna makes access to the accessed object.
摘要翻译： 具有非接触IC模块的被访问对象包括半导体器件和形成在被访问对象的两侧上的模块侧天线，其中模块侧天线由第一模块侧天线和第二模块侧 天线连接到第一模块侧天线，其中第一模块侧天线通过与通信装置上的第一装置侧天线面对面地关系来确保必要的天线有效区域，以与所访问的对象进行通信，以及 其中所述第二模块侧天线在与所述第一装置侧天线访问所访问对象的方向不同的访问方向上设置为靠近所述第二装置侧天线。
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公开(公告)号：US06926794B2
公开(公告)日：2005-08-09
申请号：US10270001
申请日：2002-10-15
IPC分类号： G06K19/02 , G06K19/077 , G06K19/06
CPC分类号： G06K19/02 , G06K19/07749 , H01L2224/16 , H01L2924/00014 , Y10T428/21 , Y10T428/216 , Y10T428/22 , Y10T428/23 , Y10T428/237 , Y10T428/239 , Y10T428/24331 , Y10T428/24868 , H01L2224/0401
摘要： The present invention provides an information carrier which has flat surfaces, is excellent in beautiful appearance and permits beautiful necessary printing, and a production process which permits easy and inexpensive production of such an information carrier. An IC chip 1 and a coil 2 connected to the IC chip are embedded in a substrate 3 composed of a nonwoven fabric. The IC chip and the coil are held between two nonwoven fabrics produced according to a conventional production procedure. The laminate of the nonwoven fabrics is fed to a roller or a press and the two nonwoven fabrics are hot-pressed, whereby their mating surfaces are joined with or without an adhesive (including low-melting synthetic resin fiber) incorporated into the webs. After positioning of the coil in the thus obtained raw product of information carrier, the laminate of the nonwoven fabrics and cover sheets is cut to obtain an information carrier of predetermined shape and size.
摘要翻译： 本发明提供一种信息载体，其具有平坦的表面，外观美观并且允许美丽的必要打印，以及允许这种信息载体容易且便宜地生产的制造方法。 连接到IC芯片的IC芯片1和线圈2嵌入由无纺布构成的基板3中。 IC芯片和线圈保持在根据常规生产程序制造的两个无纺布之间。 将无纺布的层叠体供给到辊或压机中，并且对两个无纺布进行热压，由此其配合表面与或不与粘合剂（包括低熔点合成树脂纤维）结合到纤维网中来连接。 将线圈定位在如此得到的信息载体的原料中之后，切断无纺布和覆盖片的层压体，得到规定形状和尺寸的信息载体。
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公开(公告)号：US07133703B2
公开(公告)日：2006-11-07
申请号：US10802751
申请日：2004-03-18
申请人： Yoshinori Aoshima , Kazuhiko Daido
发明人： Yoshinori Aoshima , Kazuhiko Daido
CPC分类号： G01R31/3651 , G01R31/3655 , G01R31/3689 , H04M1/0262
摘要： A small electronic device has a battery level detection unit for real-time detection of the current battery level and a communication unit for transmitting report data on a detected battery level to another small electronic device, such as a pocket PC device. The receiving small electronic device compares the data with data on its own battery level detected therein and displays the lower battery level data.
摘要翻译： 小型电子设备具有用于实时检测当前电池电量的电池电平检测单元和用于将检测到的电池电平的报告数据传送到诸如袖珍PC设备的另一小型电子设备的通信单元。 接收小型电子设备将数据与其中检测到的自身电池电平的数据进行比较，并显示较低的电池电量数据。
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公开(公告)号：US06482495B1
公开(公告)日：2002-11-19
申请号：US08814921
申请日：1997-03-12
IPC分类号： G06K1906
CPC分类号： G06K19/02 , G06K19/07749 , H01L2224/16 , H01L2924/00014 , Y10T428/21 , Y10T428/216 , Y10T428/22 , Y10T428/23 , Y10T428/237 , Y10T428/239 , Y10T428/24331 , Y10T428/24868 , H01L2224/0401
摘要： The present invention provides an information carrier which has flat surfaces, is excellent in beautiful appearance and permits beautiful necessary printing, and a production process which permits easy and inexpensive production of such an information carrier. An IC chip 1 and a coil 2 connected to the IC chip are embedded in a substrate 3 composed of a nonwoven fabric. The IC chip and the coil are held between two nonwoven fabrics produced according to a conventional production procedure. The laminate of the nonwoven fabrics is fed to a roller or a press and the two nonwoven fabrics are hot-pressed, whereby their mating surfaces are joined with or without an adhesive (including low-melting synthetic resin fiber) incorporated into the webs. After positioning of the coil in the thus obtained raw product of information carrier, the laminate of the nonwoven fabrics and cover sheets is cut to obtain an information carrier of predetermined shape and size.
摘要翻译： 本发明提供一种信息载体，其具有平坦的表面，外观美观并且允许美丽的必要打印，以及允许这种信息载体容易且便宜地生产的制造方法。 连接到IC芯片的IC芯片1和线圈2嵌入由无纺布构成的基板3中。 IC芯片和线圈保持在根据常规生产程序制造的两个无纺布之间。 将无纺布的层叠体供给到辊或压机中，并且对两个无纺布进行热压，由此其配合表面与或不与粘合剂（包括低熔点合成树脂纤维）结合到纤维网中来连接。 将线圈定位在如此得到的信息载体的原料中之后，切断无纺布和覆盖片的层压体，得到规定形状和尺寸的信息载体。
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10.发明授权Flexible IC module and method of its manufacture, and method of manufacturing information carrier comprising flexible IC module 失效柔性IC模块及其制造方法，以及包括柔性IC模块的信息载体的制造方法公开(公告)号：US06412701B1
公开(公告)日：2002-07-02
申请号：US09214436
申请日：1999-01-05
申请人： Kyouichi Kohama , Yusuke Hirai , Kaname Tamada , Toshinobu Sueyoshi , Ryuzo Fukao , Kazuhiko Daido
发明人： Kyouichi Kohama , Yusuke Hirai , Kaname Tamada , Toshinobu Sueyoshi , Ryuzo Fukao , Kazuhiko Daido
IPC分类号： G06K1902
CPC分类号： G06K19/07703 , G06K19/027 , G06K19/07718 , G06K19/07728 , G06K19/07745 , G06K19/07749 , H01L2224/05553 , H01L2224/4554 , H01L2224/4813 , H01L2924/01013 , H05K1/0366 , H05K1/189
摘要： There is a flexible IC module utilizable for the production of contactless IC cards and a method for producing an information carrier using the flexible IC module. An IC chip 1 and a coil 2 are embedded in a flexible substrate 3 comprising a nonwoven fabric or the like having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property. This flexible IC module is produced in the following procedure. {circle around (1)} A first nonwoven fabric 12 having compressibility in the thickness direction, self-pressure bonding property and resin impregnation property is placed on a bottom force 11. {circle around (2)} An IC chip and a coil are placed on the first nonwoven fabric after positioning them. {circle around (3)} A second nonwoven fabric 13 is superposed on the IC chip and coil. {circle around (4)} A top force 14 is pressed onto the second nonwoven fabric, and the first and second nonwoven fabrics, the IC chip and the coil are integrated by hot pressing.
摘要翻译： 存在可用于生产非接触式IC卡的灵活的IC模块以及使用该柔性IC模块生产信息载体的方法。 IC芯片1和线圈2嵌入在包括在厚度方向上具有可压缩性，自压接性和树脂浸渍性的无纺布等的柔性基板3中。 该柔性IC模块按以下步骤生产。 {圆周（1）}在厚度方向上具有可压缩性的第一无纺布12，自压接合性和树脂浸渍性被置于底部力11. {圆周（2）} IC芯片和线圈是 放置在第一无纺布上。 {圆周（3）}将第二无纺布13重叠在IC芯片和线圈上。 {圆周（4）}将顶部力14压在第二无纺布上，通过热压将第一和第二无纺布，IC芯片和线圈集成。
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