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1.发明授权公开(公告)号：US07226976B2
公开(公告)日：2007-06-05
申请号：US11110731
申请日：2005-04-21
CPC分类号： C08G59/686 , C08G59/18 , C08L63/00 , C08L2666/02
摘要： Provided are a latent curing agent that gives an epoxy resin composition with improved storage stability and low-temperature curability; and a curable epoxy resin composition prepared by mixing the said curing agent and an epoxy compound. The epoxy resin composition has improved storage stability, and cures at lower temperatures for a shorter period of time than conventional ones. The latent curing agent for epoxy resin comprises two components, (A) a radically polymerized polymer of a monomer having at least a polymerizable double bond, which has at least a tertiary amino group in the molecule, and (B) a polymer having at least a hydroxyl group in the molecule, and forms a solid solution that is solid at 25° C.
摘要翻译： 提供一种提供具有改善的储存稳定性和低温固化性的环氧树脂组合物的潜在性固化剂; 和通过混合所述固化剂和环氧化合物制备的可固化环氧树脂组合物。 环氧树脂组合物具有改善的储存稳定性，并且在较低温度下固化较常规的时间短。 用于环氧树脂的潜在性固化剂包含两种组分，（A）至少具有可聚合双键的单体的自由基聚合聚合物，其在分子中至少具有叔氨基，和（B）至少具有至少 分子中的羟基，并形成在25℃下为固体的固溶体。
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2.发明申请公开(公告)号：US20050187371A1
公开(公告)日：2005-08-25
申请号：US11110731
申请日：2005-04-21
CPC分类号： C08G59/686 , C08G59/18 , C08L63/00 , C08L2666/02
摘要： Provided are a latent curing agent that gives an epoxy resin composition with improved storage stability and low-temperature curability; and a curable epoxy resin composition prepared by mixing the said curing agent and an epoxy compound. The epoxy resin composition has improved storage stability, and cures at lower temperatures for a shorter period of time than conventional ones. The latent curing agent for epoxy resin comprises two components, (A) a radically polymerized polymer of a monomer having at least a polymerizable double bond, which has at least a tertiary amino group in the molecule, and (B) a polymer having at least a hydroxyl group in the molecule, and forms a solid solution that is solid at 25° C.
摘要翻译： 提供一种提供具有改善的储存稳定性和低温固化性的环氧树脂组合物的潜在性固化剂; 和通过混合所述固化剂和环氧化合物制备的可固化环氧树脂组合物。 环氧树脂组合物具有改善的储存稳定性，并且在较低温度下固化较常规的时间短。 用于环氧树脂的潜在性固化剂包含两种组分，（A）至少具有可聚合双键的单体的自由基聚合聚合物，其在分子中至少具有叔氨基，和（B）至少具有至少 分子中的羟基，并形成在25℃下为固体的固溶体。
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公开(公告)号：US5506321A
公开(公告)日：1996-04-09
申请号：US143058
申请日：1993-10-29
申请人： Hiroyasu Koto , Kiyonori Furuta , Eiko Nakao , Shigeo Nakamura
发明人： Hiroyasu Koto , Kiyonori Furuta , Eiko Nakao , Shigeo Nakamura
IPC分类号： C08F2/48 , C08G59/20 , C08G59/40 , C09D11/033 , C09D11/10 , C09D11/101 , C09D11/102 , C09D11/106 , C09D11/107 , C09D11/108 , G03F7/027 , G03F7/038 , H05K3/28 , C08F224/00 , C08F220/10
摘要： A photosensitive resin composition or photosensitive heat-curing resin composition comprising a photocurable oligomer containing 2 or more polymerizable double bonds and a carboxyl group and a heat-curing component selected from a compound containing one polymerizable double bond and one epoxy group, a compound containing one or more polymerizable double bonds and one or more blocked isocyanate groups; a photosensitive resin composition comprising a photocurable oligomer containing a carboxyl group, a blocked isocyanate group and 2 or more polymerizable double bonds; and a novel compound containing one or more polymerizable double bonds and one or more blocked isocyanate groups are disclosed. The resin compositions have high photosensitivity, excellent developability and provide a solder resist pattern with excellent properties.
摘要翻译： 一种感光性树脂组合物或感光性热固化性树脂组合物，其含有含有2个以上的可聚合双键和羧基的光固化性低聚物和选自含有一个可聚合双键和一个环氧基的化合物的热固化组分，含有一个 或更多的可聚合双键和一个或多个封端的异氰酸酯基团; 包含含有羧基，封端异氰酸酯基和2个以上可聚合双键的光固化低聚物的感光性树脂组合物; 并且公开了含有一个或多个可聚合双键和一个或多个封端异氰酸酯基团的新型化合物。 树脂组合物具有高的光敏性，优异的显影性，并提供具有优异性能的阻焊图案。
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公开(公告)号：US20070021582A1
公开(公告)日：2007-01-25
申请号：US11491118
申请日：2006-07-24
申请人： Hiroshi Amano , Osamu Yamabe , Hiroyasu Koto
发明人： Hiroshi Amano , Osamu Yamabe , Hiroyasu Koto
CPC分类号： C08G59/686 , C08G59/18 , C08G59/66
摘要： The present application relates to a one-component epoxy resin composition that contains an epoxy resin containing: (1) an epoxy resin having 2 or more epoxy groups in the molecule, (2) a polythiol compound having 2 or more thiol groups in the molecule, (3) a compound that releases a basic component under a curing temperature condition and dissolves in constituent (2), and (4) a compound having Lewis acidity. The present invention also relates to a method of producing the same.
摘要翻译： 本申请涉及含有环氧树脂的单组分环氧树脂组合物，其包含：（1）分子中具有2个以上环氧基的环氧树脂，（2）分子中具有2个以上硫醇基的多硫醇化合物 ，（3）在固化温度条件下释放碱性成分并溶解于成分（2）中的化合物，（4）具有路易斯酸性的化合物。 本发明还涉及其制备方法。
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公开(公告)号：US5723262A
公开(公告)日：1998-03-03
申请号：US680551
申请日：1996-07-09
IPC分类号： C08F2/50 , C08F8/00 , C08G18/54 , C08G18/62 , C08G18/81 , C08G59/20 , C08G59/62 , C08L61/04 , C08L61/16 , C08L63/00 , G03F7/023 , G03F7/027 , G03F7/028 , G03F7/032 , G03F7/038 , H05K3/06 , H05K3/28
CPC分类号： G03F7/0388 , C08F8/00 , C08G18/542 , C08G18/62 , C08G18/8108 , C08G18/8116 , C08G18/8158 , C08G18/8175 , G03F7/032 , G03F7/038
摘要： An alkali soluble resin and a resin composition thereof useful as a solder resist, having good adhesive properties, solder heat resistance, and plating resistance are provided. Particular resistance to plating under alkaline conditions is provided by the invention.
摘要翻译： 提供了可用作阻焊剂的碱溶性树脂和其树脂组合物，具有良好的粘合性，焊料耐热性和耐电镀性。 在碱性条件下对电镀的耐受性由本发明提供。
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公开(公告)号：US07479534B2
公开(公告)日：2009-01-20
申请号：US11491118
申请日：2006-07-24
申请人： Hiroshi Amano , Osamu Yamabe , Hiroyasu Koto
发明人： Hiroshi Amano , Osamu Yamabe , Hiroyasu Koto
IPC分类号： C08G59/66
CPC分类号： C08G59/686 , C08G59/18 , C08G59/66
摘要： The present application relates to a one-component epoxy resin composition that contains an epoxy resin containing: (1) an epoxy resin having 2 or more epoxy groups in the molecule, (2) a polythiol compound having 2 or more thiol groups in the molecule, (3) a compound that releases a basic component under a curing temperature condition and dissolves in constituent (2), and (4) a compound having Lewis acidity. The present invention also relates to a method of producing the same.
摘要翻译： 本申请涉及含有环氧树脂的单组分环氧树脂组合物，其包含：（1）分子中具有2个以上环氧基的环氧树脂，（2）分子中具有2个以上硫醇基的多硫醇化合物 ，（3）在固化温度条件下释放碱性成分并溶解于成分（2）中的化合物，（4）具有路易斯酸性的化合物。 本发明还涉及其制备方法。
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公开(公告)号：US06545166B2
公开(公告)日：2003-04-08
申请号：US10179951
申请日：2002-06-26
申请人： Masao Honma , Atsushi Mashita , Hiroyasu Koto
发明人： Masao Honma , Atsushi Mashita , Hiroyasu Koto
IPC分类号： C07D31906
CPC分类号： C07D493/10
摘要： In this application is disclosed a process for producing 3,9-bis(2-chloroethyl)-2,4,8,10-tetraoxaspiro[5.5]undecane comprising a step of reacting acrolein, pentaerythritol, and hydrogen chloride at one step, according to which the compound can be obtained conveniently in high yields.
摘要翻译： 在本申请中公开了一种制备3,9-双（2-氯乙基）-2,4,8,10-四氧杂螺[5.5]十一烷的方法，其包括在一个步骤中使丙烯醛，季戊四醇和氯化氢反应的步骤，根据 可以方便地以高收率获得化合物。
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