Apparatus for forming pattern onto article during injection molding
    1.
    发明授权
    Apparatus for forming pattern onto article during injection molding 有权
    用于在注射成型期间将图案形成到制品上的装置

    公开(公告)号:US06416306B2

    公开(公告)日:2002-07-09

    申请号:US09865568

    申请日:2001-05-29

    IPC分类号: B29C4514

    摘要: In the method, after the pattern-bearing film is fed to the female mold, the distal end of the film is fixed under a lower portion of the female mold, and at the same time the film is retreated by a force from the film supply portion. Thus, this tightens up the film so that the slacks or wrinkles cannot be formed on the film. Therefore, the film can be fortunately spread around the parting surface of the female mold. In the apparatus, the film suppressing frame is pressed to the female mold through the sliding rod arranged in the female mold, in such a manner that the female mold embraces the frame. Thus, the pressing of the frame is performed by a simple structure, and the film is accurately positioned to the internal surface of the female mold Also, the film suppressing frame is constituted to advance from and retreat to the female mold. Thus, this causes a space between the both molds and an outside standby position to be useless. A space around the apparatus can be effectively utilized.

    摘要翻译: 在该方法中,在将图案承载膜供给到阴模之后,将膜的前端固定在阴模的下部,同时通过来自胶片供给的力使膜退回 一部分。 因此,这会使胶片收紧,使得在胶片上不能形成松弛或皱纹。 因此,这款电影可以幸福地散布在阴模的分型面上。 在该装置中,通过设置在阴模中的滑动杆将膜抑制框架按压到阴模,使得阴模包围框架。 因此,通过简单的结构进行框架的按压,并且将膜精确地定位到阴模的内表面。另外,膜抑制框架构成为前进和后退到阴模。 因此,这将导致两个模具和外部备用位置之间的空间是无用的。 可以有效地利用装置周围的空间。

    Method for forming a pattern onto an article during injection molding
    3.
    发明授权
    Method for forming a pattern onto an article during injection molding 失效
    在注射成型期间在图案上形成图案的方法

    公开(公告)号:US5925302A

    公开(公告)日:1999-07-20

    申请号:US429218

    申请日:1995-04-25

    摘要: In the method, after the pattern-bearing film is fed to the female mold, the distal end of the film is fixed under a lower portion of the female mold, and at the same time the film is retreated by a force from the film supply portion. Thus, this tightens up the film so that the slacks or wrinkles cannot be formed on the film. Therefore, the film can be fortunately spread around the parting surface of the female mold. In the apparatus, the film suppressing frame is pressed to the female mold through the sliding rod arranged in the female mold, in such a manner that the female mold embraces the frame. Thus, the pressing of the frame is performed by a simple structure, and the film is accurately positioned to the internal surface of the female mold. Also, the film suppressing frame is constituted to advance from and retreat to the female mold. Thus, this causes a space between the both molds and an outside standby position to be useless. A space around the apparatus can be effectively utilized.

    摘要翻译: 在该方法中,在将图案承载膜供给到阴模之后,将膜的前端固定在阴模的下部,同时通过来自胶片供给的力使膜退回 一部分。 因此,这会使胶片收紧,使得在胶片上不能形成松弛或皱纹。 因此,这款电影可以幸福地散布在阴模的分型面上。 在该装置中,通过设置在阴模中的滑动杆将膜抑制框架按压到阴模,使得阴模包围框架。 因此,通过简单的结构进行框架的按压,并且将膜准确地定位到阴模的内表面。 此外,胶片抑制框架被构造成从阴模前进和退回。 因此,这将导致两个模具和外部备用位置之间的空间是无用的。 可以有效地利用装置周围的空间。

    Pattern-bearing sheet for use in simultaneous injection-molding and
pattern-forming method
    4.
    发明授权
    Pattern-bearing sheet for use in simultaneous injection-molding and pattern-forming method 失效
    用于同时注射成型和图案形成方法的图案轴承片

    公开(公告)号:US5843555A

    公开(公告)日:1998-12-01

    申请号:US361307

    申请日:1994-12-20

    IPC分类号: B29C45/14 B32B5/00

    摘要: A pattern-bearing sheet for a simultaneous injection-molding and pattern-forming method, has a sufficient malleability in the following conditions. When the sheet is cut to a 10-mm width and subjected to a tensile load and thus elongated at a rate of 30%/second in an environment at 50.degree. C., the sheet should exhibit a stress value of 0.6 kg or higher at the yield point and after passing through the yield point in the case where the sheet is formed from a material having a yield point, and the sheet should exhibit a stress value of 0.6 kg or higher at an elongation of 10% and higher in the case where the sheet is formed from a material not having a yield point. Desirably, the value when the sheet cut to 10-mm width is elongated at a rate of 7%/second to an elongation of 200% (200% modulus value) at a temperature of 100.degree. C. to 120.degree. C. should be 0.3 kg or lower.

    摘要翻译: 用于同时注射成型和图案形成方法的图案承载片在以下条件下具有足够的延展性。 当在50℃的环境中将片材切割成10mm宽度并承受拉伸载荷并因此以30%/秒的速率拉长时,片材应该在0.6kg或更高的应力值下显示出0.6kg或更高的应力值 屈服点并且在由具有屈服点的材料形成片材的情况下通过屈服点之后,并且在该伸长率为10%以上的情况下该片材应该显示出0.6kg以上的应力值 其中片材由不具有屈服点的材料形成。 理想的是,在100℃至120℃的温度下,将切割成10mm宽度的片材以7%/秒的速率伸长到200%(200%模量值)的伸长率应该是 0.3公斤以下。

    Process for effecting injection-molded-in decoration
    7.
    发明授权
    Process for effecting injection-molded-in decoration 失效
    注塑成型工艺

    公开(公告)号:US6071456A

    公开(公告)日:2000-06-06

    申请号:US617888

    申请日:1996-05-15

    摘要: A decoration sheet is retained on the cavity periphery by a sheet clamp in such a state that it is projected into a molding cavity of a female die. Then the decoration sheet is heated and softened by a curved hot platen, and thereafter it is drawn through suction ports of the female die to bring the sheet into close fit to the inner periphery of the molding cavity. The deformation amount of the decoration sheet heated and softened is decreased in premolding the sheet into the molding cavity surface of the female die. Therefore, distortion of the decoration sheet, appearance of wrinkles, and breakage thereof become little. Next, the female die and the male die are coupled with each other to effect die clamping, and a molten resin is poured to fill the molding cavity to effect injection molding.

    摘要翻译: PCT No.PCT / JP95 / 01509 Sec。 371日期:1996年5月15日 102(e)日期1996年5月15日PCT提交1995年7月28日PCT公布。 公开号WO96 / 03268 日期1996年2月8日装饰片通过片夹在空腔周边保持,使其突出到阴模的模腔中。 然后通过弯曲的热压板加热和软化装饰片,然后通过阴模的吸入口拉动装饰片,使片材紧密地配合到模腔的内周。 加热软化的装饰片的变形量在将片材预成型为阴模的模腔表面时减少。 因此,装饰片的变形,皱纹的外观和破损变小。 接下来,阴模和阳模相互耦合以实现模夹紧,并且注入熔融树脂以填充模腔以实现注塑。

    Apparatus for forming pattern onto article during injection molding
    8.
    发明授权
    Apparatus for forming pattern onto article during injection molding 有权
    用于在注射成型期间将图案形成在制品上的装置

    公开(公告)号:US06413069B2

    公开(公告)日:2002-07-02

    申请号:US09865583

    申请日:2001-05-29

    IPC分类号: B29C4514

    摘要: In the method, after the pattern-bearing film is fed to the female mold, the distal end of the film is fixed under a lower portion of the female mold, and at the same time the film is retreated by a force from the film supply portion. Thus, this tightens up the film so that the slacks or wrinkles cannot be formed on the film. Therefore, the film can be fortunately spread around the parting surface of the female mold. In the apparatus, the film suppressing frame is pressed to the female mold through the sliding rod arranged in the female mold, in such a manner that the female mold embraces the frame. Thus, the pressing of the frame is performed by a simple structure, and the film is accurately positioned to the internal surface of the female mold. Also, the film suppressing frame is constituted to advance from and retreat to the female mold. Thus, this causes a space between the both molds and an outside standby position to be useless. A space around the apparatus can be effectively utilized.

    摘要翻译: 在该方法中,在将图案承载膜供给到阴模之后,将膜的前端固定在阴模的下部,同时通过来自胶片供给的力使膜退回 一部分。 因此,这会使胶片收紧,使得在胶片上不能形成松弛或皱纹。 因此,这款电影可以幸福地散布在阴模的分型面上。 在该装置中,通过设置在阴模中的滑动杆将膜抑制框架按压到阴模,使得阴模包围框架。 因此,通过简单的结构进行框架的按压,并且将膜准确地定位到阴模的内表面。 此外,胶片抑制框架被构造成从阴模前进和退回。 因此,这将导致两个模具和外部备用位置之间的空间是无用的。 可以有效地利用装置周围的空间。

    Process for preparing conductive material
    9.
    发明授权
    Process for preparing conductive material 有权
    制备导电材料的方法

    公开(公告)号:US08012676B2

    公开(公告)日:2011-09-06

    申请号:US12305929

    申请日:2007-06-22

    摘要: It is to provide a process for preparing a conductive material in which transparency and conductivity are both high, and storage stability is high, and further, in a process for preparing a conductive material utilizing ultra fine silver particles, to provide a process for preparing a conductive material having high conductivity without requiring a calcination step which has conventionally been required.A process for preparing a conductive material having a conductive pattern containing silver on a support, which process for preparing a conductive material comprises acting at least one of the following mentioned (I) to (IV) on the pattern portion containing silver provided on the support:(I) a reducing substance,(II) a water-soluble phosphorus oxo acid compound,(III) a water-soluble halogen compound,(IV) warm water of 55° C. or higher.

    摘要翻译: 本发明提供一种制备透明性和导电性均高,储存稳定性高的导电材料的方法,此外,在制备使用超细银粒子的导电材料的方法中,提供制备 具有高导电性的导电材料,而不需要通常需要的煅烧步骤。 一种用于制备具有在载体上含有银的导电图案的导电材料的方法,该制备导电材料的方法包括在设置在载体上的含有银的图案部分上起到以下提及的(I)至(IV)中的至少一种作用 :(I)还原物质,(II)水溶性磷含氧化合物,(III)水溶性卤素化合物,(IV)55℃以上的温水。

    Electromagnetic wave shield material and process for producing the same
    10.
    发明授权
    Electromagnetic wave shield material and process for producing the same 有权
    电磁波屏蔽材料及其制造方法

    公开(公告)号:US07749620B2

    公开(公告)日:2010-07-06

    申请号:US10520927

    申请日:2003-07-11

    IPC分类号: B32B5/16

    摘要: The present invention is to provide an electromagnetic wave shielding material which comprises a transparent substrate and a fine line pattern formed thereon, wherein the fine line pattern comprises a metal plating film using a physically developed metal silver as a catalytic nucleus and a process for preparing an electromagnetic wave shielding material which comprises exposing a light-sensitive material having a physical development nuclei layer and a silver halide emulsion layer on a transparent substrate in this order, precipitating metal silver with an optional fine line pattern onto the physical development nuclei layer by physical development, then, removing a layer provided on the physical development nuclei layer, and subjecting to plating a metal with the use of the physically developed metal silver as a catalytic nucleus.

    摘要翻译: 本发明提供一种电磁波屏蔽材料,其包括透明基板和形成在其上的细线图案,其中细线图案包括使用物理显影的金属银作为催化核的金属镀膜,以及制备 电磁波屏蔽材料,其包括在透明基板上依次将具有物理显影核层和卤化银乳剂层的感光材料依次曝光,通过物理显影将金属银以任选的细线图案沉淀到物理显影核层上 然后,移除在物理显影核层上提供的层,并且使用物理显影的金属银作为催化核进行镀覆金属。