公开(公告)号：US20110048676A1

公开(公告)日：2011-03-03

申请号：US12852556

申请日：2010-08-09

申请人： Hiroyuki TOYODA ,  Tadakatsu NAKAJIMA ,  Yoshihiro KONDO ,  Shigeyuki SASAKI ,  Akio IDEI ,  Shigemasa SATOH

发明人： Hiroyuki TOYODA ,  Tadakatsu NAKAJIMA ,  Yoshihiro KONDO ,  Shigeyuki SASAKI ,  Akio IDEI ,  Shigemasa SATOH

IPC分类号： F28D15/02

CPC分类号： F28D15/0266 ,  F28D1/05366 ,  F28D15/046 ,  F28F1/325 ,  F28F13/187 ,  F28F2215/12 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling system applying a thermo siphon therein, being superior in energy saving and/or ecology, with an effective cooling, and also an electronic apparatus applying that therein, in particular, for cooling a CPU 200 mounted on a printed circuit board 100 within a housing thereof, comprises a heat-receiving jacket 310, being thermally connected with a surface of the CPU generating heats therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof, a condenser 320 for receiving refrigerant vapor from the heat-receiving jacket within a pressure-reduced inner space thereof and for condensing the refrigerant vapor into a liquid by transferring the heats into an outside of the apparatus, a vapor tube 331, and a liquid return tube 332, with applying the thermo siphon for circulating the refrigerant due to phase change thereof, wherein the condenser forms fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.

摘要翻译： 一种在其中施加热虹吸的冷却系统，具有优异的节能和/或生态学，有效的冷却，以及在其中应用的电子设备，特别是用于冷却安装在印刷电路板100内的CPU 200 其壳体包括与在其中产生加热的CPU的表面热连接的热接收套310，并且用于通过发热而蒸发存储在减压内部空间中的液体制冷剂;冷凝器320，用于从 在其减压的内部空间内的热接收套管，并且通过将热量传递到设备的外部，蒸气管331和液体返回管332将制冷剂蒸汽冷凝成液体，同时施加热虹吸 用于使制冷剂由于其相变而循环，其中，冷凝器在其内壁表面上沿着r的流动方向形成细槽 制冷剂，并且也在其横截面上形成为平坦的，用于有效地从其受热套管的内壁表面冷却制冷剂蒸汽。

公开(公告)号：US20100124012A1

公开(公告)日：2010-05-20

申请号：US12620742

申请日：2009-11-18

申请人： Yoshihiro KONDO ,  Tadakatsu NAKAJIMA ,  Akio IDEI ,  Shigeyasu TSUBAKI ,  Hiroyuki TOYODA ,  Tomoo HAYASHI

发明人： Yoshihiro KONDO ,  Tadakatsu NAKAJIMA ,  Akio IDEI ,  Shigeyasu TSUBAKI ,  Hiroyuki TOYODA ,  Tomoo HAYASHI

IPC分类号： G06F1/20

CPC分类号： G06F1/20 ,  H05K7/20818

摘要： A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink. The second heat transmission member is disposed in the fan module unit, and a heat radiation member provided for the pipes forms an airflow passage together with the motherboard.

摘要翻译： 一种具有冷却能力的服务器系统，其可以应对可拆卸地安装在刀片服务器上的服务器模块的CPU产生的热量的增加。 服务器模块包括容纳其中安装有CPU，存储器等的母板的壳体和用于冷却由CPU产生的热的沸腾冷却装置的一部分。 容纳在风扇模块中的风扇适于通过服务器模块外壳的开口将空气吹入服务器模块。 沸腾冷却装置包括设置在服务器模块外壳中的第一传热构件，设置在服务器模块外壳外部的第二传热构件和连接它们的多个管道。 第一传热构件是具有用于气密地密封制冷剂的内部空间的盒体，其一个外部平面被热连接到CPU，而另一个外部平面设置有散热器。 第二传热构件设置在风扇模块单元中，并且用于管道的散热构件与主板一起形成气流通道。

公开(公告)号：US20110189602A1

公开(公告)日：2011-08-04

申请号：US13018877

申请日：2011-02-01

申请人： Masahide TADOKORO ,  Yoshihiro KONDO ,  Takashi SAITO

发明人： Masahide TADOKORO ,  Yoshihiro KONDO ,  Takashi SAITO

IPC分类号： G03F7/20 ,  H05B3/20 ,  B05C21/00

CPC分类号： B05C21/00 ,  G03F7/20 ,  H05B3/20

摘要： The disclosed heating device is to perform a heating process on an exposed substrate formed with a resist film before a developing process, the device including a heating part to perform a heating process on the exposed substrate, the heating part including a plurality of two-dimensionally arranged heating elements; a seating part provided at an upper side of the heating part, on which the substrate is disposed; and a control part to correct a setting temperature of the heating part based on temperature correction values, and to control the heating part based on the corrected setting temperature, during the heating process on one substrate by the heating part, wherein the temperature correction values being previously obtained from measured critical dimensions of the resist pattern in another substrate formed with the resist pattern through the heating process by the heating part and then the developing process.

摘要翻译： 所公开的加热装置是在显影处理之前对形成有抗蚀剂膜的暴露的基板进行加热处理，该装置包括加热部分，以对暴露的基板进行加热处理，加热部分包括多个二维 布置加热元件; 设置在所述加热部的上侧的座部，所述基板设置在所述加热部的上侧; 以及控制部，其基于温度校正值校正加热部的设定温度，并且在由加热部在一个基板上的加热处理期间，基于校正的设定温度来控制加热部，其中，温度校正值为 先前由通过加热部分的加热处理形成的抗蚀剂图案的另一个衬底中的抗蚀剂图案的测量的临界尺寸获得，然后通过显影过程获得。

公开(公告)号：US20080186671A1

公开(公告)日：2008-08-07

申请号：US12021319

申请日：2008-01-29

申请人： Yoshihiro KONDO ,  Kenji Ogiro

发明人： Yoshihiro KONDO ,  Kenji Ogiro

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  H05K7/20809

摘要： In the electronic device such as computer and server which is operated in full day time and having high load condition in a limited time schedule, a suitable cooling device is provided for the heat generating elements which consists of the electronic device. The cooling device also has an feature to avoid the enlargement of the cooling device and have high power efficiency. The heat generated in the heat generating element is both transferred to a heat sink and a heat accumulator. The heat accumulator is also connected to the heat sink. The heat generating element and the heat accumulator is thermally connected by a heat pipe. And the heat accumulator and the heat sink is also thermally connected by another heat pipe.

摘要翻译： 在日常时间运行并且在有限的时间表中具有高负载条件的电脑和服务器等电子设备中，为由电子设备构成的发热元件提供合适的冷却装置。 冷却装置还具有避免冷却装置放大并且具有高功率效率的特征。 在发热元件中产生的热量都被传送到散热器和蓄热器。 蓄热器也连接到散热器。 发热元件和蓄热器通过热管进行热连接。 并且蓄热器和散热器也通过另一个热管热连接。

公开(公告)号：US20130098597A1

公开(公告)日：2013-04-25

申请号：US13589549

申请日：2012-08-20

申请人： Takayuki FUJIMOTO ,  Yoshihiro KONDO

发明人： Takayuki FUJIMOTO ,  Yoshihiro KONDO

IPC分类号： G05D23/00

CPC分类号： H05K7/20745 ,  F24F11/0008 ,  F24F11/30 ,  F24F2011/0006 ,  F24F2110/20 ,  H05K7/20836 ,  Y02B30/542

摘要： From a plurality of preset operation modes, an optimal mode is selected to let the supply air 206 attain a predetermined temperature and humidity. Upon adjusting the opening degrees of dampers 116-119, a cold water valve 156 and a humidifying water valve 154, the system measures the outside air 201, supply air 206 and return air 207 for temperature and humidity to see if a mode boundary is exceeded. If the boundary is exceeded, an assessment time is set. The humidity of the supply air 206 in the mode in effect before the boundary is exceeded is further predicted so as to determine whether the predicted value exceeds the upper limit of a tolerable humidity range or drops below the lower limit thereof.

摘要翻译： 从多个预设操作模式中，选择最佳模式以使供应空气206达到预定的温度和湿度。 在调节阻尼器116-119的开度，冷水阀156和加湿水阀154时，该系统测量外部空气201，供应空气206和回流空气207以获得温度和湿度，以查看是否超过模式边界 。 如果超出边界，则设置评估时间。 进一步预测在超过边界之前有效的模式中的供给空气206的湿度，以便确定预测值是否超过容许湿度范围的上限或低于其下限。