公开(公告)号：US4916397A

公开(公告)日：1990-04-10

申请号：US227833

申请日：1988-08-03

申请人： Hisao Masuda ,  Syuichi Osaka

发明人： Hisao Masuda ,  Syuichi Osaka

IPC分类号： H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/485 ,  H01L23/532

CPC分类号： H01L24/05 ,  H01L23/53223 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05166 ,  H01L2224/05187 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2224/48624 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941

摘要： A semiconductor device having a bonding pad for connecting lead wires comprises a semiconductor substrate, a metal silicide film, a silicon dioxide film, a metal nitride film and an aluminum film. The silicon dioxide film has an opening in a portion corresponding to the bonding pad. The metal silicide film is formed in the portion corresponding to the bonding pad on the semiconductor substrate. The metal nitride film is formed on the metal silicide film and adhered to the metal silicide film. The aluminum film is provided as a bonding pad and formed on the metal nitride film.In a method for manufacturing the above described semiconductor device, the metal silicide film is formed on the semiconductor substrate and patterned. The silicon dioxide film is formed thereon. The opening is formed in the position corresponding to the bonding pad on the silicon dioxide film. The metal nitride film is formed in the opening. The aluminum film is formed on the metal nitride film.

摘要翻译： 具有用于连接引线的接合焊盘的半导体器件包括半导体衬底，金属硅化物膜，二氧化硅膜，金属氮化物膜和铝膜。 二氧化硅膜在与焊盘对应的部分具有开口。 金属硅化物膜形成在对应于半导体衬底上的焊盘的部分中。 在金属硅化物膜上形成金属氮化物膜并粘附到金属硅化物膜上。 铝膜设置为焊盘并形成在金属氮化物膜上。 在制造上述半导体器件的方法中，在半导体衬底上形成金属硅化物膜并进行图案化。 在其上形成二氧化硅膜。 开口形成在与二氧化硅膜上的接合焊盘相对应的位置。 金属氮化物膜形成在开口中。 铝膜形成在金属氮化物膜上。

公开(公告)号：US4878610A

公开(公告)日：1989-11-07

申请号：US307512

申请日：1989-02-08

申请人： Ryuichiro Mori ,  Syuichi Osaka ,  Toshinobu Banjo

发明人： Ryuichiro Mori ,  Syuichi Osaka ,  Toshinobu Banjo

IPC分类号： H01L21/52 ,  H01L21/00

CPC分类号： H01L21/67144

摘要： A die bonding apparatus includes a stocker for temporarily accommodating dice, a first conveying device for successively picking up a plurality of dice from one wafer and conveying them to the stocker, a wafer loader/unloader for replacing the wafer from which the dice have been picked up with a new one, a bonding station for bonding a die to a work which serves as a die mounting medium, a work loader for supplying works to the bonding station, and a second conveying device for successively conveying the dice accommodated in the stocker to the bonding station.

摘要翻译： 芯片接合装置包括用于临时容纳骰子的储料器，用于从一个晶片连续地拾取多个骰子并将其传送到储料器的第一输送装置，用于替换骰子已被拣选的晶片的晶片装载/卸载器 用于将模具粘合到用作模具安装介质的工件上的粘结站，用于向粘合站供应工件的工作装载器和用于将容纳在储料器中的骰子依次传送到第二输送装置的第二输送装置 粘接站。