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10 条记录 (耗时 0.023 秒)

    Die bonding apparatus
    1.
    发明授权
    Die bonding apparatus 失效
    焊接装置

    公开(公告)号：US4878610A

    公开(公告)日：1989-11-07

    申请号：US307512

    申请日：1989-02-08

    申请人： Ryuichiro Mori ,  Syuichi Osaka ,  Toshinobu Banjo

    发明人： Ryuichiro Mori ,  Syuichi Osaka ,  Toshinobu Banjo

    IPC分类号： H01L21/52 ,  H01L21/00

    CPC分类号： H01L21/67144

    摘要： A die bonding apparatus includes a stocker for temporarily accommodating dice, a first conveying device for successively picking up a plurality of dice from one wafer and conveying them to the stocker, a wafer loader/unloader for replacing the wafer from which the dice have been picked up with a new one, a bonding station for bonding a die to a work which serves as a die mounting medium, a work loader for supplying works to the bonding station, and a second conveying device for successively conveying the dice accommodated in the stocker to the bonding station.

    摘要翻译： 芯片接合装置包括用于临时容纳骰子的储料器，用于从一个晶片连续地拾取多个骰子并将其传送到储料器的第一输送装置，用于替换骰子已被拣选的晶片的晶片装载/卸载器 用于将模具粘合到用作模具安装介质的工件上的粘结站，用于向粘合站供应工件的工作装载器和用于将容纳在储料器中的骰子依次传送到第二输送装置的第二输送装置 粘接站。

    Computer controlled automated semiconductor production apparatus
    6.
    发明授权
    Computer controlled automated semiconductor production apparatus 失效
    电脑控制自动半导体生产设备

    公开(公告)号：US5042123A

    公开(公告)日：1991-08-27

    申请号：US302316

    申请日：1989-01-26

    申请人： Ryuichiro Mori

    发明人： Ryuichiro Mori

    IPC分类号： H01L21/52 ,  H01L21/00 ,  H01L21/50 ,  H01L21/66

    CPC分类号： H01L21/67276 ,  H01L22/20 ,  H01L2924/0002 ,  Y10T29/41

    摘要： An apparatus for producing semiconductor devices includes: a wafer splitting device for splitting a semiconductor wafer into individual dice; an automatic warehouse for lead frames for storing a plurality of kinds of lead frame; an assembly device for assembling a die and a lead frame into a semiconductor device; an automatic die/lead frame transport device for transporting the dice split by the splitting device and lead frames stored in the automatic warehouse to the assembly device; and a computer for controlling the automatic die/lead frame transport device to transport the lead frames of the type and quantity corresponding to the dice split by the splitting device, from the automatic warehouse to the assembly devices. The computer compares the number of non-defective dice with a predetermined production quantity and ensures that a sufficient quantity of non-defective dice to satisfy the production quantity are split and transported to the assembly device. This apparatus is suitable for producing a large variety of semiconductor devices in small lots on an automated continuous basis.

    摘要翻译： 一种用于制造半导体器件的设备包括：用于将半导体晶片分成单个裸片的晶片分离器; 用于存储多种引线框的引线框的自动仓库; 用于将管芯和引线框架组装到半导体器件中的组装装置; 自动模具/引线框架输送装置，用于将由分割装置分割的骰子和存储在自动仓库中的引导框架传送到组装装置; 以及计算机，用于控制自动模具/引线框架传送装置，以将与分离装置分开的骰子相对应的类型和数量的引导框架从自动仓库传送到装配装置。 计算机将无缺陷骰子的数量与预定的生产量进行比较，并且确保足够数量的用于满足生产量的无缺陷骰子被分割并传送到装配装置。 该设备适用于以自动连续的方式在小批量生产各种各样的半导体器件。

    Semiconductor module comprising semiconductor packages
    7.
    发明授权
    Semiconductor module comprising semiconductor packages 失效
    半导体模块包括半导体封装

    公开(公告)号：US5903049A

    公开(公告)日：1999-05-11

    申请号：US73836

    申请日：1998-05-06

    申请人： Ryuichiro Mori

    发明人： Ryuichiro Mori

    IPC分类号： H01L25/18 ,  H01L23/31 ,  H01L25/065 ,  H01L25/07 ,  H01L25/10 ,  H01L25/11 ,  H01L23/02

    CPC分类号： H01L23/3107 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1094 ,  H01L2924/19107

    摘要： Each of two semiconductor elements 1a or 1b is connected to wiring patterns 3a or 3b on an element substrate 2a or 2b via a bump 4a or 4b, respectively. These members are sealed off by sealing resin to form a semiconductor package 6a or 6b, and the same are disposed on a mounting substrate 8 one above the other with an adhesive agent 9 applied thereto. A portion of the wiring pattern 3a not covered by the sealing resin 5, which portion is connected to the semiconductor element 1a, a portion of the wiring pattern 3b connected to the semiconductor element 1b, and an electrode on the mounting substrate 8 are electrically interconnected by connecting wires 7.

    摘要翻译： 两个半导体元件1a或1b中的每一个分别经由凸块4a或4b连接到元件基板2a或2b上的布线图案3a或3b。 这些构件通过密封树脂被密封以形成半导体封装6a或6b，并且将它们一并一个地放置在安装基板8上，并施加有粘合剂9。 未被密封树脂​​5覆盖的布线图案3a的一部分连接到半导体元件1a，连接到半导体元件1b的布线图案3b的一部分和安装基板8上的电极被电互连 通过连接电线7。

    Plastic-packaged semiconductor device including a plurality of chips
    9.
    发明授权
    Plastic-packaged semiconductor device including a plurality of chips 失效
    包括多个芯片的塑料封装半导体器件

    公开(公告)号：US06369447B2

    公开(公告)日：2002-04-09

    申请号：US09172086

    申请日：1998-10-14

    申请人： Ryuichiro Mori

    发明人： Ryuichiro Mori

    IPC分类号： H01L2352

    CPC分类号： H01L24/06 ,  H01L23/49575 ,  H01L23/528 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00012

    摘要： There are described an improvement in the mass-productivity of a plastic-packaged semiconductor device which includes a plurality of chips that are connected to leads and assembled into one package while their main surfaces are positioned so as to oppose one another and which enables selection of one of the chips with a fewer number of leads. The semiconductor device includes a pair of identical chips including a plurality of electrode pads provided in a row in the center of the main surface of the chip, and the electrode pads provided in the corresponding positions form a pair of electrode pads. The plurality of electrode pads which permit input or output of a common signal in or from the chips are connected to the respective sides of the common lead by way of a pair of electrode bumps. Two pairs of electrode pads which permit input or output of individual signals to the respective chips and which are provided side by side to each other are electrically connected to respective sides of the common lead by way of an electrode bump formed on one of the pair of electrode pads as well as by way of another adjacent electrode bump formed on the electrode pad of the other pair of electrode pads.

    摘要翻译： 描述了塑料封装半导体器件的批量生产率的改进，其包括连接到引线并组装成一个封装的多个芯片，同时它们的主表面被定位成彼此相对，并且能够选择 其中一个芯片的数量较少。 半导体器件包括一对相同的芯片，其包括设置在芯片的主表面的中心的一行中的多个电极焊盘，并且设置在相应位置的电极焊盘形成一对电极焊盘。 允许在芯片中输入或输出公共信号的多个电极焊盘通过一对电极凸块连接到公共引线的相应侧。 允许将各个信号输入或输出到各个芯片并且彼此并排设置的两对电极焊盘通过形成在所述一对中的一个上的电极凸块电连接到公共引线的相应侧 电极焊盘以及通过在另一对电极焊盘的电极焊盘上形成的另一个相邻的电极焊盘。

    Method of making resin molded semiconductor device
    10.
    发明授权
    Method of making resin molded semiconductor device 失效
    制造树脂模制半导体器件的方法

    公开(公告)号：US5139969A

    公开(公告)日：1992-08-18

    申请号：US725895

    申请日：1991-07-01

    申请人： Ryuichiro Mori

    发明人： Ryuichiro Mori

    IPC分类号： H01L21/56

    CPC分类号： H01L21/565 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265

    摘要： A resin molded semiconductor device includes external electrodes provided on and connected to the electrodes of a semiconductor element. The semiconductor device is produced by coating the electrodes of the semiconductor element with a coating resin encapsulating the semiconductor element in a sealing resin in a mold and then dissolving the coating resin. Then, a metal is disposed in the holes formed in the sealing resin to provide external electrodes. Since the external electrodes are provided on the electrodes of the semiconductor element, the packaging area has the same dimensions as the resin package, and the packaging area of the semiconductor device can be reduced.

    摘要翻译： 树脂模制半导体器件包括设置在半导体元件的电极上并连接到半导体元件的电极的外部电极。 半导体器件通过将包封半导体元件的涂覆树脂涂覆在模具中的密封树脂中，然后溶解涂覆树脂来制造半导体元件的电极。 然后，在密封树脂中形成的孔中设置金属以提供外部电极。 由于外部电极设置在半导体元件的电极上，因此封装区域具有与树脂封装相同的尺寸，并且可以减小半导体器件的封装面积。